ATE68908T1 - Anisotrop elektrisch leitfaehiger gegenstand. - Google Patents

Anisotrop elektrisch leitfaehiger gegenstand.

Info

Publication number
ATE68908T1
ATE68908T1 AT86305991T AT86305991T ATE68908T1 AT E68908 T1 ATE68908 T1 AT E68908T1 AT 86305991 T AT86305991 T AT 86305991T AT 86305991 T AT86305991 T AT 86305991T AT E68908 T1 ATE68908 T1 AT E68908T1
Authority
AT
Austria
Prior art keywords
pores
metal
plated
fill
flash
Prior art date
Application number
AT86305991T
Other languages
English (en)
Inventor
Leo Gulvad Svendsen
Nigel Robert Bates
Original Assignee
Raychem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB858519620A external-priority patent/GB8519620D0/en
Priority claimed from GB868615425A external-priority patent/GB8615425D0/en
Application filed by Raychem Ltd filed Critical Raychem Ltd
Application granted granted Critical
Publication of ATE68908T1 publication Critical patent/ATE68908T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
  • Luminescent Compositions (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Laminated Bodies (AREA)
AT86305991T 1985-08-05 1986-08-04 Anisotrop elektrisch leitfaehiger gegenstand. ATE68908T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB858519620A GB8519620D0 (en) 1985-08-05 1985-08-05 Electrically conductive article
GB868615425A GB8615425D0 (en) 1986-06-24 1986-06-24 Conductive article
EP86305991A EP0213774B1 (de) 1985-08-05 1986-08-04 Anisotrop elektrisch leitfähiger Gegenstand

Publications (1)

Publication Number Publication Date
ATE68908T1 true ATE68908T1 (de) 1991-11-15

Family

ID=26289615

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86305991T ATE68908T1 (de) 1985-08-05 1986-08-04 Anisotrop elektrisch leitfaehiger gegenstand.

Country Status (5)

Country Link
EP (1) EP0213774B1 (de)
JP (1) JPH07105167B2 (de)
AT (1) ATE68908T1 (de)
CA (1) CA1284523C (de)
DE (1) DE3682150D1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
JP2758053B2 (ja) * 1988-02-05 1998-05-25 レイケム・リミテッド 単一軸状電気伝導部品の使用
KR900701043A (ko) * 1988-02-05 1990-08-17 원본미기재 단축 전기전도성 물품
US5631447A (en) * 1988-02-05 1997-05-20 Raychem Limited Uses of uniaxially electrically conductive articles
JP2664091B2 (ja) * 1988-02-05 1997-10-15 レイケム・リミテッド 積層ポリマーシート
KR900701040A (ko) * 1988-02-05 1990-08-17 원본미기재 레이저 가공용 중합체
EP0436652A1 (de) * 1988-09-30 1991-07-17 Raychem Limited Verbindungsartikel für hybrid-mikrochip
US4954878A (en) * 1989-06-29 1990-09-04 Digital Equipment Corp. Method of packaging and powering integrated circuit chips and the chip assembly formed thereby
CA2017743C (en) * 1989-06-30 1996-02-06 William C. Hu Ultra-tall indium or alloy bump array for ir detector hybrids and micro-electronics
KR910013440A (ko) * 1989-12-19 1991-08-08 가마이 고로 이방성 도전막 및 그 제조공정
US5245751A (en) 1990-04-27 1993-09-21 Circuit Components, Incorporated Array connector
JPH07105174B2 (ja) * 1990-08-30 1995-11-13 信越ポリマー株式会社 異方導電膜の製造方法
EP0560072A3 (de) * 1992-03-13 1993-10-06 Nitto Denko Corporation Anisotropisch-elektroleitende Klebe-Schicht und diese verwendende Verbindungsstruktur
DE59503218D1 (de) * 1994-02-07 1998-09-24 Siemens Ag Verfahren zur Herstellung einer kubisch integrierten Schaltungsanordnung
US5498467A (en) * 1994-07-26 1996-03-12 W. L. Gore & Associates, Inc. Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom
FR2726397B1 (fr) * 1994-10-28 1996-11-22 Commissariat Energie Atomique Film conducteur anisotrope pour la microconnectique
US5731073A (en) * 1996-10-01 1998-03-24 W. L. Gore & Associates, Inc. Reusable, selectively conductive, Z-axis, elastomeric composite substrate
WO1998020715A1 (en) * 1996-11-08 1998-05-14 W.L. Gore & Associates, Inc. Interconnected multi-layer circuit boards
US5910354A (en) * 1997-03-04 1999-06-08 W.L. Gore & Associates, Inc. Metallurgical interconnect composite
DE19832970A1 (de) * 1998-07-22 1999-11-04 Siemens Ag Integrierte elektronische Schaltung und Verfahren zum Versehen einer integrierten elektronischen Schaltung mit Anschlüssen
DE10015964C2 (de) * 2000-03-30 2002-06-13 Infineon Technologies Ag Lotband für flexible und temperaturfeste Lotverbindungen
DE10015962C2 (de) * 2000-03-30 2002-04-04 Infineon Technologies Ag Hochtemperaturfeste Lotverbindung für Halbleiterbauelement
US7345350B2 (en) * 2003-09-23 2008-03-18 Micron Technology, Inc. Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias
DE102005022490A1 (de) * 2005-05-11 2006-11-16 Infineon Technologies Ag Verfahren zum Herstellen eines mit Kontaktelementen versehenen Montagebandes
DE102017122865B3 (de) * 2017-10-02 2019-03-14 Infineon Technologies Ag Verfahren zum Bilden einer metallischen Zwischenverbindung, Verfahren zum Herstellen einer Halbleiteranordnung mit einer metallischen Zwischenverbindung und Halbleitervorrichtungsanordnung mit einer metallischen Zwischenverbindung
DE102018103505A1 (de) 2018-02-16 2019-08-22 Osram Opto Semiconductors Gmbh Komposithalbleiterbauelement und Verfahren zur Herstellung eines Komposithalbleiterbauelements

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5265892A (en) * 1975-11-26 1977-05-31 Shinetsu Polymer Co Nonnisotropic conductiveesheet type composite materials and method of manufacture thereof
JPS5818238A (ja) * 1981-07-27 1983-02-02 Alps Electric Co Ltd 異方導電性エラストマ−シ−トの製造方法
US4504783A (en) * 1982-09-30 1985-03-12 Storage Technology Partners Test fixture for providing electrical access to each I/O pin of a VLSI chip having a large number of I/O pins
AU572615B2 (en) * 1983-12-27 1988-05-12 Sony Corporation Electrically conductive adhesive sheet circuit board and electrical connection structure
DD221903A1 (de) * 1984-01-25 1985-05-02 Univ Dresden Tech Verfahren zur herstellung von leitenden verbindungen

Also Published As

Publication number Publication date
CA1284523C (en) 1991-05-28
JPS6243008A (ja) 1987-02-25
EP0213774A1 (de) 1987-03-11
DE3682150D1 (de) 1991-11-28
EP0213774B1 (de) 1991-10-23
JPH07105167B2 (ja) 1995-11-13

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Legal Events

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