ATE517302T1 - Verfahren zur anordnung von verdampferabschnitten bündig liegender wärmerohre auf einer befestigungsplatte und entsprechende anordnung - Google Patents

Verfahren zur anordnung von verdampferabschnitten bündig liegender wärmerohre auf einer befestigungsplatte und entsprechende anordnung

Info

Publication number
ATE517302T1
ATE517302T1 AT08015644T AT08015644T ATE517302T1 AT E517302 T1 ATE517302 T1 AT E517302T1 AT 08015644 T AT08015644 T AT 08015644T AT 08015644 T AT08015644 T AT 08015644T AT E517302 T1 ATE517302 T1 AT E517302T1
Authority
AT
Austria
Prior art keywords
heat pipes
evaporator sections
arrangement
evaporator
flush
Prior art date
Application number
AT08015644T
Other languages
English (en)
Inventor
Kuo-Len Lin
Chen-Hsiang Lin
Hwai-Ming Wang
Ken Hsu
Chih-Hung Cheng
Original Assignee
Cpumate Inc
Golden Sun News Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cpumate Inc, Golden Sun News Tech Co Ltd filed Critical Cpumate Inc
Application granted granted Critical
Publication of ATE517302T1 publication Critical patent/ATE517302T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Sustainable Development (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT08015644T 2008-07-31 2008-09-04 Verfahren zur anordnung von verdampferabschnitten bündig liegender wärmerohre auf einer befestigungsplatte und entsprechende anordnung ATE517302T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097129000A TW201005253A (en) 2008-07-31 2008-07-31 Manufacturing method for levelly combining evaporation ends of aligned heat pipes to fastening seat and structure thereof

Publications (1)

Publication Number Publication Date
ATE517302T1 true ATE517302T1 (de) 2011-08-15

Family

ID=42009330

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08015644T ATE517302T1 (de) 2008-07-31 2008-09-04 Verfahren zur anordnung von verdampferabschnitten bündig liegender wärmerohre auf einer befestigungsplatte und entsprechende anordnung

Country Status (5)

Country Link
EP (1) EP2161527B1 (de)
JP (1) JP2010036251A (de)
KR (1) KR101164713B1 (de)
AT (1) ATE517302T1 (de)
TW (1) TW201005253A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI484895B (zh) 2010-05-14 2015-05-11 Asia Vital Components Co Ltd Heat dissipation device
CN102218487B (zh) * 2011-03-04 2016-01-13 东莞汉旭五金塑胶科技有限公司 导热座供多热管密合排列之组配方法及其结构
KR20180103218A (ko) * 2017-03-08 2018-09-19 서울텔레콤 주식회사 히트파이프 모듈 및 이의 제조방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653679A (ja) * 1991-09-13 1994-02-25 Furukawa Electric Co Ltd:The ヒ−トパイプ式放熱器及び発熱体の冷却構造
US6394175B1 (en) 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
JP2001248982A (ja) * 2000-03-03 2001-09-14 Fujikura Ltd ヒートパイプ構造体およびその成形工具
JP2002267376A (ja) * 2001-03-08 2002-09-18 Furukawa Electric Co Ltd:The ヒートパイプの固定方法
CN100338767C (zh) 2004-05-26 2007-09-19 鸿富锦精密工业（深圳）有限公司 热管散热装置及其制造方法
US7322102B2 (en) * 2005-01-05 2008-01-29 Cpumate Inc. Isothermal plate assembly with predetermined shape and method for manufacturing the same
US20070151711A1 (en) 2006-01-05 2007-07-05 Kuo-Hsin Chen Heat sink and method for manufacturing the same
JP2007218439A (ja) * 2006-02-14 2007-08-30 Sumitomo Light Metal Ind Ltd ヒートパイプの固定方法
US7269014B1 (en) 2006-03-15 2007-09-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20080028610A1 (en) * 2006-07-26 2008-02-07 Shyh-Ming Chen Method for assembling a vertical heat radiator
CN200973220Y (zh) * 2006-11-10 2007-11-07 鈤新科技股份有限公司 固定座及固定座与热管的组合结构

Also Published As

Publication number Publication date
TWI373601B (de) 2012-10-01
KR20100014102A (ko) 2010-02-10
EP2161527A1 (de) 2010-03-10
KR101164713B1 (ko) 2012-07-11
TW201005253A (en) 2010-02-01
EP2161527B1 (de) 2011-07-20
JP2010036251A (ja) 2010-02-18

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Legal Events

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