ATE387012T1 - Kontaktierungsstruktur einer integrierten leistungsschaltung - Google Patents
Kontaktierungsstruktur einer integrierten leistungsschaltungInfo
- Publication number
- ATE387012T1 ATE387012T1 AT01000318T AT01000318T ATE387012T1 AT E387012 T1 ATE387012 T1 AT E387012T1 AT 01000318 T AT01000318 T AT 01000318T AT 01000318 T AT01000318 T AT 01000318T AT E387012 T1 ATE387012 T1 AT E387012T1
- Authority
- AT
- Austria
- Prior art keywords
- contact pads
- power
- transistor
- active components
- metals
- Prior art date
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- H01L2924/102—Material of the semiconductor or solid state bodies
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
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- H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns
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- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20754—Diameter ranges larger or equal to 40 microns less than 50 microns
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22105100P | 2000-07-27 | 2000-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE387012T1 true ATE387012T1 (de) | 2008-03-15 |
Family
ID=22826133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01000318T ATE387012T1 (de) | 2000-07-27 | 2001-07-27 | Kontaktierungsstruktur einer integrierten leistungsschaltung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7045903B2 (de) |
| EP (1) | EP1176640B1 (de) |
| JP (1) | JP2002164437A (de) |
| AT (1) | ATE387012T1 (de) |
| DE (1) | DE60132855T2 (de) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6104761A (en) | 1998-08-28 | 2000-08-15 | Sicom, Inc. | Constrained-envelope digital-communications transmission system and method therefor |
| DE10200932A1 (de) * | 2002-01-12 | 2003-07-24 | Philips Intellectual Property | Diskretes Halbleiterbauelement |
| US6972464B2 (en) * | 2002-10-08 | 2005-12-06 | Great Wall Semiconductor Corporation | Power MOSFET |
| JP4396200B2 (ja) * | 2002-10-30 | 2010-01-13 | 株式会社デンソー | 半導体装置 |
| JP2004303861A (ja) * | 2003-03-31 | 2004-10-28 | Renesas Technology Corp | 半導体装置およびその製造方法 |
| US7005369B2 (en) * | 2003-08-21 | 2006-02-28 | Intersil American Inc. | Active area bonding compatible high current structures |
| US8274160B2 (en) * | 2003-08-21 | 2012-09-25 | Intersil Americas Inc. | Active area bonding compatible high current structures |
| EP1603160A2 (de) * | 2004-06-01 | 2005-12-07 | Matsushita Electric Industrial Co., Ltd. | Integrierte Halbleiterschaltungsanordnung |
| KR100615579B1 (ko) | 2004-09-20 | 2006-08-25 | 삼성전자주식회사 | 반도체 메모리 장치 및 이 장치의 파워 라인 배치 방법 |
| KR100675275B1 (ko) * | 2004-12-16 | 2007-01-26 | 삼성전자주식회사 | 반도체 장치 및 이 장치의 패드 배치방법 |
| US7404513B2 (en) * | 2004-12-30 | 2008-07-29 | Texas Instruments Incorporated | Wire bonds having pressure-absorbing balls |
| US7476976B2 (en) * | 2005-02-23 | 2009-01-13 | Texas Instruments Incorporated | Flip chip package with advanced electrical and thermal properties for high current designs |
| US7483248B1 (en) * | 2005-05-19 | 2009-01-27 | Sun Microsystems, Inc. | Method and apparatus for detecting current changes in integrated circuits |
| KR100849640B1 (ko) | 2005-09-16 | 2008-08-01 | 가부시키가이샤 리코 | 반도체 장치 |
| DE102006050087A1 (de) | 2006-10-24 | 2008-04-30 | Austriamicrosystems Ag | Halbleiterkörper und Verfahren zum Entwurf eines Halbleiterkörpers mit einer Anschlussleitung |
| US7667316B2 (en) * | 2006-10-31 | 2010-02-23 | Panasonic Corporation | Semiconductor integrated circuit and method for manufacturing the same |
| JP4814770B2 (ja) * | 2006-12-01 | 2011-11-16 | パナソニック株式会社 | 半導体集積回路 |
| JP5054359B2 (ja) * | 2006-12-01 | 2012-10-24 | パナソニック株式会社 | 半導体集積回路及びその製造方法 |
| JP5066928B2 (ja) * | 2007-02-08 | 2012-11-07 | 株式会社デンソー | 半導体装置 |
| JP2008218442A (ja) * | 2007-02-28 | 2008-09-18 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置及びその製造方法 |
| DE102007036566A1 (de) * | 2007-08-03 | 2009-02-19 | Siemens Ag | Federkontaktierung von elektrischen Kontaktflächen eines elektronischen Bauteils |
| US7800239B2 (en) * | 2007-12-14 | 2010-09-21 | Semiconductor Components Industries, Llc | Thick metal interconnect with metal pad caps at selective sites and process for making the same |
| JP5326151B2 (ja) * | 2007-12-26 | 2013-10-30 | セイコーNpc株式会社 | パワーmosトランジスタ |
| DE102007063268A1 (de) * | 2007-12-31 | 2009-07-09 | Advanced Micro Devices, Inc., Sunnyvale | Drahtverbindung mit aluminiumfreien Metallisierungsschichten durch Oberflächenkonditionierung |
| US20100059795A1 (en) * | 2008-09-08 | 2010-03-11 | Firas Azrai | Vertical current transport in a power converter circuit |
| KR101107659B1 (ko) * | 2010-02-05 | 2012-01-20 | 주식회사 하이닉스반도체 | 반도체 패키지 |
| US8240218B2 (en) | 2010-03-01 | 2012-08-14 | Infineon Technologies Ag | Stress sensing devices and methods |
| US8426971B2 (en) | 2010-08-27 | 2013-04-23 | Diodes FabTech, Inc. | Top tri-metal system for silicon power semiconductor devices |
| JP5558336B2 (ja) | 2010-12-27 | 2014-07-23 | 株式会社東芝 | 半導体装置 |
| JP5580230B2 (ja) | 2011-02-28 | 2014-08-27 | パナソニック株式会社 | 半導体装置 |
| US9006099B2 (en) | 2011-06-08 | 2015-04-14 | Great Wall Semiconductor Corporation | Semiconductor device and method of forming a power MOSFET with interconnect structure silicide layer and low profile bump |
| US9105552B2 (en) | 2011-10-31 | 2015-08-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package on package devices and methods of packaging semiconductor dies |
| US8823180B2 (en) * | 2011-12-28 | 2014-09-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package on package devices and methods of packaging semiconductor dies |
| US8859416B2 (en) * | 2012-04-24 | 2014-10-14 | GlobalFoundries, Inc. | Software and method for via spacing in a semiconductor device |
| US9171790B2 (en) | 2012-05-30 | 2015-10-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package on package devices and methods of packaging semiconductor dies |
| EP2858110B1 (de) * | 2012-06-01 | 2020-04-08 | Panasonic Intellectual Property Management Co., Ltd. | Leistungshalbleiterbauelement |
| TWI632644B (zh) * | 2017-08-30 | 2018-08-11 | 絡達科技股份有限公司 | 積體電路結構 |
| US10380308B2 (en) * | 2018-01-10 | 2019-08-13 | Qualcomm Incorporated | Power distribution networks (PDNs) using hybrid grid and pillar arrangements |
| TWI748233B (zh) * | 2018-08-29 | 2021-12-01 | 美商高效電源轉換公司 | 具有降低導通電阻之橫向功率元件 |
| JP7177660B2 (ja) * | 2018-10-26 | 2022-11-24 | 株式会社東芝 | 半導体装置 |
| DE112021006079B4 (de) * | 2020-12-18 | 2024-10-24 | Rohm Co., Ltd. | Halbleiteranordnung |
| CN114097080B (zh) | 2021-07-01 | 2023-12-22 | 英诺赛科(苏州)科技有限公司 | 氮化物基多通道开关半导体器件和其制造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5992537A (ja) * | 1982-11-19 | 1984-05-28 | Hitachi Ltd | 半導体装置 |
| EP0646959B1 (de) * | 1993-09-30 | 2001-08-16 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno | Verfahren zur Metallisierung und Verbindung bei der Herstellung von Leistungshalbleiterbauelementen |
| US6150722A (en) * | 1994-11-02 | 2000-11-21 | Texas Instruments Incorporated | Ldmos transistor with thick copper interconnect |
| US5665996A (en) * | 1994-12-30 | 1997-09-09 | Siliconix Incorporated | Vertical power mosfet having thick metal layer to reduce distributed resistance |
| JPH08293523A (ja) * | 1995-02-21 | 1996-11-05 | Seiko Epson Corp | 半導体装置およびその製造方法 |
| JP2000183104A (ja) * | 1998-12-15 | 2000-06-30 | Texas Instr Inc <Ti> | 集積回路上でボンディングするためのシステム及び方法 |
| US6291331B1 (en) * | 1999-10-04 | 2001-09-18 | Taiwan Semiconductor Manufacturing Company | Re-deposition high compressive stress PECVD oxide film after IMD CMP process to solve more than 5 metal stack via process IMD crack issue |
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- 2001-07-27 DE DE60132855T patent/DE60132855T2/de not_active Expired - Lifetime
- 2001-07-27 EP EP01000318A patent/EP1176640B1/de not_active Expired - Lifetime
- 2001-07-27 JP JP2001262416A patent/JP2002164437A/ja not_active Abandoned
- 2001-07-27 AT AT01000318T patent/ATE387012T1/de not_active IP Right Cessation
- 2001-07-30 US US09/917,419 patent/US7045903B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE60132855D1 (de) | 2008-04-03 |
| US7045903B2 (en) | 2006-05-16 |
| EP1176640B1 (de) | 2008-02-20 |
| EP1176640A3 (de) | 2004-03-17 |
| US20020011674A1 (en) | 2002-01-31 |
| DE60132855T2 (de) | 2009-02-26 |
| EP1176640A2 (de) | 2002-01-30 |
| JP2002164437A (ja) | 2002-06-07 |
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