ATE428566T1 - Materialstrahlsystem - Google Patents

Materialstrahlsystem

Info

Publication number
ATE428566T1
ATE428566T1 AT06843926T AT06843926T ATE428566T1 AT E428566 T1 ATE428566 T1 AT E428566T1 AT 06843926 T AT06843926 T AT 06843926T AT 06843926 T AT06843926 T AT 06843926T AT E428566 T1 ATE428566 T1 AT E428566T1
Authority
AT
Austria
Prior art keywords
jet
molten
waste reservoir
container
contaminations
Prior art date
Application number
AT06843926T
Other languages
English (en)
Inventor
Rene Jos Houben
Original Assignee
Tno
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tno filed Critical Tno
Application granted granted Critical
Publication of ATE428566T1 publication Critical patent/ATE428566T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17593—Supplying ink in a solid state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/22—Direct deposition of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/115—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by spraying molten metal, i.e. spray sintering, spray casting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Coating Apparatus (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)
  • Processing Of Solid Wastes (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AT06843926T 2005-12-27 2006-12-27 Materialstrahlsystem ATE428566T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05078008A EP1803567A1 (de) 2005-12-27 2005-12-27 Materialstrahlsystem
PCT/NL2006/000669 WO2007075084A1 (en) 2005-12-27 2006-12-27 Material jet system

Publications (1)

Publication Number Publication Date
ATE428566T1 true ATE428566T1 (de) 2009-05-15

Family

ID=36588850

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06843926T ATE428566T1 (de) 2005-12-27 2006-12-27 Materialstrahlsystem

Country Status (7)

Country Link
US (1) US8523331B2 (de)
EP (2) EP1803567A1 (de)
JP (1) JP5254034B2 (de)
AT (1) ATE428566T1 (de)
DE (1) DE602006006350D1 (de)
ES (1) ES2325968T3 (de)
WO (1) WO2007075084A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1803567A1 (de) * 2005-12-27 2007-07-04 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Materialstrahlsystem
JP5486795B2 (ja) * 2008-11-20 2014-05-07 ギガフォトン株式会社 極端紫外光源装置及びそのターゲット供給システム
US9205663B2 (en) 2014-03-26 2015-12-08 Palo Alto Research Center Incorporated Inkjet print heads with inductive heating
DE102015218375A1 (de) * 2015-09-24 2017-03-30 Robert Bosch Gmbh Druckkopf für den 3D-Druck von Metallen
US10315247B2 (en) 2015-09-24 2019-06-11 Markforged, Inc. Molten metal jetting for additive manufacturing
CN109070132A (zh) * 2016-03-03 2018-12-21 德仕托金属有限公司 用于增材制造的气动金属喷射
EP3244705B1 (de) 2016-05-11 2019-07-03 ETH Zürich Lichtquelle und verfahren zur erzeugung von uv- oder röntgenlicht
DE102016224047A1 (de) * 2016-12-02 2018-06-07 Robert Bosch Gmbh Druckkopf für den 3D-Druck von Metallen
US10000011B1 (en) 2016-12-02 2018-06-19 Markforged, Inc. Supports for sintering additively manufactured parts
US10800108B2 (en) 2016-12-02 2020-10-13 Markforged, Inc. Sinterable separation material in additive manufacturing
CA3040929C (en) 2016-12-02 2023-08-01 Markforged, Inc. Sintering additively manufactured parts with a densification linking platform
CA3040921C (en) 2016-12-06 2024-02-20 Markforged, Inc. Additive manufacturing with heat-flexed material feeding
DE102017204509A1 (de) * 2017-03-17 2018-09-20 Robert Bosch Gmbh Druckkopf für den 3D-Druck von Metallen
DE102017221178A1 (de) * 2017-11-27 2019-05-29 Robert Bosch Gmbh Druckkopf für einen 3D-Drucker
DE102017222162A1 (de) * 2017-12-07 2019-06-13 Robert Bosch Gmbh Vorrichtung zur additiven Fertigung von dreidimensionalen Werkstücken und Verfahren zum Betreiben einer Vorrichtung zur additiven Fertigung von dreidimensionalen Werkstücken
EP3814037A4 (de) 2018-06-26 2022-01-19 Markforged, Inc. Flexibles ausgangsmaterial
CN109676137A (zh) * 2019-01-28 2019-04-26 西安增材制造国家研究院有限公司 一种电阻感应复合加热金属丝材增材制造装置
DE102019202196A1 (de) * 2019-02-19 2020-08-20 Robert Bosch Gmbh Verfahren und Vorrichtung zur generativen Fertigung eines dreidimensionalen Werkstücks aus einem flüssigen Werkstoff
EP3819049B1 (de) 2019-11-05 2024-04-24 Markforged, Inc. Verfahren zur minimierung von spannungsbedingten verformungen in 3d-gedruckten und gesinterten teilen
US11654482B2 (en) * 2021-07-06 2023-05-23 Xerox Corporation Liquid metal ejector level sensing system and methods thereof
US20230150033A1 (en) * 2021-11-15 2023-05-18 Xerox Corporation Liquid metal ejector dual sensor system and methods thereof

