ATE63656T1 - Zusammengesetzte leiterplatte mit metallmusterlagen und verfahren zur herstellung. - Google Patents

Zusammengesetzte leiterplatte mit metallmusterlagen und verfahren zur herstellung.

Info

Publication number
ATE63656T1
ATE63656T1 AT84104174T AT84104174T ATE63656T1 AT E63656 T1 ATE63656 T1 AT E63656T1 AT 84104174 T AT84104174 T AT 84104174T AT 84104174 T AT84104174 T AT 84104174T AT E63656 T1 ATE63656 T1 AT E63656T1
Authority
AT
Austria
Prior art keywords
making
circuit board
metal pattern
pattern layers
composite circuit
Prior art date
Application number
AT84104174T
Other languages
English (en)
Inventor
Merwin F Hoover
Ann B Salamone
Jan Vandebult
Original Assignee
Polyonics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyonics Corp filed Critical Polyonics Corp
Application granted granted Critical
Publication of ATE63656T1 publication Critical patent/ATE63656T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AT84104174T 1983-04-15 1984-04-13 Zusammengesetzte leiterplatte mit metallmusterlagen und verfahren zur herstellung. ATE63656T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/485,328 US4555414A (en) 1983-04-15 1983-04-15 Process for producing composite product having patterned metal layer
EP84104174A EP0122619B1 (de) 1983-04-15 1984-04-13 Zusammengesetzte Leiterplatte mit Metallmusterlagen und Verfahren zur Herstellung

Publications (1)

Publication Number Publication Date
ATE63656T1 true ATE63656T1 (de) 1991-06-15

Family

ID=23927733

Family Applications (1)

Application Number Title Priority Date Filing Date
AT84104174T ATE63656T1 (de) 1983-04-15 1984-04-13 Zusammengesetzte leiterplatte mit metallmusterlagen und verfahren zur herstellung.

Country Status (6)

Country Link
US (1) US4555414A (de)
EP (1) EP0122619B1 (de)
JP (1) JPS59207234A (de)
AT (1) ATE63656T1 (de)
CA (1) CA1216680A (de)
DE (1) DE3484570D1 (de)

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US4921777A (en) * 1987-08-03 1990-05-01 Allied-Signal Inc. Method for manufacture of multilayer printed circuit boards
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US4968553A (en) * 1988-09-16 1990-11-06 Claudio Cesar Graphic architectural glass
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US5104689A (en) * 1990-09-24 1992-04-14 International Business Machines Corporation Method and apparatus for automated solder deposition at multiple sites
US5266386A (en) * 1991-02-14 1993-11-30 Beckett Industries Inc. Demetallizing procedure
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US5573004A (en) * 1994-10-06 1996-11-12 Edentec Corporation Electrically stable electrode and sensor apparatus
US5656081A (en) * 1995-06-07 1997-08-12 Img Group Limited Press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid
US5622652A (en) * 1995-06-07 1997-04-22 Img Group Limited Electrically-conductive liquid for directly printing an electrical circuit component onto a substrate, and a method for making such a liquid
WO1997014157A1 (en) * 1995-10-07 1997-04-17 Img Group Limited An electrical circuit component formed of a conductive liquid printed directly onto a substrate
US5789020A (en) * 1996-03-11 1998-08-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method of forming a hot film sensor system on a model
US6355198B1 (en) 1996-03-15 2002-03-12 President And Fellows Of Harvard College Method of forming articles including waveguides via capillary micromolding and microtransfer molding
AU723909B2 (en) * 1996-03-15 2000-09-07 President And Fellows Of Harvard College Method of forming articles and patterning surfaces via capillary micromolding
US6060121A (en) * 1996-03-15 2000-05-09 President And Fellows Of Harvard College Microcontact printing of catalytic colloids
US6232144B1 (en) * 1997-06-30 2001-05-15 Littelfuse, Inc. Nickel barrier end termination and method
DE19812880A1 (de) 1998-03-24 1999-09-30 Bayer Ag Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung
US6194127B1 (en) 1998-05-27 2001-02-27 Mcdonnell Douglas Corporation Resistive sheet patterning process and product thereof
US7198747B2 (en) 2000-09-18 2007-04-03 President And Fellows Of Harvard College Fabrication of ceramic microstructures
AU2002365994A1 (en) * 2001-11-20 2003-06-10 Bridgestone Corporation Electromagnetic wave shielded light-transmissive material and manufacturing method thereof
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US7576968B2 (en) * 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US7463474B2 (en) * 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US6900126B2 (en) 2002-11-20 2005-05-31 International Business Machines Corporation Method of forming metallized pattern
TW200413598A (en) * 2003-01-30 2004-08-01 Formosa Taffeta Co Ltd Method for producing synthetic fibrous fabric with semi-transparent printed (dyed) pattern and its fabric production
US7764173B2 (en) * 2003-02-14 2010-07-27 Honda Motor Co., Ltd. IC tag equipped vehicle and management system thereof
JP4554195B2 (ja) * 2003-12-24 2010-09-29 本田技研工業株式会社 車両管理システム
JP4184256B2 (ja) * 2003-12-25 2008-11-19 本田技研工業株式会社 商品管理システム
JP2005242659A (ja) * 2004-02-26 2005-09-08 Honda Motor Co Ltd タグ取付方法及びタグ付金属部品
US8405561B2 (en) 2007-02-01 2013-03-26 Si2 Technologies, Inc. Arbitrarily-shaped multifunctional structures and method of making
CN104475758B (zh) * 2009-09-16 2018-01-05 日立化成株式会社 液状组合物
US9435035B2 (en) 2010-01-15 2016-09-06 Byd Company Limited Metalized plastic articles and methods thereof
CN102071424B (zh) * 2010-02-26 2012-05-09 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
CN102071411B (zh) 2010-08-19 2012-05-30 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
US9052587B2 (en) * 2011-10-03 2015-06-09 Hitachi Chemical Company, Ltd. Conductive pattern formation method, conductive pattern-bearing substrate, and touch panel sensor
JP5460897B1 (ja) * 2013-01-17 2014-04-02 株式会社テムテック研究所 平面発熱体の電極を製造する方法
US9668301B2 (en) * 2015-07-03 2017-05-30 Ndt Engineering & Aerospace Co., Ltd. Wet-use plane heater using PTC constant heater-ink polymer
US11015255B2 (en) * 2018-11-27 2021-05-25 Macdermid Enthone Inc. Selective plating of three dimensional surfaces to produce decorative and functional effects

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Also Published As

Publication number Publication date
EP0122619A2 (de) 1984-10-24
DE3484570D1 (de) 1991-06-20
JPS59207234A (ja) 1984-11-24
EP0122619A3 (en) 1985-07-10
US4555414A (en) 1985-11-26
CA1216680A (en) 1987-01-13
EP0122619B1 (de) 1991-05-15

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties