WO2004068094A3 - Integrated pressure and acceleration measurement device and a method of manufacture thereof - Google Patents

Integrated pressure and acceleration measurement device and a method of manufacture thereof Download PDF

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Publication number
WO2004068094A3
WO2004068094A3 PCT/IB2004/000246 IB2004000246W WO2004068094A3 WO 2004068094 A3 WO2004068094 A3 WO 2004068094A3 IB 2004000246 W IB2004000246 W IB 2004000246W WO 2004068094 A3 WO2004068094 A3 WO 2004068094A3
Authority
WO
WIPO (PCT)
Prior art keywords
bonding
pressure
wafers
silicon
acceleration sensing
Prior art date
Application number
PCT/IB2004/000246
Other languages
French (fr)
Other versions
WO2004068094A2 (en
Inventor
Der Wiel Appolonius Jacobu Van
Original Assignee
Melexis Nv
Der Wiel Appolonius Jacobu Van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melexis Nv, Der Wiel Appolonius Jacobu Van filed Critical Melexis Nv
Priority to US10/544,038 priority Critical patent/US20060261424A1/en
Priority to EP04707265A priority patent/EP1587698A2/en
Publication of WO2004068094A2 publication Critical patent/WO2004068094A2/en
Publication of WO2004068094A3 publication Critical patent/WO2004068094A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
    • B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
    • B60C23/02—Signalling devices actuated by tyre pressure
    • B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
    • B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P13/00—Indicating or recording presence, absence, or direction, of movement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G01P3/02—Devices characterised by the use of mechanical means
    • G01P3/16—Devices characterised by the use of mechanical means by using centrifugal forces of solid masses
    • G01P3/22—Devices characterised by the use of mechanical means by using centrifugal forces of solid masses transferred to the indicator by electric or magnetic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

An integrated pressure and acceleration sensing device comprises three silicon wafers (101-103) bonded together by silicon fusion bonding. The wafers (101-103) are shaped so as to define a pressure sensitive element (113) and an acceleration sensing element (112). At least one stress measuring means linked to each of said pressure sensing and acceleration sensing elements (113,112) which are operable to generate a measurement signal responsive to deformation of said stress measuring means and which is indicative of the sensed values of pressure and/or acceleration. The device is manufactured by shaping said silicon wafers (101-103) define parts which act to form pressure and acceleration sensing elements (113,112) and bonding said silicon wafers (101-103) together using bonding techniques such as silicon fusion bonding, anodic bonding or glass-frit bonding. The wafers (101-103) are polished or lapped said to produce a relatively thin single integrated device.
PCT/IB2004/000246 2003-01-31 2004-02-02 Integrated pressure and acceleration measurement device and a method of manufacture thereof WO2004068094A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/544,038 US20060261424A1 (en) 2003-01-31 2004-02-02 Integrated pressure and acceleration measurement device and a method of manufacture thereof
EP04707265A EP1587698A2 (en) 2003-01-31 2004-02-02 Integrated pressure and acceleration measurement device and a method of manufacture thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0302271.2A GB0302271D0 (en) 2003-01-31 2003-01-31 Integrated pressure and acceleration measurement device and a method of manufacture thereof
GB0302271.2 2003-01-31

Publications (2)

Publication Number Publication Date
WO2004068094A2 WO2004068094A2 (en) 2004-08-12
WO2004068094A3 true WO2004068094A3 (en) 2004-12-16

Family

ID=9952214

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2004/000246 WO2004068094A2 (en) 2003-01-31 2004-02-02 Integrated pressure and acceleration measurement device and a method of manufacture thereof

Country Status (4)

Country Link
US (1) US20060261424A1 (en)
EP (1) EP1587698A2 (en)
GB (1) GB0302271D0 (en)
WO (1) WO2004068094A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1684079A1 (en) * 2005-01-25 2006-07-26 STMicroelectronics S.r.l. Piezoresistive accelerometer with mass on membrane, and manufacturing process
US20060276008A1 (en) * 2005-06-02 2006-12-07 Vesa-Pekka Lempinen Thinning
EP1775259A1 (en) * 2005-10-14 2007-04-18 STMicroelectronics S.r.l. Wafer level package for sensor devices
WO2007042336A2 (en) 2005-10-14 2007-04-19 Stmicroelectronics S.R.L. Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
DE102005055473A1 (en) * 2005-11-22 2007-05-24 Robert Bosch Gmbh Micromechanical device for use in e.g. pressure sensor, has seismic mass that is connected by spring structure, and free space and cavity that are provided parallel to main substrate level and below front side surface
EP2252077B1 (en) 2009-05-11 2012-07-11 STMicroelectronics Srl Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof
CN102183677B (en) * 2011-03-15 2012-08-08 迈尔森电子（天津）有限公司 Integrated inertial sensor and pressure sensor and forming method thereof
EP2693183A1 (en) * 2012-08-01 2014-02-05 Honeywell International Inc. On-chip resonant acceleration and pressure sensor
CN104743498B (en) * 2013-12-27 2016-02-03 中芯国际集成电路制造(上海)有限公司 A kind of single chip micro-computer electric system and preparation method thereof
IT201700103489A1 (en) 2017-09-15 2019-03-15 St Microelectronics Srl METHOD OF MANUFACTURE OF A THIN FILTERING MEMBRANE, ACOUSTIC TRANSDUCER INCLUDING THE FILTERING MEMBRANE, ASSEMBLY METHOD OF THE ACOUSTIC TRANSDUCER AND ELECTRONIC SYSTEM
CN111780899B (en) * 2019-04-04 2022-04-12 武汉杰开科技有限公司 Composite sensor and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0742581A2 (en) * 1995-04-12 1996-11-13 Sensonor A.S. Sealed cavity arrangement
FR2737610A1 (en) * 1995-08-01 1997-02-07 Sextant Avionique CAPACITIVE MICRO SENSOR WITH LOW PARASITIC CAPACITY

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4202148A1 (en) * 1992-01-27 1993-07-29 Kansei Kk Acceleration sensor assembly - contains operational amplifier and acceleration sensor on ceramic plate and connected to circuit via equal dia. bonding wires.
JPH07318579A (en) * 1994-05-27 1995-12-08 Tokai Rika Co Ltd Acceleration sensor
DE19605795A1 (en) * 1996-02-16 1997-08-21 Duerrwaechter E Dr Doduco Arrangement of an electrical circuit board and an electrical pressure sensor
FI102114B (en) * 1996-11-20 1998-10-15 Vtt Sensor to measure sound pressure and acceleration
US6543277B2 (en) * 1998-11-13 2003-04-08 Bridgestone/Firestone North American Tire, Llc Non-attached monitoring assembly for pneumatic tire
US7161476B2 (en) * 2000-07-26 2007-01-09 Bridgestone Firestone North American Tire, Llc Electronic tire management system
JP2004191128A (en) * 2002-12-10 2004-07-08 Pacific Ind Co Ltd Semiconductor sensor and transmitter of tire state monitoring device
US20050172717A1 (en) * 2004-02-06 2005-08-11 General Electric Company Micromechanical device with thinned cantilever structure and related methods

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0742581A2 (en) * 1995-04-12 1996-11-13 Sensonor A.S. Sealed cavity arrangement
FR2737610A1 (en) * 1995-08-01 1997-02-07 Sextant Avionique CAPACITIVE MICRO SENSOR WITH LOW PARASITIC CAPACITY

Also Published As

Publication number Publication date
EP1587698A2 (en) 2005-10-26
US20060261424A1 (en) 2006-11-23
WO2004068094A2 (en) 2004-08-12
GB0302271D0 (en) 2003-03-05

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