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Publication number Priority date Publication date Assignee Title
CA1252670A (en) * 1984-10-15 1989-04-18 Thomas W. Deyoung Ink jet apparatus and method of operating the ink jet apparatus wherein phase change ink is supplied in solid-state form
US4682185A (en) * 1984-11-08 1987-07-21 Martner John G Ink jet method and apparatus utilizing a web of hot melt ink
JPS61190011A (ja) 1985-02-20 1986-08-23 Nippon Steel Corp 溶鉄中のＭｎ調整方法
JPS6328653A (ja) * 1986-07-23 1988-02-06 Seiko Epson Corp インクジエツト記録装置
JPS6395670A (ja) 1986-10-13 1988-04-26 Matsushita Electric Ind Co Ltd Ｍｏｓ型半導体装置
JPS6395670U (de) * 1986-12-10 1988-06-20
US5030972A (en) * 1988-04-22 1991-07-09 Seiko Epson Corporation Solid ink supply for ink jet
US5171360A (en) * 1990-08-30 1992-12-15 University Of Southern California Method for droplet stream manufacturing
JP3067078B2 (ja) 1994-07-22 2000-07-17 矢崎総業株式会社 樹脂材注入装置
US5598200A (en) * 1995-01-26 1997-01-28 Gore; David W. Method and apparatus for producing a discrete droplet of high temperature liquid
US5617911A (en) * 1995-09-08 1997-04-08 Aeroquip Corporation Method and apparatus for creating a free-form three-dimensional article using a layer-by-layer deposition of a support material and a deposition material
US5894980A (en) * 1995-09-25 1999-04-20 Rapid Analysis Development Comapny Jet soldering system and method
US5917528A (en) * 1996-09-05 1999-06-29 Tektronix, Inc. Solid ink stick supply apparatus and method
JP3597373B2 (ja) 1998-03-18 2004-12-08 東芝テック株式会社 インクジェットプリンタ
JP4142800B2 (ja) * 1999-04-07 2008-09-03 株式会社ルネサステクノロジ バンプ形成装置及びバンプ形成方法
US6401001B1 (en) * 1999-07-22 2002-06-04 Nanotek Instruments, Inc. Layer manufacturing using deposition of fused droplets
JP4592174B2 (ja) * 1999-11-15 2010-12-01 オセ−テクノロジーズ ビーブイ インクペレットディスペンサを有するインクジェット装置
JP4444484B2 (ja) * 1999-11-22 2010-03-31 オセ−テクノロジーズ・ベー・ヴエー プリンタにホットメルトインクを供給するための方法およびシステム
US6491737B2 (en) * 2000-05-22 2002-12-10 The Regents Of The University Of California High-speed fabrication of highly uniform ultra-small metallic microspheres
US7405416B2 (en) * 2005-02-25 2008-07-29 Cymer, Inc. Method and apparatus for EUV plasma source target delivery
US6902246B2 (en) 2001-10-03 2005-06-07 3D Systems, Inc. Quantized feed system for solid freeform fabrication
US6692094B1 (en) * 2002-07-23 2004-02-17 Eastman Kodak Company Apparatus and method of material deposition using compressed fluids
JP2004249572A (ja) 2003-02-20 2004-09-09 Sii Printek Inc 液位調整装置
US6902243B2 (en) * 2003-02-25 2005-06-07 Wieslaw Bober Modular sub-cabinet for motion furniture
JP2004304129A (ja) * 2003-04-01 2004-10-28 Seiko Epson Corp 液滴吐出法によるパターン形成方法、多層配線構造の形成方法
US20050151814A1 (en) * 2004-01-12 2005-07-14 Xerox Corporation Guide for solid ink stick feed
EP1803567A1 (de) * 2005-12-27 2007-07-04 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Materialstrahlsystem

Also Published As

Publication number Publication date
US8523331B2 (en) 2013-09-03
EP1803567A1 (de) 2007-07-04
EP1973742A1 (de) 2008-10-01
JP2009521327A (ja) 2009-06-04
DE602006006350D1 (de) 2009-05-28
EP1973742B8 (de) 2009-08-19
JP5254034B2 (ja) 2013-08-07
EP1973742B1 (de) 2009-04-15
ES2325968T3 (es) 2009-09-25
WO2007075084A1 (en) 2007-07-05
US20090219319A1 (en) 2009-09-03

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Legal Events

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