ATE435589T1 - Verfahren und system zur erzeugung feiner linien unter verwendung von inkjet-technologie - Google Patents

Verfahren und system zur erzeugung feiner linien unter verwendung von inkjet-technologie

Info

Publication number
ATE435589T1
ATE435589T1 AT04770463T AT04770463T ATE435589T1 AT E435589 T1 ATE435589 T1 AT E435589T1 AT 04770463 T AT04770463 T AT 04770463T AT 04770463 T AT04770463 T AT 04770463T AT E435589 T1 ATE435589 T1 AT E435589T1
Authority
AT
Austria
Prior art keywords
pattern
geometry
nozzle
intermediate portion
fine lines
Prior art date
Application number
AT04770463T
Other languages
English (en)
Inventor
Eli Vronsky
Original Assignee
Pixdro Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pixdro Ltd filed Critical Pixdro Ltd
Application granted granted Critical
Publication of ATE435589T1 publication Critical patent/ATE435589T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0015—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
    • B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
    • B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/0009—Obliterating the printed matter; Non-destructive removal of the ink pattern, e.g. for repetitive use of the support
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/162—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using laser ablation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Coating Apparatus (AREA)
  • Inorganic Insulating Materials (AREA)
  • Optical Filters (AREA)
AT04770463T 2003-09-02 2004-09-02 Verfahren und system zur erzeugung feiner linien unter verwendung von inkjet-technologie ATE435589T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49909903P 2003-09-02 2003-09-02
PCT/IL2004/000792 WO2005022969A2 (en) 2003-09-02 2004-09-02 Method and system for creating fine lines using ink jet technology

Publications (1)

Publication Number Publication Date
ATE435589T1 true ATE435589T1 (de) 2009-07-15

Family

ID=34272774

Family Applications (2)

Application Number Title Priority Date Filing Date
AT04770463T ATE435589T1 (de) 2003-09-02 2004-09-02 Verfahren und system zur erzeugung feiner linien unter verwendung von inkjet-technologie
AT09159282T ATE472241T1 (de) 2003-09-02 2004-09-02 System zur schaffung feiner linien mittels tintenstrahltechnologie

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT09159282T ATE472241T1 (de) 2003-09-02 2004-09-02 System zur schaffung feiner linien mittels tintenstrahltechnologie

Country Status (8)

Country Link
US (1) US20070014974A1 (de)
EP (2) EP1665913B1 (de)
JP (1) JP4796964B2 (de)
KR (1) KR101076116B1 (de)
AT (2) ATE435589T1 (de)
DE (2) DE602004027852D1 (de)
ES (2) ES2347851T3 (de)
WO (1) WO2005022969A2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0400982D0 (en) * 2004-01-16 2004-02-18 Fujifilm Electronic Imaging Method of forming a pattern on a substrate
TWI294529B (en) * 2004-12-22 2008-03-11 Ind Tech Res Inst Method of forming micro pattern
US8031931B2 (en) * 2006-04-24 2011-10-04 Applied Materials South East Asia Pte. Ltd. Printed fourier filtering in optical inspection tools
TWI345802B (en) * 2006-10-25 2011-07-21 Ind Tech Res Inst Methods for repairing patterned structure of electronic devices
KR100854124B1 (ko) * 2007-07-23 2008-08-26 삼성전기주식회사 미세 회로패턴 형성방법
WO2009044219A1 (en) * 2007-10-02 2009-04-09 Pixdro Ltd. Method and system for making a line of required length using ink jet
US8288074B2 (en) 2008-07-18 2012-10-16 Rainbow Technology Systems Limited Photoimaging method and apparatus
WO2010007405A1 (en) * 2008-07-18 2010-01-21 Rainbow Technology Systems Limited Method for photoimaging a substrate
EP2330875A1 (de) * 2009-07-15 2011-06-08 Stichting Dutch Polymer Institute Verfahren zur Erzeugung von photonisch bearbeiteten Druckstrukturen auf Oberflächen, Vorrichtung und Verwendung dafür
KR101257156B1 (ko) * 2010-11-11 2013-04-22 한양대학교 에리카산학협력단 레이저 기반의 고해상도 잉크젯 패턴 형성 방법 및 그에 의한 기판 제조물
WO2013174651A1 (en) * 2012-05-23 2013-11-28 Oce-Technologies B.V. Printing method for printing a functional pattern and a printing apparatus
KR101374072B1 (ko) * 2012-10-23 2014-03-13 한국생산기술연구원 잉크방울의 낙하 위치제어를 통한 인쇄패턴 형성방법
WO2014139568A1 (en) * 2013-03-13 2014-09-18 Micronic Mydata AB Method and device for jetting droplets
JP2017501044A (ja) 2013-10-14 2017-01-12 コーニング インコーポレイテッド 基体上に装飾を印刷する方法
JP6442835B2 (ja) * 2014-02-27 2018-12-26 セイコーエプソン株式会社 記録装置
WO2015183243A1 (en) 2014-05-27 2015-12-03 Rolith, Inc. Anti-counterfeiting features and methods of fabrication and detection
US9796191B2 (en) 2015-03-20 2017-10-24 Corning Incorporated Method of inkjet printing decorations on substrates
CN112970337B (zh) 2019-02-14 2022-05-24 奥宝科技有限公司 用于制备具有高度密集导体的pcb产品的方法及设备

