ATE415646T1 - Methode und apparat für immersionslithographie - Google Patents

Methode und apparat für immersionslithographie

Info

Publication number
ATE415646T1
ATE415646T1 AT05447154T AT05447154T ATE415646T1 AT E415646 T1 ATE415646 T1 AT E415646T1 AT 05447154 T AT05447154 T AT 05447154T AT 05447154 T AT05447154 T AT 05447154T AT E415646 T1 ATE415646 T1 AT E415646T1
Authority
AT
Austria
Prior art keywords
immersion liquid
immersion
substrate
tensio
surface tension
Prior art date
Application number
AT05447154T
Other languages
English (en)
Inventor
Paul Mertens
Wim Fyen
Original Assignee
Imec Inter Uni Micro Electr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imec Inter Uni Micro Electr filed Critical Imec Inter Uni Micro Electr
Application granted granted Critical
Publication of ATE415646T1 publication Critical patent/ATE415646T1/de

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT05447154T 2004-07-01 2005-06-30 Methode und apparat für immersionslithographie ATE415646T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58454104P 2004-07-01 2004-07-01

Publications (1)

Publication Number Publication Date
ATE415646T1 true ATE415646T1 (de) 2008-12-15

Family

ID=34978684

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05447154T ATE415646T1 (de) 2004-07-01 2005-06-30 Methode und apparat für immersionslithographie

Country Status (5)

Country Link
US (1) US7224433B2 (de)
EP (1) EP1612609B1 (de)
JP (1) JP4809638B2 (de)
AT (1) ATE415646T1 (de)
DE (1) DE602005011204D1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040031167A1 (en) 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
US20060001851A1 (en) * 2004-07-01 2006-01-05 Grant Robert B Immersion photolithography system
US20070269724A1 (en) * 2006-05-17 2007-11-22 Micronic Laser Systems Ab Method and process for immersion exposure of a substrate
JP4368365B2 (ja) 2006-08-02 2009-11-18 Tdk株式会社 液浸露光用基板およびその製造方法、ならびに液浸露光方法
JP2009188241A (ja) * 2008-02-07 2009-08-20 Toshiba Corp 液浸露光装置及び液浸露光方法
NL2005666A (en) * 2009-12-18 2011-06-21 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
NL2007182A (en) 2010-08-23 2012-02-27 Asml Netherlands Bv Fluid handling structure, module for an immersion lithographic apparatus, lithographic apparatus and device manufacturing method.
CN107106938B (zh) 2014-12-19 2019-06-18 Asml荷兰有限公司 流体处理结构、光刻设备和器件制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04305915A (ja) * 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
US5660642A (en) * 1995-05-26 1997-08-26 The Regents Of The University Of California Moving zone Marangoni drying of wet objects using naturally evaporated solvent vapor
JP3747566B2 (ja) * 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
US7367345B1 (en) * 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US6788477B2 (en) * 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
EP1420298B1 (de) * 2002-11-12 2013-02-20 ASML Netherlands B.V. Lithographischer Apparat
EP1573730B1 (de) * 2002-12-13 2009-02-25 Koninklijke Philips Electronics N.V. Flüssigkeitsentfernung in einem verfahren und einer einrichtung zum bestrahlen von flecken auf einer schicht
US6867844B2 (en) * 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles

Also Published As

Publication number Publication date
US20060000381A1 (en) 2006-01-05
EP1612609A3 (de) 2006-05-10
EP1612609A2 (de) 2006-01-04
US7224433B2 (en) 2007-05-29
EP1612609B1 (de) 2008-11-26
JP4809638B2 (ja) 2011-11-09
DE602005011204D1 (de) 2009-01-08
JP2006019742A (ja) 2006-01-19

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties