ATE456681T1 - Kupferlegierung - Google Patents

Kupferlegierung

Info

Publication number
ATE456681T1
ATE456681T1 AT04009838T AT04009838T ATE456681T1 AT E456681 T1 ATE456681 T1 AT E456681T1 AT 04009838 T AT04009838 T AT 04009838T AT 04009838 T AT04009838 T AT 04009838T AT E456681 T1 ATE456681 T1 AT E456681T1
Authority
AT
Austria
Prior art keywords
alloy
cast
copper alloy
content
copper
Prior art date
Application number
AT04009838T
Other languages
English (en)
Inventor
Kiyohito Ishida
Ryosuke Kainuma
Takashi Kimura
Michio Miura
Takashi Mizushima
Yozo Tsugane
Original Assignee
Kiyohito Ishida
Yamaha Metanix Corp
Dowa Metaltech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kiyohito Ishida, Yamaha Metanix Corp, Dowa Metaltech Co Ltd filed Critical Kiyohito Ishida
Application granted granted Critical
Publication of ATE456681T1 publication Critical patent/ATE456681T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Conductive Materials (AREA)
AT04009838T 2003-04-30 2004-04-26 Kupferlegierung ATE456681T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003124746A JP4360832B2 (ja) 2003-04-30 2003-04-30 銅合金

Publications (1)

Publication Number Publication Date
ATE456681T1 true ATE456681T1 (de) 2010-02-15

Family

ID=32985579

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04009838T ATE456681T1 (de) 2003-04-30 2004-04-26 Kupferlegierung

Country Status (5)

Country Link
US (1) US20040261913A1 (de)
EP (1) EP1473374B1 (de)
JP (1) JP4360832B2 (de)
AT (1) ATE456681T1 (de)
DE (1) DE602004025310D1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4571471B2 (ja) * 2004-09-30 2010-10-27 Ｄｏｗａホールディングス株式会社 銅合金およびその製造法ならびに放熱板
MX2010004255A (es) * 2007-10-24 2010-04-30 Heraeus Electro Nite Int Alambre de extension de termopares.
US20130280120A1 (en) * 2010-04-23 2013-10-24 United States Department Of Energy Hard and Super-hard Metal Alloys and Methods for Making the Same
JP5218621B2 (ja) * 2011-10-28 2013-06-26 日立金属株式会社 回路基板およびこれを用いた半導体モジュール
WO2014069318A1 (ja) 2012-11-01 2014-05-08 日本碍子株式会社 銅合金およびその製造方法
RU2566098C1 (ru) * 2014-12-22 2015-10-20 Юлия Алексеевна Щепочкина Сплав на основе меди
CN111534708B (zh) * 2020-04-23 2021-04-30 西安斯瑞先进铜合金科技有限公司 一种采用真空感应熔炼制备CuMn12Ni合金的方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2175223A (en) * 1938-07-01 1939-10-10 American Brass Co Copper alloy
GB536893A (en) * 1939-12-01 1941-05-30 American Brass Co Improvements in or relating to processes for producing copper base boron alloys, and oxygen-free copper base boron alloys of high electrical conductivity
US2809889A (en) * 1955-11-16 1957-10-15 Owens Illinois Glass Co Aluminum bronze alloy containing boron and nickel
US2854332A (en) * 1956-10-11 1958-09-30 Armour Res Found Copper base brazing alloys containing boron and iron
US3640779A (en) * 1969-09-30 1972-02-08 Olin Corp High-conductivity copper alloys
SU430176A1 (ru) * 1972-03-10 1974-05-30 Сплав на основе меди
SU544698A1 (ru) * 1975-05-07 1977-01-30 Государственный Научно-Исследовательский И Проектный Институт Сплавов И Обработки Цветных Металлов Сплав на основе меди
US4517157A (en) * 1984-10-11 1985-05-14 Gte Products Corporation Copper based brazing alloy
US4836982A (en) * 1984-10-19 1989-06-06 Martin Marietta Corporation Rapid solidification of metal-second phase composites
CH667880A5 (fr) * 1986-07-30 1988-11-15 Claude Planchamp Absorbeur de radiations nucleaires.
JPH08942B2 (ja) * 1986-12-19 1996-01-10 トヨタ自動車株式会社 分散強化Ｃｕ基合金
DE3725950A1 (de) * 1987-08-05 1989-02-16 Kabel Metallwerke Ghh Verwendung einer kupferlegierung als werkstoff fuer stranggiesskokillen
US5435828A (en) * 1993-12-21 1995-07-25 United Technologies Corporation Cobalt-boride dispersion-strengthened copper
JPH0827531A (ja) * 1994-07-14 1996-01-30 Sumitomo Electric Ind Ltd 銅合金導体およびその製造方法
JPH08174272A (ja) * 1994-12-21 1996-07-09 Mitsui Mining & Smelting Co Ltd 硬化肉盛用銅基合金粉末
JPH10158766A (ja) * 1996-11-29 1998-06-16 Miyoshi Gokin Kogyo Kk 耐熱・耐摩耗性銅合金

Also Published As

Publication number Publication date
JP2004331993A (ja) 2004-11-25
DE602004025310D1 (de) 2010-03-18
EP1473374B1 (de) 2010-01-27
EP1473374A1 (de) 2004-11-03
US20040261913A1 (en) 2004-12-30
JP4360832B2 (ja) 2009-11-11

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Legal Events

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