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK648187D0 (da) * 1987-12-09 1987-12-09 Linkease Test Systems A S Fremgangsmaade og apparat til fremstilling af kredsloebsdel
JPH06179285A (ja) * 1992-12-15 1994-06-28 Matsushita Electric Works Ltd 印刷方法
JPH09318811A (ja) * 1996-03-26 1997-12-12 Kansai Paint Co Ltd 着色パターンの形成方法
JPH09312462A (ja) * 1996-05-21 1997-12-02 Kanegafuchi Chem Ind Co Ltd 電気回路の形成方法
JP4003273B2 (ja) * 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
JP3169926B2 (ja) * 1998-02-13 2001-05-28 キヤノン株式会社 電子源の製造方法
JPH11248928A (ja) * 1998-03-05 1999-09-17 Canon Inc カラーフィルターの製造方法
GB2350321A (en) * 1999-05-27 2000-11-29 Patterning Technologies Ltd Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition
JP2001010030A (ja) * 1999-06-28 2001-01-16 Canon Inc インクジェット記録装置およびインクジェット記録方法
US6565185B1 (en) * 1999-09-29 2003-05-20 Seiko Epson Corporation Nozzle testing before and after nozzle cleaning
WO2002003322A1 (de) 2000-07-03 2002-01-10 Isa Conductive Microsystems Gmbh Verfahren zum herstellen eines kartenförmigen datenträgers und vorrichtung zur durchführung des verfahrens
US20020108860A1 (en) 2001-01-15 2002-08-15 Staats Sau Lan Tang Fabrication of polymeric microfluidic devices
JP3854889B2 (ja) * 2001-04-19 2006-12-06 キヤノン株式会社 金属または金属化合物パターンの製造方法および電子源の製造方法
WO2003004280A2 (en) * 2001-07-05 2003-01-16 Creo Srl Improved uniformity ink jet system
GB2379083A (en) * 2001-08-20 2003-02-26 Seiko Epson Corp Inkjet printing on a substrate using two immiscible liquids
GB2379414A (en) * 2001-09-10 2003-03-12 Seiko Epson Corp Method of forming a large flexible electronic display on a substrate using an inkjet head(s) disposed about a vacuum roller holding the substrate
JP2003133691A (ja) * 2001-10-22 2003-05-09 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体
JP2003152313A (ja) * 2001-11-12 2003-05-23 Murata Mfg Co Ltd レジスト形成方法
GB2382798A (en) * 2001-12-04 2003-06-11 Qinetiq Ltd Inkjet printer which deposits at least two fluids on a substrate such that the fluids react chemically to form a product thereon
JP3800125B2 (ja) * 2002-04-18 2006-07-26 セイコーエプソン株式会社 電気光学パネル、電子機器及び電気光学パネルの製造方法
US7078276B1 (en) * 2003-01-08 2006-07-18 Kovio, Inc. Nanoparticles and method for making the same
US7405033B2 (en) * 2003-01-17 2008-07-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing resist pattern and method for manufacturing semiconductor device
US20050014005A1 (en) * 2003-07-18 2005-01-20 Laura Kramer Ink-jettable reactive polymer systems for free-form fabrication of solid three-dimensional objects
US6942308B2 (en) * 2003-10-10 2005-09-13 Hewlett-Packard Development Company, L.P. Compensation of lateral position changes in printing
US7141103B2 (en) * 2004-06-22 2006-11-28 Pitney Bowes Inc. Photosensitive optically variable ink compositions useful for ink jet printing

Also Published As

Publication number Publication date
ES2329137T3 (es) 2009-11-23
KR20070017464A (ko) 2007-02-12
KR101076116B1 (ko) 2011-10-21
EP2109350A1 (de) 2009-10-14
DE602004027852D1 (de) 2010-08-05
ATE472241T1 (de) 2010-07-15
JP2007504661A (ja) 2007-03-01
US20070014974A1 (en) 2007-01-18
EP2109350B1 (de) 2010-06-23
EP1665913B1 (de) 2009-07-01
WO2005022969A3 (en) 2005-06-30
EP1665913A2 (de) 2006-06-07
WO2005022969A2 (en) 2005-03-10
JP4796964B2 (ja) 2011-10-19
DE602004021823D1 (de) 2009-08-13
ES2347851T3 (es) 2010-11-04

Similar Documents

Publication Publication Date Title
ATE435589T1 (de) Verfahren und system zur erzeugung feiner linien unter verwendung von inkjet-technologie
DE50104541D1 (de) Verfahren und Vorrichtung zur Herstellung einer Druckform
ATE282527T1 (de) Verfahren und vorrichtund zur herstellung einer druckform
DE60031694D1 (de) Verfahren und vorrichtung zum uv tintenstrahledrucken und kombinierten drucken und steppen
ATE220005T1 (de) Verfahren zur herstellung eines tintenstrahlkopfes, mit diesem verfahren hergestellter tintenstrahldruckkopf und tintenstrahlvorrichtung mit diesem druckkopf
ATE197741T1 (de) Verfahren zur herstellung von flüssigkeitsstrahlaufzeichnungskopf
DE3877480D1 (de) Verfahren zur herstellung von duesen fuer tintenstrahldrucker.
ATE382485T1 (de) Sicherheitsdokumente oder -anordnungen und verfahren zur herstellung einer optischen beugungsstruktur in sicherheitsdokumenten oder - anordnungen
ATE318716T1 (de) Herstellungsverfahren von tintenstrahlaufzeichnungsmedien
DE69628348D1 (de) Verfahren und Vorrichtung zur Datenveränderung und Systemsteuerung bei einer Modelliervorrichtung durch selektive Materialablagerung
EP0930641A3 (de) Verfahren zum Bilden von Mustern und Vorrichtung zum Herstellen von Substraten
EP0869005A3 (de) Tintenstrahldrucker-Düsenplatten mit verbesserter Tintenflussgestaltung
DE69406731T2 (de) Aufzeichnungselement, Tintenstrahlaufzeichnungsverfahren unter Verwendung desselben, so erhaltener Druck und Dispersion und Verfahren zur Herstellung des Aufzeichnungselementes unter Verwendung der Dispersion
ATE539888T1 (de) Industrielles mikroauftragesystem mit auftrageverteilung zur verminderung der auswirkung von tröpfchenausrichtungstoleranzen und -fehlern sowie tröpfchenvolumentoleranzen und fehlern
ATE147014T1 (de) Herstellungsverfahren eines tintenstrahldruckkopfes
UA80979C2 (en) Method and device for producing a stamp
ATE457873T1 (de) Verfahren zur herstellung einer siliciumdüsenplatte und verfahren zur herstellung eines tintenstrahlkopfs
DK0539678T3 (da) Registreringsmaterialer til en ink jet fremgangsmåde
ATE486722T1 (de) Verfahren zur herstellung einer düsenplatte und verfahren zur herstellung eines flüssigkeitstropfenstrahlgeräts
CN107803982A (zh) 一种具有悬空结构的3d物体的打印方法及装置
DE69707039T2 (de) Vorrichtung zur Herstellung von Stempeln
ATE275481T1 (de) Tintenstrahlaufzeichnungsmaterial und verfahren zur herstellung
DE59901261D1 (de) Verfahren und vorrichtung zur herstellung von dünnschichtstrukturen
ATE249925T1 (de) Verfahren zur herstellung einer druckform und druckverfahren unter verwendung der druckform

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties