ATE394657T1 - Silizium-drucksensor mit niedrigem druckausgleich zwischen dem gemessenen druck und dem referenzraum - Google Patents

Silizium-drucksensor mit niedrigem druckausgleich zwischen dem gemessenen druck und dem referenzraum

Info

Publication number
ATE394657T1
ATE394657T1 AT04718620T AT04718620T ATE394657T1 AT E394657 T1 ATE394657 T1 AT E394657T1 AT 04718620 T AT04718620 T AT 04718620T AT 04718620 T AT04718620 T AT 04718620T AT E394657 T1 ATE394657 T1 AT E394657T1
Authority
AT
Austria
Prior art keywords
pressure
sensor
chamber
silicon
reference space
Prior art date
Application number
AT04718620T
Other languages
English (en)
Inventor
Karen Birkelund
Christoffer Greisen
Pirmin Rombach
Original Assignee
Danfoss As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss As filed Critical Danfoss As
Application granted granted Critical
Publication of ATE394657T1 publication Critical patent/ATE394657T1/de

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14Housings
    • G01L19/148Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14Housings
    • G01L19/142Multiple part housings
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14Housings
    • G01L19/147Details about the mounting of the sensor to support or covering means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14Housings
    • G01L19/149Housings of immersion sensor, e.g. where the sensor is immersed in the measuring medium or for in vivo measurements, e.g. by using catheter tips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
AT04718620T 2003-03-10 2004-03-09 Silizium-drucksensor mit niedrigem druckausgleich zwischen dem gemessenen druck und dem referenzraum ATE394657T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DKPA200300358 2003-03-10

Publications (1)

Publication Number Publication Date
ATE394657T1 true ATE394657T1 (de) 2008-05-15

Family

ID=32981674

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04718620T ATE394657T1 (de) 2003-03-10 2004-03-09 Silizium-drucksensor mit niedrigem druckausgleich zwischen dem gemessenen druck und dem referenzraum

Country Status (6)

Country Link
US (1) US7246525B2 (de)
EP (1) EP1601942B1 (de)
CN (1) CN1751232A (de)
AT (1) ATE394657T1 (de)
DE (1) DE602004013555D1 (de)
WO (1) WO2004081510A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10360941A1 (de) 2003-12-23 2005-07-28 Sensor-Technik Wiedemann Gmbh Rohrförmiger Drucksensor
EP2725334B1 (de) * 2012-10-25 2020-04-15 Invensense, Inc. Drucksensor mit einer Membrane und Herstellungsverfahren dafür
FI125447B (en) * 2013-06-04 2015-10-15 Murata Manufacturing Co Improved pressure sensor
CH708708A1 (de) * 2013-10-03 2015-04-15 Kistler Holding Ag Messelement zum Messen eines Drucks und Druckmesssensor.
US9383270B1 (en) * 2013-10-28 2016-07-05 Sandia Corporation Silicon force sensor
EP2871456B1 (de) 2013-11-06 2018-10-10 Invensense, Inc. Drucksensor und Herstellungsmethode für einen Drucksensor
EP2871455B1 (de) 2013-11-06 2020-03-04 Invensense, Inc. Drucksensor
EP3614115B1 (de) 2015-04-02 2024-09-11 InvenSense, Inc. Drucksensor
CN112041688B (zh) * 2018-04-24 2022-05-24 株式会社电装 半导体装置的制造方法
JP6897703B2 (ja) * 2018-04-24 2021-07-07 株式会社デンソー 半導体装置の製造方法
CN108622851A (zh) * 2018-04-28 2018-10-09 中科芯集成电路股份有限公司 一种带有空腔的衬底的制备方法
US11225409B2 (en) 2018-09-17 2022-01-18 Invensense, Inc. Sensor with integrated heater
CN209326840U (zh) 2018-12-27 2019-08-30 热敏碟公司 压力传感器及压力变送器
CN109668679B (zh) * 2019-01-29 2023-11-03 中国石油集团川庆钻探工程有限公司 石英晶体压力计传感器多级缓冲隔离装置
EP3712434B1 (de) 2019-03-20 2021-12-22 Danfoss A/S Rückschlagventildämpfung
EP3969868A1 (de) 2019-05-17 2022-03-23 InvenSense, Inc. Drucksensor mit verbesserter dichtigkeit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000002611A (ja) 1998-06-12 2000-01-07 Fujikura Ltd 圧力センサ
US6346742B1 (en) * 1998-11-12 2002-02-12 Maxim Integrated Products, Inc. Chip-scale packaged pressure sensor
US6626044B1 (en) 2000-10-03 2003-09-30 Honeywell International Inc. Freeze resistant sensor
US6505398B2 (en) 2000-12-04 2003-01-14 Kavlico Corporation Very high pressure miniature sensing and mounting technique

Also Published As

Publication number Publication date
DE602004013555D1 (de) 2008-06-19
WO2004081510A1 (en) 2004-09-23
US20060179951A1 (en) 2006-08-17
EP1601942B1 (de) 2008-05-07
US7246525B2 (en) 2007-07-24
CN1751232A (zh) 2006-03-22
EP1601942A1 (de) 2005-12-07

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Legal Events

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