DE60232356D1 - - Google Patents

Info

Publication number
DE60232356D1
DE60232356D1 DE60232356T DE60232356T DE60232356D1 DE 60232356 D1 DE60232356 D1 DE 60232356D1 DE 60232356 T DE60232356 T DE 60232356T DE 60232356 T DE60232356 T DE 60232356T DE 60232356 D1 DE60232356 D1 DE 60232356D1
Authority
DE
Germany
Prior art keywords
boric acid
polishing system
chemical
conjugate base
mechanical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60232356T
Other languages
English (en)
Inventor
Renjie Zhou
Steven K Grumbine
Isaac K Cherian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of DE60232356D1 publication Critical patent/DE60232356D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1051—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina by folding

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE60232356T 2001-10-24 2002-09-24 Expired - Lifetime DE60232356D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/033,152 US6705926B2 (en) 2001-10-24 2001-10-24 Boron-containing polishing system and method
PCT/US2002/031945 WO2003035782A1 (en) 2001-10-24 2002-09-24 Boron-containing polishing system and method

Publications (1)

Publication Number Publication Date
DE60232356D1 true DE60232356D1 (de) 2009-06-25

Family

ID=21868825

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60232356T Expired - Lifetime DE60232356D1 (de) 2001-10-24 2002-09-24

Country Status (8)

Country Link
US (2) US6705926B2 (de)
EP (1) EP1448736B1 (de)
JP (1) JP2005507165A (de)
CN (1) CN100425666C (de)
AT (1) ATE431388T1 (de)
DE (1) DE60232356D1 (de)
TW (1) TWI232234B (de)
WO (1) WO2003035782A1 (de)

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US7220166B2 (en) * 2000-08-30 2007-05-22 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US7129160B2 (en) * 2002-08-29 2006-10-31 Micron Technology, Inc. Method for simultaneously removing multiple conductive materials from microelectronic substrates
US7192335B2 (en) * 2002-08-29 2007-03-20 Micron Technology, Inc. Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
US7078308B2 (en) 2002-08-29 2006-07-18 Micron Technology, Inc. Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
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US7077880B2 (en) * 2004-01-16 2006-07-18 Dupont Air Products Nanomaterials Llc Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
US7316603B2 (en) * 2002-01-22 2008-01-08 Cabot Microelectronics Corporation Compositions and methods for tantalum CMP
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US7018560B2 (en) * 2003-08-05 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composition for polishing semiconductor layers
US7112122B2 (en) * 2003-09-17 2006-09-26 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US7419911B2 (en) * 2003-11-10 2008-09-02 Ekc Technology, Inc. Compositions and methods for rapidly removing overfilled substrates
US7153777B2 (en) * 2004-02-20 2006-12-26 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
US7253111B2 (en) * 2004-04-21 2007-08-07 Rohm And Haas Electronic Materials Cmp Holding, Inc. Barrier polishing solution
US7566391B2 (en) 2004-09-01 2009-07-28 Micron Technology, Inc. Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
US20060110923A1 (en) * 2004-11-24 2006-05-25 Zhendong Liu Barrier polishing solution
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US7678702B2 (en) * 2005-08-31 2010-03-16 Air Products And Chemicals, Inc. CMP composition of boron surface-modified abrasive and nitro-substituted sulfonic acid and method of use
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US20070075042A1 (en) * 2005-10-05 2007-04-05 Siddiqui Junaid A Stabilizer-Fenton's reaction metal-vinyl pyridine polymer-surface-modified chemical mechanical planarization composition and associated method
US20070218692A1 (en) * 2006-01-31 2007-09-20 Nissan Chemical Industries, Ltd. Copper-based metal polishing compositions and polishing processes
JP5529736B2 (ja) * 2007-07-26 2014-06-25 キャボット マイクロエレクトロニクス コーポレイション 相変化材料を化学的機械的に研磨するための組成物及び方法
US7915071B2 (en) * 2007-08-30 2011-03-29 Dupont Air Products Nanomaterials, Llc Method for chemical mechanical planarization of chalcogenide materials
US20090124173A1 (en) * 2007-11-09 2009-05-14 Cabot Microelectronics Corporation Compositions and methods for ruthenium and tantalum barrier cmp
CA2796759C (en) * 2010-04-19 2022-10-04 The University Of Toledo Aldose-ketose transformation for separation and/or chemical conversion of c6 and c5 sugars from biomass materials
RU2589482C2 (ru) * 2010-10-07 2016-07-10 Басф Се Водная полирующая композиция и способ химико-механического полирования подложек, имеющих структурированные или неструктурированные диэлектрические слои с низкой диэлектрической постоянной
TWI502065B (zh) * 2010-10-13 2015-10-01 Entegris Inc 抑制氮化鈦腐蝕之組成物及方法
US8546617B1 (en) 2012-03-23 2013-10-01 Empire Technology Development Llc Dioxaborinanes and uses thereof
US9073177B2 (en) * 2012-07-31 2015-07-07 Saint-Gobain Abrasives, Inc. Abrasive article comprising abrasive particles of a composite composition
IN2015DN00805A (de) * 2012-07-31 2015-07-03 Empire Technology Dev Llc
US9120938B2 (en) 2012-07-31 2015-09-01 Empire Technology Development Llc Polymerizable organoboron alkyd resin anti fouling coatings
WO2014143037A1 (en) * 2013-03-15 2014-09-18 William Brenden Carlson Boron containing compounds and uses thereof
CN103497128B (zh) * 2013-09-04 2016-06-08 常州大学 一种合成对称二芳基二硫醚的方法
US10414947B2 (en) * 2015-03-05 2019-09-17 Cabot Microelectronics Corporation Polishing composition containing ceria particles and method of use
JP6564624B2 (ja) * 2015-06-10 2019-08-21 株式会社ディスコ 研削砥石
CN113412324B (zh) 2018-12-03 2022-12-02 富士胶片电子材料美国有限公司 蚀刻组合物
CN109913133B (zh) * 2019-03-29 2020-09-29 大连理工大学 一种钇铝石榴石晶体的高效高质量化学机械抛光液
US11499072B2 (en) 2019-08-30 2022-11-15 Saint-Gobain Ceramics & Plastics, Inc. Composition and method for conducting a material removing operation
CN114286846B (zh) 2019-08-30 2023-06-06 圣戈本陶瓷及塑料股份有限公司 用于进行材料去除操作的流体组合物及方法

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Also Published As

Publication number Publication date
US20040180612A1 (en) 2004-09-16
US7001253B2 (en) 2006-02-21
WO2003035782A1 (en) 2003-05-01
ATE431388T1 (de) 2009-05-15
EP1448736A1 (de) 2004-08-25
CN1575325A (zh) 2005-02-02
JP2005507165A (ja) 2005-03-10
CN100425666C (zh) 2008-10-15
US6705926B2 (en) 2004-03-16
US20030077985A1 (en) 2003-04-24
EP1448736B1 (de) 2009-05-13
TWI232234B (en) 2005-05-11

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Legal Events

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