ATE408149T1 - Verfahren zur kalibrierung und de-embedding, geräte für de-embedding und netzwerk- vektoranalysator - Google Patents

Verfahren zur kalibrierung und de-embedding, geräte für de-embedding und netzwerk- vektoranalysator

Info

Publication number
ATE408149T1
ATE408149T1 AT03720805T AT03720805T ATE408149T1 AT E408149 T1 ATE408149 T1 AT E408149T1 AT 03720805 T AT03720805 T AT 03720805T AT 03720805 T AT03720805 T AT 03720805T AT E408149 T1 ATE408149 T1 AT E408149T1
Authority
AT
Austria
Prior art keywords
embedding
load device
substantially identical
parameter values
calibration
Prior art date
Application number
AT03720805T
Other languages
English (en)
Inventor
Lukas Tiemeijer
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE408149T1 publication Critical patent/ATE408149T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/28—Measuring attenuation, gain, phase shift or derived characteristics of electric four pole networks, i.e. two-port networks; Measuring transient response
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Investigating Or Analysing Biological Materials (AREA)
  • Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
  • Semiconductor Integrated Circuits (AREA)
AT03720805T 2002-05-16 2003-05-08 Verfahren zur kalibrierung und de-embedding, geräte für de-embedding und netzwerk- vektoranalysator ATE408149T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02076911 2002-05-16

Publications (1)

Publication Number Publication Date
ATE408149T1 true ATE408149T1 (de) 2008-09-15

Family

ID=29433146

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03720805T ATE408149T1 (de) 2002-05-16 2003-05-08 Verfahren zur kalibrierung und de-embedding, geräte für de-embedding und netzwerk- vektoranalysator

Country Status (9)

Country Link
US (2) US7026829B2 (de)
EP (1) EP1506428B1 (de)
JP (1) JP2005526250A (de)
CN (1) CN100541224C (de)
AT (1) ATE408149T1 (de)
AU (1) AU2003224379A1 (de)
DE (1) DE60323484D1 (de)
TW (1) TWI306705B (de)
WO (1) WO2003098255A1 (de)

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DE202004021093U1 (de) 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Aktiver Halbleiterscheibenmessfühler
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7403028B2 (en) * 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) * 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
JP2010503472A (ja) * 2006-09-13 2010-02-04 スリーエム イノベイティブ プロパティズ カンパニー 予備成形済みの展性のある中実のクラウン
US7518378B2 (en) * 2007-02-13 2009-04-14 Keithley Instruments, Inc. Cable compensation for pulsed I-V measurements
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7741857B2 (en) * 2008-03-06 2010-06-22 International Business Machines Corporation System and method for de-embedding a device under test employing a parametrized netlist
US8350586B2 (en) * 2009-07-02 2013-01-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus of deembedding
US8436626B2 (en) * 2009-12-17 2013-05-07 Taiwan Semiconductor Manfacturing Company, Ltd. Cascaded-based de-embedding methodology
CN102147434B (zh) * 2010-02-09 2013-10-30 中芯国际集成电路制造(上海)有限公司 一种测试电感的方法
CN102156235B (zh) * 2010-02-12 2013-05-08 中芯国际集成电路制造(上海)有限公司 射频电路中电感的短路测试装置及短路测试方法
CN102375101B (zh) * 2010-08-19 2013-12-18 上海华虹Nec电子有限公司 采用不同层金属引线连出的无源器件测试去嵌方法
US8917083B2 (en) 2010-11-24 2014-12-23 International Business Machines Corporation Structures and methods for RF de-embedding
CN102645625B (zh) * 2011-02-17 2016-01-20 台湾积体电路制造股份有限公司 短路虚拟架构、解内嵌的方法及装置
US8681945B2 (en) * 2011-12-22 2014-03-25 Telefonaktiebolaget Lm Ericsson (Publ) Calibration of a line driving device
US9581675B2 (en) * 2012-08-24 2017-02-28 Tektronix, Inc. Virtual model adapter removal and substitution technique for cascaded networks
CN103063999B (zh) * 2012-12-21 2016-03-16 上海华虹宏力半导体制造有限公司 去嵌入的方法
CN103364751B (zh) * 2013-07-11 2016-09-07 中国电子科技集团公司第四十一研究所 一种矢量网络分析仪电子校准件及校准方法
CN104569734B (zh) * 2013-10-12 2017-07-18 北京航天计量测试技术研究所 一种电缆网冗余线故障诊断方法
CN103675457B (zh) * 2013-11-05 2017-02-08 中国人民解放军国防科学技术大学 一种微波器件阻抗测量校准方法
CN103630864B (zh) * 2013-11-26 2016-12-07 中国电子科技集团公司第四十一研究所 一种用于自由空间材料电磁参数测试系统的校准方法
US11543448B2 (en) 2013-12-23 2023-01-03 Keysight Technologies, Inc. Dynamically determining measurement uncertainty (MU) of measurement devices
CN103983931B (zh) * 2014-05-06 2016-06-08 中国电子科技集团公司第十三研究所 矢量网络分析仪s参数测量不确定度的确定方法
US11215655B2 (en) * 2014-10-12 2022-01-04 Compass Technology Group, LLC Correction of transmission line induced phase and amplitude errors in reflectivity measurements
CN107076822B (zh) * 2014-10-28 2020-01-10 上海集成电路研发中心有限公司 利用引入器件判断射频器件去嵌入精度的测试结构及方法
CN104635135A (zh) * 2015-01-30 2015-05-20 中国科学院微电子研究所 一种化合物半导体器件的去嵌入方法
CN105891628B (zh) * 2016-03-30 2018-05-29 清华大学 通用四端口在片高频去嵌入方法
US10164106B2 (en) 2016-12-29 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and a method for fabricating the same
CN108646208B (zh) * 2018-06-08 2020-06-05 中国电子科技集团公司第四十一研究所 一种多端口夹具自动去嵌入方法
CN109524214B (zh) * 2018-11-22 2020-06-12 上海华力集成电路制造有限公司 螺旋电感去嵌入的开路结构及其去嵌入方法
CN112666506A (zh) * 2020-12-10 2021-04-16 中国电子技术标准化研究院 集成电路校准用在片电容标准样片
US11812879B2 (en) 2021-02-28 2023-11-14 Born Outdoor Group, Ltd. Modular portable bedding system
CN113655360A (zh) * 2021-08-10 2021-11-16 中国科学院上海微系统与信息技术研究所 Rf mos器件的在片测试结构的去嵌方法

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US6249128B1 (en) * 1997-10-22 2001-06-19 Teradyne, Inc. Automated microwave test system with improved accuracy
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US6643597B1 (en) * 2001-08-24 2003-11-04 Agilent Technologies, Inc. Calibrating a test system using unknown standards
US6744262B2 (en) * 2002-03-14 2004-06-01 Agilent Technologies, Inc. Method, apparatus, and article of manufacture for characterizing a device and predicting electrical behavior of the device in a circuit
US6832170B2 (en) * 2002-05-02 2004-12-14 Anritsu Company Methods for embedding and de-embedding using a circulator
US6895343B2 (en) * 2002-07-12 2005-05-17 Agilent Technologies, Inc. System and method for measuring essential power amplification functions
US7019535B2 (en) * 2002-09-16 2006-03-28 Agilent Technologies, Inc. Method and system for calibrating a measurement device path and for measuring a device under test in the calibrated measurement device path
US7034548B2 (en) * 2003-04-11 2006-04-25 Agilent Technologies, Inc. Balanced device characterization including test system calibration

Also Published As

Publication number Publication date
EP1506428A1 (de) 2005-02-16
EP1506428B1 (de) 2008-09-10
US7026829B2 (en) 2006-04-11
TW200400718A (en) 2004-01-01
DE60323484D1 (de) 2008-10-23
CN1735815A (zh) 2006-02-15
US7071707B2 (en) 2006-07-04
WO2003098255A1 (en) 2003-11-27
AU2003224379A1 (en) 2003-12-02
CN100541224C (zh) 2009-09-16
US20050179444A1 (en) 2005-08-18
US20060114004A1 (en) 2006-06-01
JP2005526250A (ja) 2005-09-02
TWI306705B (en) 2009-02-21

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