JP2007504661A - インクジェット技術を利用した細線形成方法およびシステム - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 97
- 238000005516 engineering process Methods 0.000 title description 18
- 239000000463 material Substances 0.000 claims abstract description 97
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000005406 washing Methods 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims description 20
- 238000007641 inkjet printing Methods 0.000 claims description 19
- 230000003287 optical effect Effects 0.000 claims description 9
- 238000002679 ablation Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 238000012937 correction Methods 0.000 claims description 2
- 230000002950 deficient Effects 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims 1
- 239000013589 supplement Substances 0.000 claims 1
- 239000000976 ink Substances 0.000 description 48
- 230000015572 biosynthetic process Effects 0.000 description 26
- 238000006243 chemical reaction Methods 0.000 description 16
- 238000001459 lithography Methods 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000007639 printing Methods 0.000 description 10
- 230000007547 defect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000011532 electronic conductor Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
Description
・感光性材料の大部分が硬化後に洗い流される、
・各パターンごとにマスクが必要であり、事前に準備しなければならない、
という二つの理由により高価である。
材料の連続した液滴を前記基板上に滴下し、その境界内に前記形状がおさまるような十分な寸法のパターンを形成する工程と、
前記形状を画定する前記パターンの内側部分を囲む、前記パターンの余剰領域を除去する工程とを含む。
図3aおよび3bに示されるように、少なくとも一つのノズルを含むインクジェットヘッドにより感光硬化性材料を線状に付着させる。感光硬化性材料は、吐出しやすく十分に基板上に広がるように適当な粘度および表面張力を有するよう、事前に調製される。
インクジェット印刷の主要な問題点の一つは、ノズルの信頼性である。ノズルの信頼性の問題はいくつかの形態がある。
・重度の故障(ノズルが恒常的に使用不可)
・誤った方向性
・過小な液滴量
非常に細い線に欠陥があると、その線が機能しなくなる可能性がある。オフセット印刷加工に使用される前述のカラーフィルタの場合、ブラックマトリクスセルに少しでも欠陥が有ると、隣接するセルの二つの異なる色が混ざり、それによってフィルタリングされる画素を不良にすることになる。
図8a〜図8dは、第一の方法によって反応性材料の平行線間の反応領域に線を形成する一連の工程を示す実体図である。この方法では、第一材料で第一の線50が印刷され、それに平行な第二の線51が第二材料で、第一の線と重複して重複領域52を形成するように印刷される。第一および第二の線は、互いに接触したときに化学的または物理的反応をおこして接触部分で線を硬化するが(エポキシ接着剤のように)、2つの線が重複しない領域では何も影響を及ぼさないような材料で形成される。前記反応は従って前記重複領域52のみに限定され、硬化されない残りの部分は一定の時間の後に洗い流される(過剰硬化を防止するため)。
この方法はカラーフィルタのみに適用され、多様な形状を形成するための前記の方法の一つと組み合わせて使用してもよい。この方法は三原色(RGB)インクを使用して、色と色とを分離するために使用されるブラックマトリクスを形成する。その作製方法は、図8を参照して記載された前述の方法と同様である。
まずおおまかな線または形状をインクジェット法で形成し、その後レーザーで精密な形状に調整するという、図3a〜図3bを参照して記載した前記の原理を、インクの一部を除去するためにレーザービームを使用する場合にも適用することができる。
本発明は特に細線形成に関して記載されているが、本発明の原理はいかなる幾何学的形状にも適用可能であると理解されるべきである。たとえば、回路パッドおよび導電性配線を画定するアートワーク(artwork)を使用してプリント回路基板を製造することが知られており、このアートワークは通常プリント回路基板の活性層を露光する際に使用されるマスクとして使用されるが、本発明はこのアートワークが直接プリント回路基板に描画されるようにし、マスクを不要とする。かかる方法において、活性層(通常は銅)にまず感光硬化性材料が塗布され、その露光部分が硬化する。未硬化材料が洗い流されて活性銅層の不要な領域がすべて露出されエッチングされるが、保全すべき活性銅層の領域は影響を受けない。かかる方法において、活性層の大部分が廃棄される。
Claims (25)
- 基板上に所望の寸法の形状(24、35)を形成する方法であって、
材料の一連の液滴(43)を前記基板上に滴下して、その境界内に前記形状がおさまるような十分な寸法のパターン(22、32)を形成する工程と、
前記形状を画定する前記パターンの内側部分を囲む、前記パターンの余剰領域を除去する工程と、を含むことを特徴とする方法。 - 前記パターンの前記余剰領域は、前記形状を画定する前記パターンの領域を硬化し、未硬化材料をすべて除去することにより除去される、請求項1に記載の方法。
- 前記形状はレーザービームを使用して硬化される、請求項2に記載の方法。
- 前記液滴は、基板上に配置された直後に硬化される、請求項2または3に記載の方法。
- 前記液滴は、前記インクパターンが完全に形成された後に硬化される、請求項2または3に記載の方法。
- 前記パターンの余剰領域は、前記形状(75)を囲む、前記パターンの少なくとも一つの余剰領域(71、72、73、74)をアブレーションすることにより除去される、請求項1に記載の方法。
- レーザーを使用して、制御された高精度のアブレーションを行う、請求項6に記載の方法。
- 前記形状を画定する前記パターンの領域を硬化する工程をさらに含む、請求項6または7に記載の方法。
- 前記液滴を監視し、液滴の欠落または形成不良を補正する工程をさらに含む、前記の請求項のいずれかに記載の方法。
- 前記補正は一つ以上の補助インクジェットプリンターヘッドにより行われる、請求項9に記載の方法。
- 液滴の欠落または形成不良の可能性を低減するために前記液滴のいくつかを重ね合わせて形成する工程をさらに含む、請求項1〜8のいずれかに記載の方法。
- 前記重ね合わせは一つ以上の補助インクジェットプリンターヘッドにより行われる、請求項11に記載の方法。
- 前記材料はインクである、請求項1〜12のいずれかに記載の方法。
- 前記材料は、各々がその境界内に一つ以上の線をおさめるのに十分である前記基板の別個の領域のみに付与される、請求項1〜13のいずれかに記載の方法。
- 前記材料は感光硬化性材料である、請求項1〜13のいずれかに記載の方法。
- マスクを介して前記感光硬化性材料を露光し、前記形状に対応して前記材料を硬化する工程をさらに含む、請求項15に記載の方法。
- 前記感光硬化性材料(32)が基板(31)上の活性層(30)に付与され、前記方法はさらに、
マスクを介して前記感光硬化性材料を露光し、前記形状に対応して前記材料を硬化する工程と、
前記感光硬化性材料(32)の未硬化領域を洗い流して前記形状(34)を現出させる工程と、
前記活性層の、硬化した材料で被覆されていない領域をエッチングする工程と、
前記硬化した材料で形成されたパターンを除去する工程とを含む、請求項15に記載の方法。 - 前記感光硬化性材料は、各々がその境界内に一つ以上の形状をおさめるのに十分である前記基板上の前記活性層の別個の領域のみに付与される、請求項16または17に記載の方法。
- 第一材料で第一形状(50)をインクジェット印刷する工程と、
前記第一材料と接触する部分では硬化し重複しない部分には影響がおよばないような、前記第一材料と接触による反応をおこす第二材料で、前記第一形状と重複して重複領域(52)を形成するように、ほぼ平行な第二形状(51)をインクジェット印刷する工程と、
硬化しなかった前記第一および第二材料を洗い流す工程とを含む、請求項1〜16のいずれかに記載の方法。 - ほぼ平行で非接触な第一形状(60)および第二形状(61)を、前記基板から洗い流せる第一材料を使用してインクジェット印刷する工程と、
前記第一および第二の線(60、61)の間の隙間(63)を被覆し、前記第一および第二の線に重複し、ほぼ平行な第三形状(62)を、第二材料を使用してインクジェット印刷する工程と、
前記第一および第二形状(60、61)の間の前記隙間(63)で前記第二材料を硬化して前記基板に接着させる工程と、
前記基板を洗浄して、前記第一および第二形状(60、61)を、それらと重複する第三形状(62)の部分とともに洗い流す工程とを含む、請求項1〜16のいずれかに記載の方法。 - 第一材料を第一領域にインクジェット印刷して第一原色を形成する工程と、
前記第一原色に重複して重複領域を形成するように、第二材料を第二領域にインクジェット印刷して第二原色を形成する工程とを含む方法であって、
前記第一および第二材料は接触により反応し黒色を呈する、請求項1〜15のいずれかに記載の方法。 - 基板上に所望の幅の細線を形成する方法であって、
アブレーション可能な材料の一連の液滴を前記基板上に滴下して、その境界内に前記所望の幅の線(75)がおさまるような十分な寸法のパターン(70)を形成する工程と、
前記線を囲む、前記パターンの少なくとも一つの余剰領域(71、72、73、74)をアブレーションする工程とを含むことを特徴とする方法。 - 第一ノズル(41)と、
前記第一ノズル(41)の下流側に設置され、前記第一ノズルがインクジェット材料からなる第一液滴(43)を適切に配置したかどうかを検出する光学検出器(42)と、
前記光学検出器(42)の下流側に設置された補助ノズル(44)と、
前記光学検出器(42)と前記補助ノズル(44)とに接続され、前記第一ノズルがインクジェット材料からなる液滴を適切に配置しなかったことを検出した前記光学検出器(42)に応答して前記第二ノズルが前記第一液滴(43)の代わりとなるかまたはそれを補完する第二液滴(46)を吐出するよう制御する制御器(45)と、
前記第二ノズル(44)の下流側に設置され、一連の液滴の境界内に形成されるパターンを硬化または乾燥させるレーザー(47)とを備えたことを特徴とする、インクジェット印刷システム(40、50)。 - 前記光学検出器(42)は、前記第一ノズル(41)またはそれにより形成される液滴(43)の経路を監視し、実際の液滴を「オン・ザ・フライ(on the fly)」で検出するように構成されている、請求項23に記載のインクジェット印刷システム。
- 前記光学検出器(42)は前記基板に印刷されたドットを監視するように構成されている、請求項23に記載のインクジェット印刷システム。
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ATE472241T1 (de) | 2010-07-15 |
EP1665913A2 (en) | 2006-06-07 |
JP4796964B2 (ja) | 2011-10-19 |
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DE602004027852D1 (de) | 2010-08-05 |
US20070014974A1 (en) | 2007-01-18 |
ES2347851T3 (es) | 2010-11-04 |
WO2005022969A2 (en) | 2005-03-10 |
EP1665913B1 (en) | 2009-07-01 |
WO2005022969A3 (en) | 2005-06-30 |
ES2329137T3 (es) | 2009-11-23 |
EP2109350B1 (en) | 2010-06-23 |
ATE435589T1 (de) | 2009-07-15 |
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