ATE424101T1 - Drehbares flüssigkeitsreservoir zur computer- kühlung - Google Patents

Drehbares flüssigkeitsreservoir zur computer- kühlung

Info

Publication number
ATE424101T1
ATE424101T1 AT06807190T AT06807190T ATE424101T1 AT E424101 T1 ATE424101 T1 AT E424101T1 AT 06807190 T AT06807190 T AT 06807190T AT 06807190 T AT06807190 T AT 06807190T AT E424101 T1 ATE424101 T1 AT E424101T1
Authority
AT
Austria
Prior art keywords
conduit
tank
flow
liquid
vortex
Prior art date
Application number
AT06807190T
Other languages
English (en)
Inventor
Eric Eckberg
James Gerken
Cary Huettner
Roger Schmidt
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of ATE424101T1 publication Critical patent/ATE424101T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Centrifugal Separators (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
AT06807190T 2005-10-13 2006-10-12 Drehbares flüssigkeitsreservoir zur computer- kühlung ATE424101T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/249,912 US7228888B2 (en) 2005-10-13 2005-10-13 Rotatable liquid reservoir for computer cooling

Publications (1)

Publication Number Publication Date
ATE424101T1 true ATE424101T1 (de) 2009-03-15

Family

ID=37905595

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06807190T ATE424101T1 (de) 2005-10-13 2006-10-12 Drehbares flüssigkeitsreservoir zur computer- kühlung

Country Status (8)

Country Link
US (1) US7228888B2 (de)
EP (1) EP1949776B1 (de)
JP (1) JP4521464B2 (de)
CN (1) CN101288355B (de)
AT (1) ATE424101T1 (de)
DE (1) DE602006005394D1 (de)
TW (1) TW200801912A (de)
WO (1) WO2007042549A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
US20070227698A1 (en) * 2006-03-30 2007-10-04 Conway Bruce R Integrated fluid pump and radiator reservoir
US8157001B2 (en) 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
CN104014148B (zh) * 2014-05-09 2016-05-11 江苏嘉泰蒸发结晶设备有限公司 分离器防漩涡装置
DE112015006353T5 (de) * 2015-03-25 2017-12-14 Mitsubishi Electric Corporation Kühlvorrichtung, leistungswandlervorrichtung und kühlsystem
US10729040B2 (en) * 2015-09-14 2020-07-28 Mitsubishi Electric Corporation Cooler, power conversion apparatus, and cooling system
US11032941B2 (en) * 2019-03-28 2021-06-08 Intel Corporation Modular thermal energy management designs for data center computing
US10925188B1 (en) * 2019-11-11 2021-02-16 Microsoft Technology Licensing, Llc Self-contained immersion cooling server assemblies
CN113155233B (zh) * 2021-04-20 2023-07-28 青岛沃克机械制造有限公司 一种称重式水位控制装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2640557A (en) * 1950-12-13 1953-06-02 Fuller Co Retroverted passage type muffler with outer conduit formed of sound absorbing material
FR2224875B1 (de) * 1973-04-03 1978-10-27 Thomson Csf
US4047561A (en) * 1974-10-18 1977-09-13 General Electric Company Cooling liquid de-gassing system
GB1591899A (en) * 1976-12-27 1981-07-01 Dresser Ind Degasser spray vessel
US4550799A (en) * 1983-02-22 1985-11-05 Wayne King Muffler for exhaust gases
USRE32092E (en) * 1984-07-27 1986-03-18 Liquid Modulators, Inc. Liquid modulator
JPH05136305A (ja) * 1991-11-08 1993-06-01 Hitachi Ltd 発熱体の冷却装置
JP2792304B2 (ja) * 1992-01-22 1998-09-03 日本電気株式会社 集積回路用冷却装置
EP0560478B1 (de) * 1992-02-10 1998-10-14 Nec Corporation Kühlvorrichtung für Bauteile mit elektronischen Schaltungen
JP3636118B2 (ja) * 2001-09-04 2005-04-06 株式会社日立製作所 電子装置用の水冷装置
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
JP2004289049A (ja) * 2003-03-25 2004-10-14 Seiko Instruments Inc 熱輸送装置及びこの装置を備えた携帯可能な電子機器
JP4157451B2 (ja) * 2003-09-30 2008-10-01 株式会社東芝 気液分離機構、リザーブタンク、及び電子機器
US6948556B1 (en) * 2003-11-12 2005-09-27 Anderson William G Hybrid loop cooling of high powered devices
JP2005229020A (ja) * 2004-02-16 2005-08-25 Hitachi Ltd 液冷システム及びそれを備えた電子機器
CN100405588C (zh) * 2004-03-16 2008-07-23 杨洪武 外侧导流集成热管散热器
JP2005285947A (ja) * 2004-03-29 2005-10-13 Toshiba Home Technology Corp 冷却装置
JP4056504B2 (ja) * 2004-08-18 2008-03-05 Ｎｅｃディスプレイソリューションズ株式会社 冷却装置及びこれを備えた電子機器
US20060060331A1 (en) * 2004-08-20 2006-03-23 Ari Glezer Apparatus and method for enhanced heat transfer
JP2006227306A (ja) * 2005-02-17 2006-08-31 Sony Corp 冷却液タンク及び投射型表示装置

Also Published As

Publication number Publication date
US7228888B2 (en) 2007-06-12
CN101288355A (zh) 2008-10-15
DE602006005394D1 (de) 2009-04-09
EP1949776B1 (de) 2009-02-25
JP2009512044A (ja) 2009-03-19
TW200801912A (en) 2008-01-01
WO2007042549A2 (en) 2007-04-19
CN101288355B (zh) 2012-08-22
WO2007042549A3 (en) 2007-07-12
EP1949776A2 (de) 2008-07-30
US20070084588A1 (en) 2007-04-19
JP4521464B2 (ja) 2010-08-11

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