ATE544725T1 - Verfahren zum herstellen eines mikrosensors - Google Patents
Verfahren zum herstellen eines mikrosensorsInfo
- Publication number
- ATE544725T1 ATE544725T1 AT06075521T AT06075521T ATE544725T1 AT E544725 T1 ATE544725 T1 AT E544725T1 AT 06075521 T AT06075521 T AT 06075521T AT 06075521 T AT06075521 T AT 06075521T AT E544725 T1 ATE544725 T1 AT E544725T1
- Authority
- AT
- Austria
- Prior art keywords
- capacitive plates
- accelerometer
- inertial mass
- fixed
- movable
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00047—Cavities
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0323—Grooves
- B81B2203/033—Trenches
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/082—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for two degrees of freedom of movement of a single mass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/081,422 US7250322B2 (en) | 2005-03-16 | 2005-03-16 | Method of making microsensor |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE544725T1 true ATE544725T1 (de) | 2012-02-15 |
Family
ID=36607522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06075521T ATE544725T1 (de) | 2005-03-16 | 2006-03-06 | Verfahren zum herstellen eines mikrosensors |
Country Status (3)
Country | Link |
---|---|
US (1) | US7250322B2 (de) |
EP (1) | EP1702884B1 (de) |
AT (1) | ATE544725T1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060207327A1 (en) | 2005-03-16 | 2006-09-21 | Zarabadi Seyed R | Linear accelerometer |
US8250921B2 (en) * | 2007-07-06 | 2012-08-28 | Invensense, Inc. | Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics |
US7934423B2 (en) | 2007-12-10 | 2011-05-03 | Invensense, Inc. | Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics |
US8462109B2 (en) | 2007-01-05 | 2013-06-11 | Invensense, Inc. | Controlling and accessing content using motion processing on mobile devices |
US8952832B2 (en) | 2008-01-18 | 2015-02-10 | Invensense, Inc. | Interfacing application programs and motion sensors of a device |
JP4792143B2 (ja) * | 2007-02-22 | 2011-10-12 | 株式会社デンソー | 半導体装置およびその製造方法 |
US7510894B2 (en) * | 2007-04-03 | 2009-03-31 | Delphi Technologies, Inc. | Post-logic isolation of silicon regions for an integrated sensor |
US8877648B2 (en) * | 2009-03-26 | 2014-11-04 | Semprius, Inc. | Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby |
CN101871952B (zh) * | 2010-06-11 | 2012-07-11 | 瑞声声学科技(深圳)有限公司 | Mems加速度传感器 |
CN101865934B (zh) * | 2010-06-11 | 2012-01-18 | 瑞声声学科技(深圳)有限公司 | 加速度传感器 |
US10267822B2 (en) | 2013-01-31 | 2019-04-23 | Hewlett-Packard Development Company, L.P. | Sensor having particle barrier |
US10800649B2 (en) | 2016-11-28 | 2020-10-13 | Analog Devices International Unlimited Company | Planar processing of suspended microelectromechanical systems (MEMS) devices |
DE102017211080B3 (de) * | 2017-06-29 | 2018-11-08 | Infineon Technologies Dresden GmbH & Co. KG | Mikromechanischer Sensor und Verfahren zum Herstellen eines mikromechanischen Sensors und eines mikromechanischen Sensorelements |
US10843920B2 (en) * | 2019-03-08 | 2020-11-24 | Analog Devices International Unlimited Company | Suspended microelectromechanical system (MEMS) devices |
Family Cites Families (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2916279A (en) | 1956-03-19 | 1959-12-08 | Austin N Stanton | Acceleration and velocity detection devices and systems |
US2912657A (en) | 1956-05-24 | 1959-11-10 | Schaevitz Engineering | Angular accelerometer |
SU583397A1 (ru) | 1976-01-04 | 1977-12-05 | Tarkhanov Oleg V | Емкостной преобразователь угловых ускорений |
SU1035523A1 (ru) | 1981-06-05 | 1983-08-15 | Московский Ордена Ленина И Ордена Октябрьской Революции Энергетический Институт | Устройство дл измерени угловых ускорений |
US4435737A (en) | 1981-12-16 | 1984-03-06 | Rockwell International Corporation | Low cost capacitive accelerometer |
SU1040424A1 (ru) | 1982-03-03 | 1983-09-07 | Предприятие П/Я А-1891 | Угловой акселерометр |
US4699006A (en) | 1984-03-19 | 1987-10-13 | The Charles Stark Draper Laboratory, Inc. | Vibratory digital integrating accelerometer |
US4736629A (en) | 1985-12-20 | 1988-04-12 | Silicon Designs, Inc. | Micro-miniature accelerometer |
US4805456A (en) | 1987-05-19 | 1989-02-21 | Massachusetts Institute Of Technology | Resonant accelerometer |
US4851080A (en) | 1987-06-29 | 1989-07-25 | Massachusetts Institute Of Technology | Resonant accelerometer |
US5006487A (en) | 1989-07-27 | 1991-04-09 | Honeywell Inc. | Method of making an electrostatic silicon accelerometer |
US5092174A (en) | 1989-10-19 | 1992-03-03 | Texas Instruments Incorporated | Capacitance accelerometer |
EP0461761B1 (de) | 1990-05-18 | 1994-06-22 | British Aerospace Public Limited Company | Trägheitssensoren |
US5253526A (en) | 1990-05-30 | 1993-10-19 | Copal Company Limited | Capacitive acceleration sensor with free diaphragm |
US5233213A (en) | 1990-07-14 | 1993-08-03 | Robert Bosch Gmbh | Silicon-mass angular acceleration sensor |
US5314572A (en) | 1990-08-17 | 1994-05-24 | Analog Devices, Inc. | Method for fabricating microstructures |
JPH0644008B2 (ja) | 1990-08-17 | 1994-06-08 | アナログ・ディバイセス・インコーポレーテッド | モノリシック加速度計 |
US5417111A (en) | 1990-08-17 | 1995-05-23 | Analog Devices, Inc. | Monolithic chip containing integrated circuitry and suspended microstructure |
US5249465A (en) | 1990-12-11 | 1993-10-05 | Motorola, Inc. | Accelerometer utilizing an annular mass |
JP2938989B2 (ja) | 1991-01-29 | 1999-08-25 | キヤノン株式会社 | 角加速度センサ |
JP3063209B2 (ja) | 1991-03-27 | 2000-07-12 | 豊田工機株式会社 | 容量型加速度センサ |
DE4122435A1 (de) | 1991-07-06 | 1993-01-07 | Bosch Gmbh Robert | Verfahren zur herstellung von beschleunigungssensoren und beschleunigungssensor |
US5146389A (en) | 1991-07-22 | 1992-09-08 | Motorola, Inc. | Differential capacitor structure and method |
US5707077A (en) | 1991-11-18 | 1998-01-13 | Hitachi, Ltd. | Airbag system using three-dimensional acceleration sensor |
US5665915A (en) | 1992-03-25 | 1997-09-09 | Fuji Electric Co., Ltd. | Semiconductor capacitive acceleration sensor |
US5251484A (en) | 1992-04-03 | 1993-10-12 | Hewlett-Packard Company | Rotational accelerometer |
JP2654602B2 (ja) | 1992-12-25 | 1997-09-17 | 日本電気株式会社 | 半導体力学量センサ |
FR2700065B1 (fr) | 1992-12-28 | 1995-02-10 | Commissariat Energie Atomique | Procédé de fabrication d'accéléromètres utilisant la technologie silicium sur isolant. |
DE4341271B4 (de) | 1993-12-03 | 2005-11-03 | Robert Bosch Gmbh | Beschleunigungssensor aus kristallinem Material und Verfahren zur Herstellung dieses Beschleunigungssensors |
DE4400127C2 (de) | 1994-01-05 | 2003-08-14 | Bosch Gmbh Robert | Kapazitiver Beschleunigungssensor und Verfahren zu seiner Herstellung |
DE4432837B4 (de) | 1994-09-15 | 2004-05-13 | Robert Bosch Gmbh | Beschleunigungssensor und Meßverfahren |
US5587518A (en) | 1994-12-23 | 1996-12-24 | Ford Motor Company | Accelerometer with a combined self-test and ground electrode |
US6000280A (en) | 1995-07-20 | 1999-12-14 | Cornell Research Foundation, Inc. | Drive electrodes for microfabricated torsional cantilevers |
JPH09318649A (ja) | 1996-05-30 | 1997-12-12 | Texas Instr Japan Ltd | 複合センサ |
US6013933A (en) | 1997-05-30 | 2000-01-11 | Motorola, Inc. | Semiconductor structure having a monocrystalline member overlying a cavity in a semiconductor substrate and process therefor |
US6199430B1 (en) | 1997-06-17 | 2001-03-13 | Denso Corporation | Acceleration sensor with ring-shaped movable electrode |
US5939633A (en) | 1997-06-18 | 1999-08-17 | Analog Devices, Inc. | Apparatus and method for multi-axis capacitive sensing |
US6678069B1 (en) | 1998-07-01 | 2004-01-13 | Canon Kabushiki Kaisha | Image formation apparatus, image processing apparatus, image synthesis method, image processing method and storage medium |
US6000287A (en) | 1998-08-28 | 1999-12-14 | Ford Motor Company | Capacitor center of area sensitivity in angular motion micro-electromechanical systems |
DE19844686A1 (de) | 1998-09-29 | 2000-04-06 | Fraunhofer Ges Forschung | Mikromechanischer Drehratensensor und Verfahren zur Herstellung |
DE69938658D1 (de) | 1999-09-10 | 2008-06-19 | St Microelectronics Srl | Gegen mechanische Spannungen unempfindliche mikroelektromechanische Struktur |
US6257062B1 (en) | 1999-10-01 | 2001-07-10 | Delphi Technologies, Inc. | Angular Accelerometer |
US6428713B1 (en) * | 1999-10-01 | 2002-08-06 | Delphi Technologies, Inc. | MEMS sensor structure and microfabrication process therefor |
DE19960094A1 (de) | 1999-12-14 | 2001-07-05 | Bosch Gmbh Robert | Verfahren zur mikromechanischen Herstellung eines Halbleiterelements, insbesondere Beschleunigungssensors |
WO2001053194A1 (en) * | 2000-01-19 | 2001-07-26 | Mitsubishi Denki Kabushiki Kaisha | Microdevice and its production method |
JP3666370B2 (ja) | 2000-07-06 | 2005-06-29 | 株式会社村田製作所 | 外力検知センサ |
US6571628B1 (en) | 2000-10-16 | 2003-06-03 | Institute Of Microelectronics | Z-axis accelerometer |
JP2004530897A (ja) | 2001-06-18 | 2004-10-07 | ハネウェル・インターナショナル・インコーポレーテッド | 小型で容量表示値が高いシリコン系mems加速度計 |
JP2003166999A (ja) | 2001-12-03 | 2003-06-13 | Denso Corp | 半導体力学量センサ |
US6761070B2 (en) * | 2002-01-31 | 2004-07-13 | Delphi Technologies, Inc. | Microfabricated linear accelerometer |
US6785117B2 (en) | 2002-03-15 | 2004-08-31 | Denso Corporation | Capacitive device |
JP4000936B2 (ja) | 2002-07-26 | 2007-10-31 | 株式会社デンソー | 容量式力学量センサを有する検出装置 |
US20050235751A1 (en) | 2004-04-27 | 2005-10-27 | Zarabadi Seyed R | Dual-axis accelerometer |
US7258010B2 (en) * | 2005-03-09 | 2007-08-21 | Honeywell International Inc. | MEMS device with thinned comb fingers |
-
2005
- 2005-03-16 US US11/081,422 patent/US7250322B2/en active Active
-
2006
- 2006-03-06 AT AT06075521T patent/ATE544725T1/de active
- 2006-03-06 EP EP06075521A patent/EP1702884B1/de active Active
Also Published As
Publication number | Publication date |
---|---|
EP1702884A3 (de) | 2011-01-05 |
EP1702884A2 (de) | 2006-09-20 |
EP1702884B1 (de) | 2012-02-08 |
US20060211161A1 (en) | 2006-09-21 |
US7250322B2 (en) | 2007-07-31 |
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