ATE471548T1 - Rfid-etiketten für paletten und kartons und verfahren zu ihrer befestigung - Google Patents

Rfid-etiketten für paletten und kartons und verfahren zu ihrer befestigung

Info

Publication number
ATE471548T1
ATE471548T1 AT06787743T AT06787743T ATE471548T1 AT E471548 T1 ATE471548 T1 AT E471548T1 AT 06787743 T AT06787743 T AT 06787743T AT 06787743 T AT06787743 T AT 06787743T AT E471548 T1 ATE471548 T1 AT E471548T1
Authority
AT
Austria
Prior art keywords
layer
coil
cartons
pallets
attaching
Prior art date
Application number
AT06787743T
Other languages
English (en)
Inventor
Thomas J Clare
Andre Cote
Original Assignee
Checkpoint Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Checkpoint Systems Inc filed Critical Checkpoint Systems Inc
Application granted granted Critical
Publication of ATE471548T1 publication Critical patent/ATE471548T1/de

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07786Antenna details the antenna being of the HF type, such as a dipole
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Details Of Aerials (AREA)
  • Labeling Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Cartons (AREA)
  • Burglar Alarm Systems (AREA)
  • Pallets (AREA)
  • Making Paper Articles (AREA)
  • Packaging Frangible Articles (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
AT06787743T 2005-07-19 2006-07-18 Rfid-etiketten für paletten und kartons und verfahren zu ihrer befestigung ATE471548T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US70043105P 2005-07-19 2005-07-19
US11/457,890 US7436305B2 (en) 2005-07-19 2006-07-17 RFID tags for pallets and cartons and system for attaching same
PCT/US2006/027892 WO2007011954A2 (en) 2005-07-19 2006-07-18 Rfid tags for pallets and cartons and system for attaching same

Publications (1)

Publication Number Publication Date
ATE471548T1 true ATE471548T1 (de) 2010-07-15

Family

ID=37546759

Family Applications (2)

Application Number Title Priority Date Filing Date
AT06787743T ATE471548T1 (de) 2005-07-19 2006-07-18 Rfid-etiketten für paletten und kartons und verfahren zu ihrer befestigung
AT10161430T ATE531004T1 (de) 2005-07-19 2006-07-18 Verfahren zum befestigen von rfid-etiketten

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT10161430T ATE531004T1 (de) 2005-07-19 2006-07-18 Verfahren zum befestigen von rfid-etiketten

Country Status (11)

Country Link
US (2) US7436305B2 (de)
EP (2) EP2207133B1 (de)
JP (1) JP4881949B2 (de)
CN (3) CN101853419B (de)
AT (2) ATE471548T1 (de)
AU (1) AU2006270022B2 (de)
CA (2) CA2705018C (de)
DE (1) DE602006014970D1 (de)
ES (2) ES2376530T3 (de)
MX (1) MX2008000923A (de)
WO (1) WO2007011954A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2874442B1 (fr) * 2004-08-20 2007-06-29 Kaysersberg Packaging Soc Par Procede pour appliquer des transpondeurs d'identification par radiofrequence sur des feuilles d'emballage, support de transpondeurs
US7605708B2 (en) 2005-12-22 2009-10-20 Checkpoint Systems, Inc. Smart corrugated cardboard
US8061624B2 (en) * 2009-12-28 2011-11-22 Avery Dennison Corporation RFID strap and cutting device
US8991709B2 (en) 2010-08-30 2015-03-31 Tagstar Systems Gmbh Tamper-proof RFID label
DE102012109040B4 (de) * 2012-09-25 2014-12-11 BIBA - Bremer Institut für Produktion und Logistik GmbH Klettervorrichtung und Verfahren zum Ausführen von Tätigkeiten an gestapelten Gegenständen
WO2016126236A1 (en) * 2015-02-03 2016-08-11 Halliburton Energy Services, Inc. Improved radio frequency identification tag
GB2606088B (en) * 2016-08-31 2023-02-08 Skyworks Solutions Inc Amplifier with improved return loss and mismatch over gain modes
CN108000939B (zh) * 2017-11-24 2019-08-16 中煤科工集团淮北爆破技术研究院有限公司 一种自动安全雷管盒贴标机

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4605844A (en) * 1985-02-11 1986-08-12 At&T Technologies, Inc. Computerized transaction card with inductive data transfer
JP2508444B2 (ja) * 1987-06-25 1996-06-19 ソニー株式会社 カラ−陰極線管
JPH01129396A (ja) * 1987-11-14 1989-05-22 Tokai Kinzoku Kk 共振タグおよびその製造法
US5071445A (en) * 1990-05-18 1991-12-10 Basf Aktiengesellschaft Novel reaction products of aminoalkylene polycarboxylic acids with secondary amines and middle distillate compositions containing the aforesaid
US5083942A (en) * 1991-02-13 1992-01-28 E. I. Du Pont De Nemours And Company Fish hook hold-downs
CN2138348Y (zh) * 1992-05-12 1993-07-14 李连彬 防脱落插头
US5497140A (en) * 1992-08-12 1996-03-05 Micron Technology, Inc. Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication
JP3305843B2 (ja) * 1993-12-20 2002-07-24 株式会社東芝 半導体装置
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5541399A (en) * 1994-09-30 1996-07-30 Palomar Technologies Corporation RF transponder with resonant crossover antenna coil
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
JP2000113152A (ja) * 1998-10-05 2000-04-21 Hitachi Maxell Ltd 非接触メモリ素子を内蔵した磁気ストライプテープ及びそれを利用して製造されたicカード及びicタグ
US6891110B1 (en) * 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
US6259369B1 (en) * 1999-09-30 2001-07-10 Moore North America, Inc. Low cost long distance RFID reading
JP2001175829A (ja) * 1999-10-08 2001-06-29 Dainippon Printing Co Ltd 非接触式データキャリアおよびicチップ
AU2001283216B2 (en) * 2000-08-11 2006-06-15 Escort Memory Systems Rfid tag assembly and system
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US6993298B2 (en) * 2001-09-07 2006-01-31 Siemens Energy & Automation, Inc. Programmable controller with RF wireless interface
US6988666B2 (en) * 2001-09-17 2006-01-24 Checkpoint Systems, Inc. Security tag and process for making same
CA2518614A1 (en) * 2002-04-24 2003-11-06 Mineral Lassen Llc Manufacturing method for a wireless communication device and manufacturing apparatus
CN2567692Y (zh) * 2002-09-03 2003-08-20 深圳市人一投资发展有限公司 长距离微波自动识别读写器
US7253735B2 (en) * 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7242996B2 (en) * 2003-03-25 2007-07-10 Id Solutions, Inc. Attachment of RFID modules to antennas
JP4694115B2 (ja) * 2003-08-14 2011-06-08 大日本印刷株式会社 非接触icタグ付シートの製造方法
US7227470B2 (en) * 2004-04-06 2007-06-05 Lasersoft Americas Limited Partnership RFID label application system
KR101038493B1 (ko) * 2004-11-12 2011-06-01 삼성테크윈 주식회사 극초단파용 라디오 주파수 인식태그 제조방법

Also Published As

Publication number Publication date
AU2006270022B2 (en) 2010-03-25
CN101853419A (zh) 2010-10-06
EP1904961A2 (de) 2008-04-02
EP2207133B1 (de) 2011-10-26
CA2616000A1 (en) 2007-01-25
ES2349960T3 (es) 2011-01-13
CN101273370A (zh) 2008-09-24
CN101273370B (zh) 2010-12-29
CN101853418B (zh) 2013-05-15
ES2376530T3 (es) 2012-03-14
ATE531004T1 (de) 2011-11-15
US20070018824A1 (en) 2007-01-25
JP2009503651A (ja) 2009-01-29
WO2007011954A3 (en) 2007-05-31
CA2705018C (en) 2012-09-11
US7961102B2 (en) 2011-06-14
US7436305B2 (en) 2008-10-14
WO2007011954A2 (en) 2007-01-25
CA2616000C (en) 2012-07-10
CN101853419B (zh) 2013-05-15
EP2207133A1 (de) 2010-07-14
DE602006014970D1 (de) 2010-07-29
AU2006270022A1 (en) 2007-01-25
US20090015412A1 (en) 2009-01-15
CN101853418A (zh) 2010-10-06
MX2008000923A (es) 2008-03-26
EP1904961B1 (de) 2010-06-16
CA2705018A1 (en) 2007-01-25
JP4881949B2 (ja) 2012-02-22

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties