ATE384337T1 - Mehrfarben-lichtemissionslampe und lichtquelle - Google Patents

Mehrfarben-lichtemissionslampe und lichtquelle

Info

Publication number
ATE384337T1
ATE384337T1 AT02765340T AT02765340T ATE384337T1 AT E384337 T1 ATE384337 T1 AT E384337T1 AT 02765340 T AT02765340 T AT 02765340T AT 02765340 T AT02765340 T AT 02765340T AT E384337 T1 ATE384337 T1 AT E384337T1
Authority
AT
Austria
Prior art keywords
light
fabricating
lamp
emitting
led
Prior art date
Application number
AT02765340T
Other languages
English (en)
Inventor
Takashi Udagawa
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001248455A external-priority patent/JP3772708B2/ja
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Application granted granted Critical
Publication of ATE384337T1 publication Critical patent/ATE384337T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
  • Discharge Lamps And Accessories Thereof (AREA)
AT02765340T 2001-08-20 2002-08-16 Mehrfarben-lichtemissionslampe und lichtquelle ATE384337T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001248455A JP3772708B2 (ja) 2001-08-20 2001-08-20 多色発光ランプ及び光源
US32308801P 2001-09-19 2001-09-19

Publications (1)

Publication Number Publication Date
ATE384337T1 true ATE384337T1 (de) 2008-02-15

Family

ID=26620635

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02765340T ATE384337T1 (de) 2001-08-20 2002-08-16 Mehrfarben-lichtemissionslampe und lichtquelle

Country Status (6)

Country Link
US (1) US7479731B2 (de)
EP (1) EP1419535B1 (de)
CN (1) CN100344002C (de)
AT (1) ATE384337T1 (de)
DE (1) DE60224681T2 (de)
WO (1) WO2003017387A1 (de)

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US6730987B2 (en) * 2001-09-10 2004-05-04 Showa Denko K.K. Compound semiconductor device, production method thereof, light-emitting device and transistor
US6936863B2 (en) * 2002-11-18 2005-08-30 Showa Denko K.K. Boron phosphide-based semiconductor light-emitting device, production method thereof and light-emitting diode
TWI273724B (en) * 2002-11-18 2007-02-11 Showa Denko Kk Boron phosphide-based semiconductor light-emitting device, production method thereof and light-emitting diode
WO2007040295A1 (en) * 2005-10-04 2007-04-12 Seoul Opto Device Co., Ltd. (al, ga, in)n-based compound semiconductor and method of fabricating the same
JP4908041B2 (ja) * 2006-03-31 2012-04-04 株式会社沖データ 発光ダイオードアレイ、ｌｅｄヘッド及び画像記録装置
WO2016085823A1 (en) * 2014-11-26 2016-06-02 View, Inc. Counter electrode for electrochromic devices
US8582193B2 (en) 2010-04-30 2013-11-12 View, Inc. Electrochromic devices
US10156762B2 (en) 2009-03-31 2018-12-18 View, Inc. Counter electrode for electrochromic devices
US10591795B2 (en) 2009-03-31 2020-03-17 View, Inc. Counter electrode for electrochromic devices
US12043890B2 (en) 2009-03-31 2024-07-23 View, Inc. Electrochromic devices
US9664974B2 (en) 2009-03-31 2017-05-30 View, Inc. Fabrication of low defectivity electrochromic devices
TWI398966B (zh) * 2009-06-08 2013-06-11 晶元光電股份有限公司 發光元件及其製造方法
US8836532B2 (en) 2009-07-16 2014-09-16 Gentex Corporation Notification appliance and method thereof
US12353109B2 (en) 2009-12-22 2025-07-08 View Operating Corporation Electrochromic cathode materials
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
US8934259B2 (en) 2011-06-08 2015-01-13 Semprius, Inc. Substrates with transferable chiplets
CN102903804B (zh) * 2011-07-25 2015-12-16 财团法人工业技术研究院 发光元件的转移方法以及发光元件阵列
CN103456848A (zh) * 2012-06-04 2013-12-18 华夏光股份有限公司 半导体装置及其制造方法
US9490402B2 (en) * 2012-08-17 2016-11-08 Zhiqiang Qian LED light-emitting device for white light
CN104716238A (zh) * 2013-12-12 2015-06-17 中国科学院苏州纳米技术与纳米仿生研究所 双色光电器件及其制作方法
US11891327B2 (en) 2014-05-02 2024-02-06 View, Inc. Fabrication of low defectivity electrochromic devices
WO2016011600A1 (zh) * 2014-07-22 2016-01-28 深圳市兆明芯科技控股有限公司 免打线封装的led芯片及封装工艺
CN112067123A (zh) 2014-09-23 2020-12-11 赫普塔冈微光有限公司 紧凑、功率有效的堆叠宽带光学发射器
US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
US9799719B2 (en) 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
US10228601B2 (en) 2014-11-26 2019-03-12 View, Inc. Counter electrode for electrochromic devices
WO2017144573A1 (en) 2016-02-25 2017-08-31 X-Celeprint Limited Efficiently micro-transfer printing micro-scale devices onto large-format substrates
US10600671B2 (en) 2016-11-15 2020-03-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
TWI762428B (zh) 2016-11-15 2022-04-21 愛爾蘭商艾克斯展示公司技術有限公司 微轉印可印刷覆晶結構及方法
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates

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JPS5433748A (en) 1977-08-22 1979-03-12 Nec Corp Optical integrated circuit of semiconductor
JPS604991B2 (ja) * 1979-05-11 1985-02-07 株式会社東芝 ディスプレイ装置
US4929866A (en) * 1987-11-17 1990-05-29 Mitsubishi Cable Industries, Ltd. Light emitting diode lamp
JP2809691B2 (ja) * 1989-04-28 1998-10-15 株式会社東芝 半導体レーザ
JP2809692B2 (ja) * 1989-04-28 1998-10-15 株式会社東芝 半導体発光素子およびその製造方法
JP3062510B2 (ja) * 1990-12-07 2000-07-10 日本電信電話株式会社 半導体光素子
JPH04365382A (ja) * 1991-06-13 1992-12-17 Toshiba Corp 半導体発光装置及びその駆動方法
JPH05283744A (ja) 1991-12-20 1993-10-29 Toshiba Corp 半導体素子
JPH0651129A (ja) * 1992-07-27 1994-02-25 Inoue Denki Kk 照明装置
JP3090057B2 (ja) 1996-08-07 2000-09-18 昭和電工株式会社 短波長発光素子
US6069021A (en) * 1997-05-14 2000-05-30 Showa Denko K.K. Method of growing group III nitride semiconductor crystal layer and semiconductor device incorporating group III nitride semiconductor crystal layer
US5789768A (en) * 1997-06-23 1998-08-04 Epistar Corporation Light emitting diode having transparent conductive oxide formed on the contact layer
US6194744B1 (en) * 1998-03-17 2001-02-27 Showa Denko Kabushiki Kaisha Method of growing group III nitride semiconductor crystal layer and semiconductor device incorporating group III nitride semiconductor crystal layer
JPH10242567A (ja) * 1998-04-06 1998-09-11 Toshiba Corp 半導体レーザ
JP2000012896A (ja) 1998-06-19 2000-01-14 Showa Denko Kk Ｉｉｉ族窒化物半導体素子
JP4238385B2 (ja) 1998-08-06 2009-03-18 昭和電工株式会社 化合物半導体素子およびその製造方法
JP4290887B2 (ja) * 1998-09-17 2009-07-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ｌｅｄ電球
US6730987B2 (en) * 2001-09-10 2004-05-04 Showa Denko K.K. Compound semiconductor device, production method thereof, light-emitting device and transistor
US6936863B2 (en) * 2002-11-18 2005-08-30 Showa Denko K.K. Boron phosphide-based semiconductor light-emitting device, production method thereof and light-emitting diode

Also Published As

Publication number Publication date
US20040183089A1 (en) 2004-09-23
EP1419535A4 (de) 2006-11-02
WO2003017387A1 (en) 2003-02-27
DE60224681T2 (de) 2009-01-08
CN100344002C (zh) 2007-10-17
EP1419535A1 (de) 2004-05-19
US7479731B2 (en) 2009-01-20
CN1541420A (zh) 2004-10-27
DE60224681D1 (de) 2008-03-06
EP1419535B1 (de) 2008-01-16

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