ATE475630T1 - Glas und glasrohr zur einkapselung von halbleiter - Google Patents

Glas und glasrohr zur einkapselung von halbleiter

Info

Publication number
ATE475630T1
ATE475630T1 AT01111860T AT01111860T ATE475630T1 AT E475630 T1 ATE475630 T1 AT E475630T1 AT 01111860 T AT01111860 T AT 01111860T AT 01111860 T AT01111860 T AT 01111860T AT E475630 T1 ATE475630 T1 AT E475630T1
Authority
AT
Austria
Prior art keywords
glass
weight
encapsulating semiconductors
encapsulating
li2o
Prior art date
Application number
AT01111860T
Other languages
English (en)
Inventor
Hiroyuki Kosokabe
Original Assignee
Nippon Electric Glass Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co filed Critical Nippon Electric Glass Co
Application granted granted Critical
Publication of ATE475630T1 publication Critical patent/ATE475630T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/076Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/076Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/076Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C03C3/087Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00Compositions for glass with special properties
    • C03C4/16Compositions for glass with special properties for dielectric glass
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Glass Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AT01111860T 2000-05-16 2001-05-16 Glas und glasrohr zur einkapselung von halbleiter ATE475630T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000143990 2000-05-16

Publications (1)

Publication Number Publication Date
ATE475630T1 true ATE475630T1 (de) 2010-08-15

Family

ID=18650727

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01111860T ATE475630T1 (de) 2000-05-16 2001-05-16 Glas und glasrohr zur einkapselung von halbleiter

Country Status (7)

Country Link
US (2) US6534346B2 (de)
EP (1) EP1156020B1 (de)
KR (1) KR100622033B1 (de)
CN (2) CN1285122C (de)
AT (1) ATE475630T1 (de)
DE (1) DE60142663D1 (de)
TW (1) TWI239940B (de)

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DE10150239A1 (de) * 2001-10-11 2003-04-30 Schott Glas Bleifreie Glasrohre, deren Verwendung und Dioden
DE60312687T2 (de) * 2002-07-08 2007-12-06 Koninklijke Philips Electronics N.V. Eine glaskomponente enthaltender elektrischer beleuchtungskörper
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US20040206953A1 (en) * 2003-04-16 2004-10-21 Robert Morena Hermetically sealed glass package and method of fabrication
US7344901B2 (en) * 2003-04-16 2008-03-18 Corning Incorporated Hermetically sealed package and method of fabricating of a hermetically sealed package
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US20050082167A1 (en) * 2003-07-28 2005-04-21 Yasukazu Iwamoto Glass electrode
US7176152B2 (en) * 2004-06-09 2007-02-13 Ferro Corporation Lead-free and cadmium-free conductive copper thick film pastes
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
JP5029014B2 (ja) * 2004-09-29 2012-09-19 日本電気硝子株式会社 半導体封止用ガラス及び半導体封止用外套管並びに半導体電子部品
JPWO2006068030A1 (ja) * 2004-12-21 2008-06-12 旭硝子株式会社 電極被覆用ガラス
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US20080302418A1 (en) * 2006-03-18 2008-12-11 Benyamin Buller Elongated Photovoltaic Devices in Casings
US20100326429A1 (en) * 2006-05-19 2010-12-30 Cumpston Brian H Hermetically sealed cylindrical solar cells
US20100132765A1 (en) * 2006-05-19 2010-06-03 Cumpston Brian H Hermetically sealed solar cells
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US20100132794A1 (en) * 2006-10-06 2010-06-03 Cumpston Brian H Sealed photovoltaic apparatus
CN101062832B (zh) * 2006-11-21 2010-09-22 钟运辉 电子产品用无铅玻壳
US9310026B2 (en) 2006-12-04 2016-04-12 Cree, Inc. Lighting assembly and lighting method
US8337045B2 (en) 2006-12-04 2012-12-25 Cree, Inc. Lighting device and lighting method
KR101031742B1 (ko) * 2007-01-30 2011-04-29 가부시키가이샤 무라타 세이사쿠쇼 감광성 유리 페이스트 및 다층 배선 칩 부품
CN101743488B (zh) 2007-07-17 2014-02-26 科锐公司 具有内部光学特性结构的光学元件及其制造方法
US11114594B2 (en) 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
US7897530B2 (en) * 2008-01-14 2011-03-01 Atomic Energy Council-Institute Of Nuclear Energy Research Glass-ceramic sealant for planar solid oxide fuel cells
JP5072657B2 (ja) 2008-03-05 2012-11-14 株式会社松風 アルミノシリケートガラスおよびセラミックス系歯冠陶材用の色調調整組成物
JP5354445B2 (ja) * 2008-06-25 2013-11-27 日本電気硝子株式会社 金属被覆用ガラス及び半導体封止材料
CN102050577B (zh) * 2009-11-06 2012-10-10 湖北新华光信息材料有限公司 一种特殊用途的封接玻璃
US8329482B2 (en) 2010-04-30 2012-12-11 Cree, Inc. White-emitting LED chips and method for making same
JP2012031048A (ja) * 2010-07-01 2012-02-16 Nippon Electric Glass Co Ltd 無鉛半導体封入用ガラス
JP5909937B2 (ja) * 2010-09-09 2016-04-27 日本電気硝子株式会社 半導体パッケージ用カバーガラス及びその製造方法
CN102070301A (zh) * 2010-11-26 2011-05-25 西安华泰有色金属实业有限责任公司 一次锂电池用耐蚀封接玻璃材料及其制备方法
CN102633435A (zh) * 2012-03-09 2012-08-15 金招娣 用于制造二极管玻壳的无铅低温玻璃
US9208929B2 (en) 2013-09-20 2015-12-08 Schott Corporation GTMS connector for oil and gas market
US10186425B2 (en) * 2014-10-31 2019-01-22 Shindengen Electric Manufacturing Co., Ltd. Method of manufacturing semiconductor device and resist glass
CN106024726B (zh) * 2016-07-19 2018-12-11 如皋市大昌电子有限公司 一种用无铅玻璃封装的二极管
CN110627362A (zh) * 2019-10-22 2019-12-31 江苏虹普电子材料科技有限公司 一种用于汽车火花塞封接的玻璃粉及其制备方法
DE102020108867A1 (de) 2020-03-31 2021-09-30 Schott Ag Einschmelzglas und dessen Verwendung
EP4222125A1 (de) * 2020-09-30 2023-08-09 Corning Incorporated Bleifreie glaszusammensetzung zur herstellung von mikrokanalplatten
TWI900767B (zh) * 2021-06-14 2025-10-11 日商日本電氣硝子股份有限公司 半導體元件被覆用玻璃及使用其之半導體元件被覆用材料
DE102023126243A1 (de) 2023-09-27 2025-03-27 Schott Ag Verwendung eines Glases zur Passivierung eines elektronischen Bauelements und passiviertes elektronisches Bauelement

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Also Published As

Publication number Publication date
CN1323753A (zh) 2001-11-28
DE60142663D1 (de) 2010-09-09
KR100622033B1 (ko) 2006-09-13
US20030124774A1 (en) 2003-07-03
EP1156020A1 (de) 2001-11-21
US6724094B2 (en) 2004-04-20
US6534346B2 (en) 2003-03-18
TWI239940B (en) 2005-09-21
EP1156020B1 (de) 2010-07-28
CN1285122C (zh) 2006-11-15
KR20010106248A (ko) 2001-11-29
CN1217395C (zh) 2005-08-31
CN1617329A (zh) 2005-05-18
US20020001881A1 (en) 2002-01-03

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