ATE463036T1 - Ablösbare halbleitende abschirmung und zusammensetzungen dafür - Google Patents
Ablösbare halbleitende abschirmung und zusammensetzungen dafürInfo
- Publication number
- ATE463036T1 ATE463036T1 AT04784955T AT04784955T ATE463036T1 AT E463036 T1 ATE463036 T1 AT E463036T1 AT 04784955 T AT04784955 T AT 04784955T AT 04784955 T AT04784955 T AT 04784955T AT E463036 T1 ATE463036 T1 AT E463036T1
- Authority
- AT
- Austria
- Prior art keywords
- compositions
- shields
- removable
- semi
- semiconductive shield
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/421—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
- H01B7/0291—Disposition of insulation comprising two or more layers of insulation having different electrical properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/14—Copolymers of propene
- C08L23/142—Copolymers of propene at least partially crystalline copolymers of propene with other olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US50609703P | 2003-09-25 | 2003-09-25 | |
PCT/US2004/031340 WO2005031761A1 (fr) | 2003-09-25 | 2004-09-24 | Blindage semi-conducteur pelable et compositions pour un tel blindage |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE463036T1 true ATE463036T1 (de) | 2010-04-15 |
Family
ID=34393107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04784955T ATE463036T1 (de) | 2003-09-25 | 2004-09-24 | Ablösbare halbleitende abschirmung und zusammensetzungen dafür |
Country Status (10)
Country | Link |
---|---|
US (1) | US20070012468A1 (fr) |
EP (1) | EP1668652B2 (fr) |
JP (2) | JP4959331B2 (fr) |
CN (1) | CN1856844B (fr) |
AT (1) | ATE463036T1 (fr) |
CA (1) | CA2536948C (fr) |
DE (1) | DE602004026326D1 (fr) |
MX (1) | MXPA06003343A (fr) |
TW (1) | TWI356832B (fr) |
WO (1) | WO2005031761A1 (fr) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE456139T1 (de) * | 2006-07-10 | 2010-02-15 | Borealis Tech Oy | Kabelschicht auf der basis von polypropylen mit hoher elektrischer ausfall-spannungsfestigkeit |
WO2009058560A1 (fr) | 2007-11-02 | 2009-05-07 | Union Carbide Chemicals & Plastics Technology Llc | Réduction de pertes diélectriques par utilisation d'argile organique dans des compositions semi-conductrices ou isolantes |
DE602008005863D1 (de) * | 2008-05-27 | 2011-05-12 | Borealis Ag | Ablösbare halbleitende Zusammensetzung mit bei niedriger Temperatur schmelzenden Polyolefinen |
EP2128195A1 (fr) * | 2008-05-27 | 2009-12-02 | Borealis AG | Composition semiconductrice pelable comprenant une polyoléfine à faible température de fusion |
US8388868B2 (en) * | 2010-02-01 | 2013-03-05 | General Cable Technologies Corporation | Vulcanizable copolymer semiconductive shield compositions |
EP2365010B1 (fr) | 2010-03-01 | 2013-01-23 | Borealis AG | Composition de polymère semi-conducteur comportant un copolymère polaire |
JP5689171B2 (ja) | 2010-06-03 | 2015-03-25 | ダウ グローバル テクノロジーズ エルエルシー | ケーブルのための剥離性絶縁シールド |
CN101942142B (zh) * | 2010-08-16 | 2012-08-15 | 江阴市海江高分子材料有限公司 | 110kv及以上电压等级电缆用半导电屏蔽料制备方法 |
KR101653210B1 (ko) | 2012-02-16 | 2016-09-01 | 보레알리스 아게 | 반전도성 폴리머 조성물 |
CN103481519A (zh) * | 2013-09-22 | 2014-01-01 | 苏州市湘园特种精细化工有限公司 | 一种绝缘橡胶片的加工工艺 |
CN105719767A (zh) * | 2014-01-17 | 2016-06-29 | 常州船用电缆有限责任公司 | 船舶及海上石油平台用耐泥浆电力电缆 |
KR20160132019A (ko) | 2014-03-12 | 2016-11-16 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전도성 중합체 재료 |
US10217544B2 (en) | 2014-12-17 | 2019-02-26 | Prysmian S.P.A | Energy cable having a cold-strippable semiconductive layer |
JP6558564B2 (ja) * | 2015-03-13 | 2019-08-14 | 日立金属株式会社 | 送電ケーブル |
JP2016170994A (ja) * | 2015-03-13 | 2016-09-23 | 日立金属株式会社 | 送電ケーブル |
BR112018006668A2 (pt) * | 2015-09-30 | 2018-10-09 | Schlumberger Technology Bv | cabo de alimentação submersível de alta temperatura |
US10204715B2 (en) * | 2016-03-31 | 2019-02-12 | Schlumberger Technology Corporation | Submersible power cable |
CN110698752A (zh) * | 2019-10-08 | 2020-01-17 | 深圳市晖耀电线电缆有限公司 | 一种导电屏蔽膜材料及其制备方法、屏蔽数据线 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE440709B (sv) † | 1976-06-10 | 1985-08-12 | Asea Ab | Sett att med anvendning av en strengsprutmaskin pa en med isolering av icke tverbunden eller tverbunden polyten forsedd kabelledare applicera ett ledande, avrivbart skikt |
US4286023A (en) † | 1976-10-04 | 1981-08-25 | Union Carbide Corporation | Article of manufacture, the cross-linked product of a semi-conductive composition bonded to a crosslinked polyolefin substrate |
DE3375619D1 (en) † | 1983-06-13 | 1988-03-10 | Mitsui Du Pont Polychemical | Semiconducting compositions and wires and cables using the same |
FI862569A (fi) * | 1985-06-21 | 1986-12-22 | Nippon Unicar Co Ltd | Sammansaettningar baserade pao blandningar av etylen-etylakrylatkopolymerer och etylen-vinylacetat -vinylklorid-terpolymerer. |
DE69015302T2 (de) † | 1989-09-29 | 1995-05-18 | Union Carbide Chem Plastic | Isolierte elektrische Leiter. |
JP3551755B2 (ja) * | 1998-04-03 | 2004-08-11 | 日立電線株式会社 | 剥離容易性半導電性樹脂組成物及び電線・ケーブル |
US6013202A (en) * | 1998-07-29 | 2000-01-11 | Bicc General Uk Cables Limited | Compositions of matter and electric cables |
JP4399076B2 (ja) † | 1999-04-28 | 2010-01-13 | 日本ユニカー株式会社 | 水架橋ポリエチレン絶縁電力ケーブル外部半導電層用剥離性半導電性樹脂組成物 |
JP4399077B2 (ja) * | 1999-06-09 | 2010-01-13 | 日本ユニカー株式会社 | 水架橋ポリエチレン絶縁電力ケーブル内部半導電層用密着性半導電性樹脂組成物 |
JP2001302856A (ja) * | 2000-02-17 | 2001-10-31 | Fujikura Ltd | 半導電性樹脂組成物およびそれを用いた電力ケーブル |
US6455771B1 (en) * | 2001-03-08 | 2002-09-24 | Union Carbide Chemicals & Plastics Technology Corporation | Semiconducting shield compositions |
JP5025048B2 (ja) * | 2001-04-06 | 2012-09-12 | 日本ユニカー株式会社 | 半導電性樹脂組成物およびそれを用いた電力ケーブル |
US6972099B2 (en) * | 2003-04-30 | 2005-12-06 | General Cable Technologies Corporation | Strippable cable shield compositions |
JP5013872B2 (ja) * | 2003-06-09 | 2012-08-29 | ユニオン カーバイド ケミカルズ アンド プラスティックス テクノロジー エルエルシー | 剥離性半導体絶縁シールド |
-
2004
- 2004-09-24 CN CN200480027900XA patent/CN1856844B/zh not_active Expired - Lifetime
- 2004-09-24 CA CA2536948A patent/CA2536948C/fr not_active Expired - Lifetime
- 2004-09-24 TW TW093129014A patent/TWI356832B/zh active
- 2004-09-24 DE DE602004026326T patent/DE602004026326D1/de not_active Expired - Lifetime
- 2004-09-24 WO PCT/US2004/031340 patent/WO2005031761A1/fr active Search and Examination
- 2004-09-24 EP EP04784955A patent/EP1668652B2/fr not_active Expired - Lifetime
- 2004-09-24 US US10/569,936 patent/US20070012468A1/en not_active Abandoned
- 2004-09-24 AT AT04784955T patent/ATE463036T1/de not_active IP Right Cessation
- 2004-09-24 JP JP2006528196A patent/JP4959331B2/ja not_active Expired - Lifetime
- 2004-09-24 MX MXPA06003343A patent/MXPA06003343A/es active IP Right Grant
-
2011
- 2011-10-20 JP JP2011230303A patent/JP2012074382A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE602004026326D1 (de) | 2010-05-12 |
MXPA06003343A (es) | 2006-06-08 |
CN1856844A (zh) | 2006-11-01 |
EP1668652A1 (fr) | 2006-06-14 |
JP2012074382A (ja) | 2012-04-12 |
CA2536948C (fr) | 2013-01-22 |
CA2536948A1 (fr) | 2005-04-07 |
JP2007506847A (ja) | 2007-03-22 |
TWI356832B (en) | 2012-01-21 |
EP1668652B2 (fr) | 2012-11-21 |
JP4959331B2 (ja) | 2012-06-20 |
US20070012468A1 (en) | 2007-01-18 |
TW200523305A (en) | 2005-07-16 |
EP1668652B1 (fr) | 2010-03-31 |
CN1856844B (zh) | 2011-06-01 |
WO2005031761A1 (fr) | 2005-04-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |