ATE431388T1 - Bor enthaltendes poliersystem und dessen verfahren - Google Patents

Bor enthaltendes poliersystem und dessen verfahren

Info

Publication number
ATE431388T1
ATE431388T1 AT02776164T AT02776164T ATE431388T1 AT E431388 T1 ATE431388 T1 AT E431388T1 AT 02776164 T AT02776164 T AT 02776164T AT 02776164 T AT02776164 T AT 02776164T AT E431388 T1 ATE431388 T1 AT E431388T1
Authority
AT
Austria
Prior art keywords
polishing system
boric acid
boron containing
containing polishing
chemical
Prior art date
Application number
AT02776164T
Other languages
English (en)
Inventor
Renjie Zhou
Steven Grumbine
Isaac Cherian
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE431388T1 publication Critical patent/ATE431388T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1051—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina by folding
AT02776164T 2001-10-24 2002-09-24 Bor enthaltendes poliersystem und dessen verfahren ATE431388T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/033,152 US6705926B2 (en) 2001-10-24 2001-10-24 Boron-containing polishing system and method
PCT/US2002/031945 WO2003035782A1 (en) 2001-10-24 2002-09-24 Boron-containing polishing system and method

Publications (1)

Publication Number Publication Date
ATE431388T1 true ATE431388T1 (de) 2009-05-15

Family

ID=21868825

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02776164T ATE431388T1 (de) 2001-10-24 2002-09-24 Bor enthaltendes poliersystem und dessen verfahren

Country Status (8)

Country Link
US (2) US6705926B2 (de)
EP (1) EP1448736B1 (de)
JP (1) JP2005507165A (de)
CN (1) CN100425666C (de)
AT (1) ATE431388T1 (de)
DE (1) DE60232356D1 (de)
TW (1) TWI232234B (de)
WO (1) WO2003035782A1 (de)

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US9416338B2 (en) * 2010-10-13 2016-08-16 Advanced Technology Materials, Inc. Composition for and method of suppressing titanium nitride corrosion
US8546617B1 (en) 2012-03-23 2013-10-01 Empire Technology Development Llc Dioxaborinanes and uses thereof
IN2015DN00805A (de) * 2012-07-31 2015-07-03 Empire Technology Dev Llc
US9073177B2 (en) * 2012-07-31 2015-07-07 Saint-Gobain Abrasives, Inc. Abrasive article comprising abrasive particles of a composite composition
US9120938B2 (en) 2012-07-31 2015-09-01 Empire Technology Development Llc Polymerizable organoboron alkyd resin anti fouling coatings
CN105209556B (zh) * 2013-03-15 2017-11-14 英派尔科技开发有限公司 含硼化合物和其用途
CN103497128B (zh) * 2013-09-04 2016-06-08 常州大学 一种合成对称二芳基二硫醚的方法
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Also Published As

Publication number Publication date
US20040180612A1 (en) 2004-09-16
CN1575325A (zh) 2005-02-02
US6705926B2 (en) 2004-03-16
JP2005507165A (ja) 2005-03-10
TWI232234B (en) 2005-05-11
CN100425666C (zh) 2008-10-15
US20030077985A1 (en) 2003-04-24
US7001253B2 (en) 2006-02-21
EP1448736A1 (de) 2004-08-25
WO2003035782A1 (en) 2003-05-01
DE60232356D1 (de) 2009-06-25
EP1448736B1 (de) 2009-05-13

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