ATE93075T1 - Verfahren zum montieren eines elektronischen bausteins und diesen verwendende speicherkarte. - Google Patents

Verfahren zum montieren eines elektronischen bausteins und diesen verwendende speicherkarte.

Info

Publication number
ATE93075T1
ATE93075T1 AT89202342T AT89202342T ATE93075T1 AT E93075 T1 ATE93075 T1 AT E93075T1 AT 89202342 T AT89202342 T AT 89202342T AT 89202342 T AT89202342 T AT 89202342T AT E93075 T1 ATE93075 T1 AT E93075T1
Authority
AT
Austria
Prior art keywords
layer
assembling
hole
electronic component
memory card
Prior art date
Application number
AT89202342T
Other languages
English (en)
Inventor
Jan Paul Bouquet
Original Assignee
Alcatel Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Nv filed Critical Alcatel Nv
Application granted granted Critical
Publication of ATE93075T1 publication Critical patent/ATE93075T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Holo Graphy (AREA)
  • Electrically Operated Instructional Devices (AREA)
AT89202342T 1988-09-27 1989-09-16 Verfahren zum montieren eines elektronischen bausteins und diesen verwendende speicherkarte. ATE93075T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE8801103A BE1002529A6 (nl) 1988-09-27 1988-09-27 Methode om een elektronische component te monteren en geheugen kaart waarin deze wordt toegepast.
EP89202342A EP0367311B1 (de) 1988-09-27 1989-09-16 Verfahren zum Montieren eines elektronischen Bausteins und diesen verwendende Speicherkarte

Publications (1)

Publication Number Publication Date
ATE93075T1 true ATE93075T1 (de) 1993-08-15

Family

ID=3883649

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89202342T ATE93075T1 (de) 1988-09-27 1989-09-16 Verfahren zum montieren eines elektronischen bausteins und diesen verwendende speicherkarte.

Country Status (7)

Country Link
US (1) US5042145A (de)
EP (1) EP0367311B1 (de)
AT (1) ATE93075T1 (de)
AU (2) AU617867B2 (de)
BE (1) BE1002529A6 (de)
DE (1) DE68908341T2 (de)
ES (1) ES2044061T3 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5203078A (en) * 1985-07-17 1993-04-20 Ibiden Co., Ltd. Printed wiring board for IC cards
US5274570A (en) * 1989-05-22 1993-12-28 Mazda Motor Corporation Integrated circuit having metal substrate
EP0597055B1 (de) * 1992-05-25 1997-12-17 Gay Frères Vente et Exportation SA Elektronisches Etikett
DE4424396C2 (de) * 1994-07-11 1996-12-12 Ibm Trägerelement zum Einbau in Chipkarten oder anderen Datenträgerkarten
FR2731132B1 (fr) * 1995-02-24 1997-04-04 Solaic Sa Procede pour implanter un element electronique, notamment un microcircuit, dans un corps de carte electronique, et corps de carte electronique comportant un element electronique ainsi implante
SE9701612D0 (sv) * 1997-04-29 1997-04-29 Johan Asplund Smartcard and method for its manufacture
US6531997B1 (en) 1999-04-30 2003-03-11 E Ink Corporation Methods for addressing electrophoretic displays
WO2001063991A1 (en) * 2000-02-25 2001-08-30 Ibiden Co., Ltd. Multilayer printed wiring board and method for producing multilayer printed wiring board
CN1901177B (zh) 2000-09-25 2010-05-12 揖斐电株式会社 半导体元件及其制造方法、多层印刷布线板及其制造方法
WO2003096595A2 (en) * 2002-05-08 2003-11-20 Drexler Technology Corporation Method of making secure personal data card
FI20030293A7 (fi) * 2003-02-26 2004-08-27 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
FI119583B (fi) * 2003-02-26 2008-12-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
FI20031341L (fi) 2003-09-18 2005-03-19 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
FI117814B (fi) * 2004-06-15 2007-02-28 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
WO2006134220A1 (en) * 2005-06-16 2006-12-21 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
FI122128B (fi) * 2005-06-16 2011-08-31 Imbera Electronics Oy Menetelmä piirilevyrakenteen valmistamiseksi
FI119714B (fi) 2005-06-16 2009-02-13 Imbera Electronics Oy Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi
FI20060256A7 (fi) * 2006-03-17 2006-03-20 Imbera Electronics Oy Piirilevyn valmistaminen ja komponentin sisältävä piirilevy
US7836588B2 (en) * 2006-07-06 2010-11-23 Ideon Llc Method for fabricating an electronic device
GB0705287D0 (en) * 2007-03-20 2007-04-25 Conductive Inkjet Tech Ltd Electrical connection of components

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1339660A (en) * 1971-11-20 1973-12-05 Ferranti Ltd Supports for semiconductor devices
JPS5231673A (en) * 1975-09-04 1977-03-10 Sharp Corp Resin sealing method of semiconductor device
JPS53149763A (en) * 1977-06-01 1978-12-27 Citizen Watch Co Ltd Mounting method of semiconductor integrate circuit
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
FR2584236B1 (fr) * 1985-06-26 1988-04-29 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
FR2601477B1 (fr) * 1986-07-11 1988-10-21 Bull Cp8 Procede de montage d'un circuit integre dans une carte a microcircuits electroniques, et carte en resultant
FR2625067A1 (fr) * 1987-12-22 1989-06-23 Sgs Thomson Microelectronics Procede pour fixer sur un support un composant electronique et ses contacts
FR2631200B1 (fr) * 1988-05-09 1991-02-08 Bull Cp8 Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit

Also Published As

Publication number Publication date
DE68908341T2 (de) 1994-01-13
DE68908341D1 (de) 1993-09-16
AU8353191A (en) 1991-11-07
ES2044061T3 (es) 1994-01-01
BE1002529A6 (nl) 1991-03-12
EP0367311A1 (de) 1990-05-09
AU617867B2 (en) 1991-12-05
EP0367311B1 (de) 1993-08-11
AU646284B2 (en) 1994-02-17
AU4142789A (en) 1990-04-05
US5042145A (en) 1991-08-27

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee