TWI448730B - Even lighting scanning type visual system - Google Patents
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Description
本發明係關於一種掃描式視覺系統,尤指一種均勻打光之掃描式視覺系統。The present invention relates to a scanning vision system, and more particularly to a scanning vision system that uniformly illuminates.
傳統的固定式視覺打光系統,多藉由固定的取像及打光位置來予以實施,而依據光源的形式,可區分為暗場打光和亮場打光,此兩種打光類型的影像對比恰呈現相反狀態。如第1圖所示之固定式視覺打光系統1,由於取像裝置10與打光裝置11的設置角度係接近45°,故產生暗場打光的暗場效果。而如第2圖所示之固定式視覺打光系統2,由於取像裝置20與打光裝置21的設置角度係接近90°,故產生亮場打光的亮場效果。The conventional fixed visual lighting system is mostly implemented by fixed image capturing and lighting positions, and according to the form of the light source, it can be divided into dark field lighting and bright field lighting, and the two types of lighting. The image contrast is in the opposite state. As shown in Fig. 1, the fixed visual lighting system 1 has a dark field effect of dark field lighting since the angle of installation of the image capturing device 10 and the lighting device 11 is close to 45°. On the other hand, in the fixed visual lighting system 2 shown in FIG. 2, since the installation angle of the image capturing device 20 and the lighting device 21 is close to 90°, a bright field effect of bright field lighting is generated.
目前的掃描式視覺系統中,由於掃描器會藉由電致旋轉元件而旋轉內建之鏡片,所以在掃描過程中,掃描角度會產生變化,進而令亮場效果及暗場效果混合出現。如第3圖所示,掃描式視覺系統3的掃描器30及打光裝置31係設於照射區域32上方,當掃描器30在藉由旋轉振鏡之方式導引雷射與視覺對照射區域32之取像點A進行雕刻及取像時,則會產生暗場效果,而當掃描器30在藉由旋轉振鏡之方式導引雷射與視覺對照射區域32之取像點B進行雕刻及取像時,則會產生亮場效果。然而,使用習知技術進行掃描取像時其照射區域32上之各個取像點並未具有相等的亮度。In the current scanning vision system, since the scanner rotates the built-in lens by the electro-rotating element, the scanning angle changes during the scanning process, and the bright field effect and the dark field effect are mixed. As shown in FIG. 3, the scanner 30 and the lighting device 31 of the scanning vision system 3 are disposed above the illumination area 32. When the scanner 30 is guided by the rotary galvanometer, the laser and the vision pair are irradiated. When the image capturing point A of 32 is engraved and imaged, a dark field effect is generated, and when the scanner 30 guides the laser and the mirror to engrave the image point B of the irradiation area 32 by rotating the galvanometer. When the image is taken, a bright field effect is produced. However, each of the image capturing points on the illumination area 32 does not have equal brightness when scanning is taken using conventional techniques.
上述操作的缺點在於,當暗場效果及亮場效果混合出現時,照射區域32上之最佳均勻度僅能接近70%,從而使習知掃描式視覺系統3無法獲得較佳的影像對比度,易造成後續取像軟體的誤判,甚至導致定位誤差。而在已公開的專利文獻中,如第I290223、I282855、201017060號台灣專利,及第5822053、5825495號美國專利,皆係針對傳統的固定式視覺打光系統予以改良以形成光源可調節的型態,但並未實際解決現今的掃描式視覺系統的掃描過程中會混合出現暗場效果及亮場效果的問題。The disadvantage of the above operation is that when the dark field effect and the bright field effect are mixed, the optimal uniformity on the illumination area 32 can only be close to 70%, so that the conventional scanning vision system 3 cannot obtain better image contrast. It is easy to cause misjudgment of subsequent image capture software and even lead to positioning error. In the published patent documents, such as Taiwan Patent No. I290223, I282855, 201017060, and U.S. Patent Nos. 5,822,053, 5,825, 495, all of which are directed to conventional fixed-type visual lighting systems to form a light source adjustable type. However, it does not actually solve the problem that the dark field effect and the bright field effect are mixed during the scanning process of the current scanning vision system.
鑒於習知技術的種種缺失,本發明之主要目的之一係提供一種能避免掃描式視覺系統混合發生暗場效果及亮場效果之技術。In view of the various deficiencies of the prior art, one of the primary objects of the present invention is to provide a technique that avoids the effects of dark field effects and bright field effects in a scanning vision system.
為達上述目的及其它目的,本發明係提供一種均勻打光之掃描式視覺系統,係包括掃描器,係設置於一照射區域上方,並透過旋轉鏡片之方式對該照射區域進行取像;以及打光裝置,係設置於該照射區域之至少兩個側邊,用以朝向該照射區域投射光源,俾使該掃描器進行取像所得之每個取像點具有相等的亮度。To achieve the above and other objects, the present invention provides a scanning system for uniform illumination, comprising a scanner disposed above an illumination area and imaging the illumination area by rotating the lens; The light-emitting device is disposed on at least two sides of the illumination area for projecting a light source toward the illumination area, so that each image capturing point obtained by the scanner has equal brightness.
於一實施例中,該照射區域係為方形,而該打光裝置係具備四個長條狀之打光單元以環置於該照射面之四個側邊,或是具備兩個長條狀之打光單元以設置於該照射面之兩個相對側邊。In one embodiment, the illumination area is square, and the lighting device is provided with four strip-shaped lighting units to be placed on the four sides of the illumination surface, or has two strips. The lighting unit is disposed on two opposite sides of the illumination surface.
於另一實施例中,該照射面係為方形,而該打光裝置係具備兩個長條狀之打光單元以設置於該照射面之兩個相鄰側邊。In another embodiment, the illumination surface is square, and the light-emitting device is provided with two elongated light-emitting units for being disposed on two adjacent sides of the illumination surface.
相較於習知技術,本發明之掃描式視覺系統之之打光單元係分別設置於照射面周圍之至少兩個側邊上,且打光單元能朝向照射區域投射側向光源使每個取像點具有相等的亮度,因此當掃描器藉由旋轉鏡片之方式對照射區域進行雷射雕刻及取像時,能大幅減低亮場效果及暗場效果混合出現的問題,從而避免後續的定位誤差。Compared with the prior art, the lighting unit of the scanning vision system of the present invention is respectively disposed on at least two sides around the irradiation surface, and the lighting unit can project the lateral light source toward the irradiation area to make each take The image points have equal brightness. Therefore, when the scanner performs laser engraving and image capturing on the illumination area by rotating the lens, the problems of bright field effect and dark field effect mixing can be greatly reduced, thereby avoiding subsequent positioning errors. .
以下藉由特定的具體實施形態說明本發明之實施方式,熟悉此技術之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點與功效。當然,本發明亦可藉由其他不同的具體實施形態加以施行或應用。The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily appreciate the other advantages and advantages of the present invention. Of course, the invention may be embodied or applied by other different embodiments.
請一併參閱第4圖至第8圖,以進一步瞭解本發明之均勻打光之掃描式視覺系統,其中,第4圖係為本發明之均勻打光之掃描式視覺系統之整體配置示意圖,第5圖係為本發明之均勻打光之掃描式視覺系統之一打光裝置示意圖,第6圖係為本發明之均勻打光之掃描式視覺系統之另一打光裝置示意圖,第7圖係為本發明之均勻打光之掃描式視覺系統之又一打光裝置示意圖,第8圖係為本發明之均勻打光之掃描式視覺系統之打光裝置及照射面之對應關係圖。Please refer to FIG. 4 to FIG. 8 for further understanding of the uniform illumination scanning vision system of the present invention, wherein FIG. 4 is a schematic diagram of the overall configuration of the uniform illumination scanning vision system of the present invention. Figure 5 is a schematic view of one of the polishing devices of the uniform illumination scanning vision system of the present invention, and Figure 6 is a schematic view of another polishing device of the uniform illumination scanning vision system of the present invention, Figure 7 It is a schematic diagram of another polishing device of the uniform illumination scanning vision system of the present invention, and FIG. 8 is a corresponding relationship diagram of the lighting device and the illumination surface of the uniform illumination scanning vision system of the present invention.
如圖所示,本發明之均勻打光之掃描式視覺系統4係包括掃描器40及打光裝置41,於本實施例中,打光裝置41係具備至少二組打光單元,且打光單元係具備複數個能側向投射光源之發光二極體。又本實施例之照射區域為一平面(以下稱照射面5),打光單元係投射光源至照射面5。As shown in the figure, the uniform illumination scanning vision system 4 of the present invention comprises a scanner 40 and a lighting device 41. In this embodiment, the lighting device 41 is provided with at least two groups of lighting units, and is polished. The unit has a plurality of light emitting diodes capable of laterally projecting light sources. Further, the irradiation area of the present embodiment is a plane (hereinafter referred to as an irradiation surface 5), and the lighting unit projects a light source to the irradiation surface 5.
掃描器40係設置於照射面5上方,用以照射面5進行取像。於本實施例中,照射面5可為面積大於180*180mm2 之方形平台,而掃描器40係可與輸出波長介於100nm至100,000nm之雷射單元42、偵測單元43(例如為CCD)及視覺成像單元44(例如為成像鏡頭)相互搭配,藉此導引雷射單元42產生之雷射對照射面5進行雕刻加工,並將視覺成像導引至視覺成像單元44及偵測單元43以進行取像。再者,掃描器40復可具備電致轉動元件,以透過旋轉鏡片之方式對照射面5進行雕刻及取像,而掃描器40面向照射面5供雷射及視覺成像進出之端面,也可裝配有聚焦透鏡45。The scanner 40 is disposed above the irradiation surface 5 for illuminating the surface 5 for image taking. In this embodiment, the illumination surface 5 may be a square platform having an area greater than 180*180 mm 2 , and the scanner 40 is compatible with the laser unit 42 and the detection unit 43 (for example, a CCD) having an output wavelength of 100 nm to 100,000 nm. And the visual imaging unit 44 (for example, an imaging lens) is matched with each other, thereby guiding the laser generated by the laser unit 42 to engrave the illumination surface 5, and guiding the vision imaging to the visual imaging unit 44 and the detection unit. 43 to take the image. Furthermore, the scanner 40 can be provided with an electro-rotation element for engraving and imaging the illumination surface 5 by rotating the lens, and the scanner 40 faces the illumination surface 5 for the laser and the imaging end face. A focusing lens 45 is mounted.
打光裝置41係設置於照射面5之至少兩個側邊,以朝向照射面5投射光源,俾使照射面5上之每個取像點皆具有相等的亮度。於本實施例中,照射面5為方形,且打光裝置41係具備四個長條狀之打光單元410、411、412、413;其次,每個打光單元410、411、412、413亦可設置有一個或複數個光源414,且光源414係可具有垂直於照射面5之發光面415;具體來說,係可將該些打光單元410、411、412、413環置於照射面5之四個側邊,而打光單元410、411、412、413上的光源414之發光面415係可垂直於照射面5,如第4、5圖所示。另外,打光裝置41也可由設置於照射面5之兩個相對側邊上設置長條狀之打光單元411、413所構成,或是由設置於照射面5之另外兩個相對側邊上之打光單元410、412所構成,如第7圖所示。The lighting device 41 is disposed on at least two sides of the irradiation surface 5 to project a light source toward the irradiation surface 5 so that each of the image capturing points on the irradiation surface 5 has equal brightness. In this embodiment, the illumination surface 5 is square, and the lighting device 41 is provided with four strip-shaped lighting units 410, 411, 412, 413; secondly, each of the lighting units 410, 411, 412, 413 One or a plurality of light sources 414 may be disposed, and the light source 414 may have a light emitting surface 415 perpendicular to the illumination surface 5; specifically, the light-emitting units 410, 411, 412, and 413 may be placed in the illumination. The four sides of the face 5, and the light-emitting face 415 of the light source 414 on the light-emitting units 410, 411, 412, 413 can be perpendicular to the illuminated face 5, as shown in Figures 4 and 5. In addition, the lighting device 41 may be formed by providing the strip-shaped lighting units 411 and 413 provided on the opposite sides of the irradiation surface 5 or on the other two opposite sides of the irradiation surface 5. The lighting units 410 and 412 are configured as shown in FIG.
具體來說,於第5圖或第7圖之實施型態中,照射面5及打光裝置41之打光單元係可滿足幾何公式:D=L-2(d2+d3)tanθ。請一併參照第8圖,上述公式中,D為照射面5之寬度,L為位於照射面5相對側邊之打光單元411(410)、413(412)之水平距離,d2為打光單元411(410)、413(412)之底部距離照射面5之高度,d3為打光單元411(410)、413(412)本身之尺寸高度,θ為打光單元411(410)、413(412)之發光角度,而圖中所示之d1,係對應發光角度θ為打光單元411(410)、413(412)之發光面距照射面5的水平距離。換言之,打光裝置41環繞出的範圍係可為照射面5之1.5~2倍,例如1.7倍。然而,打光單元411(410)、413(412)之設置角度亦可具有一定的容忍範圍,即打光單元411(410)、413(412)之發光面相對於照射面5之設置角度係可介於80°至100°(90°±10°)間。Specifically, in the embodiment of FIG. 5 or FIG. 7, the illumination unit 5 and the lighting unit of the lighting device 41 can satisfy the geometric formula: D=L-2(d2+d3)tanθ. Referring to FIG. 8 together, in the above formula, D is the width of the illumination surface 5, L is the horizontal distance between the light-emitting units 411 (410) and 413 (412) on the opposite sides of the illumination surface 5, and d2 is the illumination. The bottom of the units 411 (410), 413 (412) is the height of the illumination surface 5, d3 is the height of the light-emitting units 411 (410), 413 (412) itself, and θ is the lighting unit 411 (410), 413 ( The illuminating angle of 412), and the d1 shown in the figure corresponds to the horizontal distance of the illuminating surface of the lighting units 411 (410) and 413 (412) from the illuminating surface 5 corresponding to the illuminating angle θ. In other words, the range in which the lighting device 41 surrounds may be 1.5 to 2 times, for example, 1.7 times the irradiation surface 5. However, the setting angles of the lighting units 411 (410) and 413 (412) may also have a certain tolerance range, that is, the setting angles of the light-emitting surfaces of the lighting units 411 (410) and 413 (412) with respect to the irradiation surface 5 may be Between 80° and 100° (90° ± 10°).
於另一實施例中,打光裝置41之二組長條狀打光單元可由設置於照射面5之兩個相鄰側邊,如第6圖所示,僅將打光單元411、412設置於照射面5之兩個相鄰側邊。該些打光單元411、412之發光面相對於照射面5之設置角度,係可具有一定的容忍範圍,亦即介於80°至100°(90°±10°)間。需說明者,相較於第5圖,第6、7圖之實施型態雖會造成亮度之降低與照射範圍之減少,惟並不會影響照射面5上之每個取像點應具有相等之亮度。In another embodiment, the two sets of strip-shaped lighting units of the lighting device 41 may be disposed on two adjacent sides of the illumination surface 5, as shown in FIG. 6, only the lighting units 411, 412 are disposed on Two adjacent sides of the illuminated surface 5 are illuminated. The angles of the light-emitting surfaces of the light-emitting units 411 and 412 with respect to the illumination surface 5 may have a certain tolerance range, that is, between 80° and 100° (90°±10°). It should be noted that compared with Fig. 5, the embodiment of Figs. 6 and 7 causes a decrease in brightness and a decrease in the illumination range, but does not affect that each image point on the illumination surface 5 should be equal. Brightness.
實際測試如第4圖所示之四面環繞打光單元以及傳統向下投射光源之雙層方形光源可調型態(未圖示)後發現,若照射面5之面積為400*400mm2 ,本發明之均勻度模擬結果至少為97.3%,而傳統之雙層方形光源可調型態之均勻度模擬結果,至多為65.6%,由此可知,本發明確實能大幅降低因亮場效果及暗場效果混合出現所生之缺陷。Actual test, as shown in Figure 4, the four-sided surrounding lighting unit and the traditional two-sided square light source adjustable type (not shown), it is found that if the area of the illuminated surface 5 is 400*400mm 2 , this The uniformity simulation result of the invention is at least 97.3%, and the uniformity simulation result of the conventional double-layer square light source adjustable state is at most 65.6%. Therefore, the present invention can significantly reduce the bright field effect and the dark field. The effect blends with the defects.
綜上所述,由於本發明之均勻打光之掃描式視覺系統係將打光裝置之打光單元配置於照射面周圍之至少二個側邊上,且該些打光單元係能朝向照射面投射側向光源以使照射面上之每個取像點皆具有相等的亮度,所以,在掃描器進行取像時,亮場效果及暗場效果混合出現的機率會大幅降低,從而提昇後續的定位精準度。In summary, the uniform illumination scanning vision system of the present invention has the lighting unit of the lighting device disposed on at least two sides of the illumination surface, and the lighting units are capable of facing the illumination surface. Projecting the lateral light source so that each image capturing point on the illuminated surface has equal brightness, so that when the scanner performs image capturing, the probability of mixing the bright field effect and the dark field effect is greatly reduced, thereby improving the subsequent Positioning accuracy.
惟,上述實施形態僅例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施形態進行修飾與改變。因此,本發明之權利保護範圍,應如後述之申請專利範圍所列。However, the above-described embodiments are merely illustrative of the principles and effects of the invention and are not intended to limit the invention. Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the claims described below.
1、2...固定式視覺打光系統1, 2. . . Fixed visual lighting system
10、20...取像裝置10, 20. . . Image capture device
11、21...打光裝置11, 21. . . Lighting device
3...掃描式視覺系統3. . . Scanning vision system
30...掃描器30. . . scanner
31...打光裝置31. . . Lighting device
32...照射區域32. . . Irradiated area
4...均勻打光之掃描式視覺系統4. . . Uniformly illuminated scanning vision system
40...掃描器40. . . scanner
41...打光裝置41. . . Lighting device
410、411、412、413...打光單元410, 411, 412, 413. . . Lighting unit
414...光源414. . . light source
415...發光面415. . . Luminous surface
42...雷射單元42. . . Laser unit
43...偵測單元43. . . Detection unit
44...視覺成像單元44. . . Visual imaging unit
45...聚焦透鏡45. . . Focusing lens
5...照射面5. . . Irradiated surface
第1圖係為現有之固定式視覺打光系統之一配置示意圖;Figure 1 is a schematic diagram of one of the existing fixed visual lighting systems;
第2圖係為現有之固定式視覺打光系統之另一配置示意圖;Figure 2 is a schematic diagram of another configuration of the existing fixed visual lighting system;
第3圖係為現有之掃描式視覺系統之配置示意圖;Figure 3 is a schematic diagram of the configuration of the existing scanning vision system;
第4圖係為本發明之均勻打光之掃描式視覺系統之整體配置示意圖;Figure 4 is a schematic view showing the overall configuration of the uniform illumination scanning vision system of the present invention;
第5圖係為本發明之均勻打光之掃描式視覺系統之一打光裝置示意圖;Figure 5 is a schematic view of a light-emitting device of the uniform illumination scanning vision system of the present invention;
第6圖係為本發明之均勻打光之掃描式視覺系統之另一打光裝置示意圖;Figure 6 is a schematic view of another light-emitting device of the uniformly illuminated scanning vision system of the present invention;
第7圖係為本發明之均勻打光之掃描式視覺系統之又一打光裝置示意圖;以及Figure 7 is a schematic view of another polishing device of the uniformly illuminated scanning vision system of the present invention;
第8圖係為本發明之均勻打光之掃描式視覺系統之打光裝置及照射面之對應關係圖。Figure 8 is a diagram showing the correspondence between the lighting device and the irradiation surface of the uniform illumination scanning vision system of the present invention.
4...均勻打光之掃描式視覺系統4. . . Uniformly illuminated scanning vision system
40...掃描器40. . . scanner
41...打光裝置41. . . Lighting device
410、411、412、413...打光單元410, 411, 412, 413. . . Lighting unit
42...雷射單元42. . . Laser unit
43...偵測單元43. . . Detection unit
44...視覺成像單元44. . . Visual imaging unit
45...聚焦透鏡45. . . Focusing lens
5...照射面5. . . Irradiated surface
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US10705346B2 (en) | 2016-10-11 | 2020-07-07 | Industrial Technology Research Institute | Laser uniformly machining apparatus and method |
US11338392B2 (en) | 2018-11-09 | 2022-05-24 | Industrial Technology Research Institute | Cutting method for forming chamfered corners |
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TWI319812B (en) * | 2006-03-22 | 2010-01-21 | System for inspecting surfaces with improved light efficiency | |
US7688492B2 (en) * | 2004-04-19 | 2010-03-30 | Eo Technics Co., Ltd. | Laser processing apparatus |
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US7688492B2 (en) * | 2004-04-19 | 2010-03-30 | Eo Technics Co., Ltd. | Laser processing apparatus |
TWI319812B (en) * | 2006-03-22 | 2010-01-21 | System for inspecting surfaces with improved light efficiency |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US10705346B2 (en) | 2016-10-11 | 2020-07-07 | Industrial Technology Research Institute | Laser uniformly machining apparatus and method |
US11338392B2 (en) | 2018-11-09 | 2022-05-24 | Industrial Technology Research Institute | Cutting method for forming chamfered corners |
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