ATE496396T1 - LASER PROCESSING APPARATUS AND METHODS - Google Patents

LASER PROCESSING APPARATUS AND METHODS

Info

Publication number
ATE496396T1
ATE496396T1 AT04735829T AT04735829T ATE496396T1 AT E496396 T1 ATE496396 T1 AT E496396T1 AT 04735829 T AT04735829 T AT 04735829T AT 04735829 T AT04735829 T AT 04735829T AT E496396 T1 ATE496396 T1 AT E496396T1
Authority
AT
Austria
Prior art keywords
processing
laser
laser beam
processing apparatus
irradiated
Prior art date
Application number
AT04735829T
Other languages
German (de)
Inventor
You-Hie Han
Won-Chul Jung
Original Assignee
Eo Technics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eo Technics Co Ltd filed Critical Eo Technics Co Ltd
Application granted granted Critical
Publication of ATE496396T1 publication Critical patent/ATE496396T1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/50—Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

Disclosed is a laser processing apparatus for minimizing generation of sludge and enhancing the processing efficiency while processing an object. The laser processing apparatus includes a beam irradiator for emitting a laser beam from a laser light source, a beam scanner for operating the laser beam emitted from the beam scanner, to be irradiated on a predetermined interval of a processing position of the object repeatedly on the straight, and a condensing lens for regulating a focus of the laser beam emitted from the beam irradiator. The object is movable at least once along a processing direction during processing the object. According to the present invention, it is able to improve the processing efficiency and to work an object with a uniform morphology by using a mask filtering a laser beam irradiated at a rotation turning point of a beam scanning mirror, capable of continuously irradiating a laser beam by deforming the laser beam into an elliptical pattern.
AT04735829T 2004-04-19 2004-06-02 LASER PROCESSING APPARATUS AND METHODS ATE496396T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020040026749A KR100514996B1 (en) 2004-04-19 2004-04-19 Apparatus for manufacturing using laser
PCT/KR2004/001315 WO2005101487A1 (en) 2004-04-19 2004-06-02 Laser processing apparatus

Publications (1)

Publication Number Publication Date
ATE496396T1 true ATE496396T1 (en) 2011-02-15

Family

ID=35150255

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04735829T ATE496396T1 (en) 2004-04-19 2004-06-02 LASER PROCESSING APPARATUS AND METHODS

Country Status (9)

Country Link
US (1) US7688492B2 (en)
EP (1) EP1738409B1 (en)
JP (1) JP4856058B2 (en)
KR (1) KR100514996B1 (en)
CN (1) CN1947239B (en)
AT (1) ATE496396T1 (en)
CA (1) CA2564124A1 (en)
DE (1) DE602004031154D1 (en)
WO (1) WO2005101487A1 (en)

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CN103894734A (en) * 2012-12-31 2014-07-02 上海微电子装备有限公司 Laser annealing device and operation method of laser annealing device
JP6161188B2 (en) * 2013-02-05 2017-07-12 株式会社ブイ・テクノロジー Laser processing apparatus and laser processing method
CN103551735A (en) * 2013-10-18 2014-02-05 昆山思拓机器有限公司 Processing device and process for conductive rubber pad
JP6347714B2 (en) * 2014-10-02 2018-06-27 株式会社ディスコ Wafer processing method
CN106271105B (en) * 2016-08-31 2018-05-25 武汉凌云光电科技有限责任公司 A kind of laser cutting method and system of achievable fiber end face angle control
CN106362992B (en) * 2016-11-29 2019-03-01 苏州热工研究院有限公司 The laser cleaning system of inner wall of the pipe decontamination
FR3080321B1 (en) * 2018-04-23 2020-03-27 Addup APPARATUS AND METHOD FOR MANUFACTURING A THREE-DIMENSIONAL OBJECT
US11318558B2 (en) 2018-05-15 2022-05-03 The Chancellor, Masters And Scholars Of The University Of Cambridge Fabrication of components using shaped energy beam profiles
US10903121B1 (en) 2019-08-14 2021-01-26 Applied Materials, Inc. Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process

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Also Published As

Publication number Publication date
KR100514996B1 (en) 2005-09-15
DE602004031154D1 (en) 2011-03-03
JP4856058B2 (en) 2012-01-18
US7688492B2 (en) 2010-03-30
EP1738409B1 (en) 2011-01-19
CA2564124A1 (en) 2005-10-27
EP1738409A1 (en) 2007-01-03
JP2007532322A (en) 2007-11-15
CN1947239B (en) 2011-08-31
CN1947239A (en) 2007-04-11
EP1738409A4 (en) 2008-10-08
US20080088900A1 (en) 2008-04-17
WO2005101487A1 (en) 2005-10-27

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