ATE534148T1 - Leuchtdioden-anordnung mit farbkonversions- material - Google Patents

Leuchtdioden-anordnung mit farbkonversions- material

Info

Publication number
ATE534148T1
ATE534148T1 AT05774675T AT05774675T ATE534148T1 AT E534148 T1 ATE534148 T1 AT E534148T1 AT 05774675 T AT05774675 T AT 05774675T AT 05774675 T AT05774675 T AT 05774675T AT E534148 T1 ATE534148 T1 AT E534148T1
Authority
AT
Austria
Prior art keywords
light
conversion material
emitting diode
color conversion
diode arrangement
Prior art date
Application number
AT05774675T
Other languages
English (en)
Inventor
Peter Pachler
Original Assignee
Tridonic Jennersdorf Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tridonic Jennersdorf Gmbh filed Critical Tridonic Jennersdorf Gmbh
Application granted granted Critical
Publication of ATE534148T1 publication Critical patent/ATE534148T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Led Device Packages (AREA)
AT05774675T 2004-11-03 2005-08-24 Leuchtdioden-anordnung mit farbkonversions- material ATE534148T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004053116A DE102004053116A1 (de) 2004-11-03 2004-11-03 Leuchtdioden-Anordnung mit Farbkonversions-Material
PCT/EP2005/009141 WO2006048064A1 (de) 2004-11-03 2005-08-24 Leuchtdioden-anordnung mit farbkonversions-material

Publications (1)

Publication Number Publication Date
ATE534148T1 true ATE534148T1 (de) 2011-12-15

Family

ID=34980314

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05774675T ATE534148T1 (de) 2004-11-03 2005-08-24 Leuchtdioden-anordnung mit farbkonversions- material

Country Status (8)

Country Link
US (1) US7777236B2 (de)
EP (1) EP1807877B1 (de)
JP (1) JP2008519444A (de)
KR (1) KR101188566B1 (de)
CN (1) CN101088172B (de)
AT (1) ATE534148T1 (de)
DE (1) DE102004053116A1 (de)
WO (1) WO2006048064A1 (de)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
JP2007294587A (ja) * 2006-04-24 2007-11-08 Ngk Spark Plug Co Ltd 発光素子収納用パッケージ
JP2008004645A (ja) * 2006-06-20 2008-01-10 Harison Toshiba Lighting Corp 発光デバイス
TWI418054B (zh) 2006-08-08 2013-12-01 Ｌｇ電子股份有限公司 發光裝置封裝與製造此封裝之方法
DE102006048368A1 (de) * 2006-10-09 2008-04-10 Huf Hülsbeck & Fürst Gmbh & Co. Kg Außenliegendes Montagebauteil
EP1914809A1 (de) * 2006-10-20 2008-04-23 Tridonic Optoelectronics GmbH Hülle für optoelektronische Bauelemente
KR20090083450A (ko) * 2006-11-06 2009-08-03 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 자체 지지 파장 변환 소자 제조 방법 및 발광 장치 제조 방법
WO2008056292A1 (en) 2006-11-07 2008-05-15 Philips Intellectual Property & Standards Gmbh Arrangement for emitting mixed light
EP1988583B1 (de) * 2007-04-30 2016-10-12 Tridonic Jennersdorf GmbH Leuchtdiode-Modul mit Farbumwandlungsschicht für eine gleichmäßige Farbverteilung
US11114594B2 (en) 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
DE102007056874A1 (de) * 2007-11-26 2009-05-28 Osram Gesellschaft mit beschränkter Haftung LED-Beleuchtungsvorrichtung mit Konversionsreflektor
RU2010137317A (ru) * 2008-02-08 2012-03-20 Конинклейке Филипс Электроникс Н.В. (Nl) Оптический элемент и способ его изготовления
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
US8851356B1 (en) 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US8007286B1 (en) 2008-03-18 2011-08-30 Metrospec Technology, Llc Circuit boards interconnected by overlapping plated through holes portions
US8143631B2 (en) 2008-03-06 2012-03-27 Metrospec Technology Llc Layered structure for use with high power light emitting diode systems
JP5224173B2 (ja) * 2008-03-07 2013-07-03 スタンレー電気株式会社 半導体発光装置
US8410720B2 (en) 2008-04-07 2013-04-02 Metrospec Technology, LLC. Solid state lighting circuit and controls
DE102008021661A1 (de) 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh LED-Modul mit Rahmen und Leiterplatte
US9287469B2 (en) 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
JP5770084B2 (ja) * 2008-07-01 2015-08-26 コーニンクレッカ フィリップス エヌ ヴェ Ｌｅｄに関する近接コリメータ
JP5521325B2 (ja) * 2008-12-27 2014-06-11 日亜化学工業株式会社 発光装置及びその製造方法
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
DE102009033287A1 (de) 2009-07-15 2011-01-20 Osram Opto Semiconductors Gmbh Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode
US8803171B2 (en) * 2009-07-22 2014-08-12 Koninklijke Philips N.V. Reduced color over angle variation LEDs
US20110049545A1 (en) * 2009-09-02 2011-03-03 Koninklijke Philips Electronics N.V. Led package with phosphor plate and reflective substrate
KR101114150B1 (ko) * 2009-10-19 2012-03-09 엘지이노텍 주식회사 발광 소자
DE102009058421A1 (de) * 2009-12-16 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil
KR101186648B1 (ko) * 2009-12-21 2012-09-28 서울반도체 주식회사 Ｌｅｄ 패키지 및 그의 제조 방법
DE102010028407B4 (de) * 2010-04-30 2021-01-14 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
TW201201419A (en) * 2010-06-29 2012-01-01 Semileds Optoelectronics Co Wafer-type light emitting device having precisely coated wavelength-converting layer
DE102010032041A1 (de) 2010-07-23 2012-01-26 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement und Verfahren zur Herstellung von strahlungsemittierenden Bauelemnenten
US20120168641A1 (en) * 2010-09-08 2012-07-05 Lizotte Todd E Uv ptfe diffuser technology
DE102010048162A1 (de) * 2010-10-11 2012-04-12 Osram Opto Semiconductors Gmbh Konversionsbauteil
JP5582048B2 (ja) * 2011-01-28 2014-09-03 日亜化学工業株式会社 発光装置
JP5962102B2 (ja) 2011-03-24 2016-08-03 日亜化学工業株式会社 発光装置及びその製造方法
US8602577B2 (en) 2011-04-25 2013-12-10 Osram Sylvania Inc. Side-emitting solid state light source modules with funnel-shaped phosphor surface
US20130056749A1 (en) * 2011-09-07 2013-03-07 Michael Tischler Broad-area lighting systems
JP2013110199A (ja) * 2011-11-18 2013-06-06 Citizen Electronics Co Ltd Ｌｅｄ発光装置
US8907362B2 (en) 2012-01-24 2014-12-09 Cooledge Lighting Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods
WO2013112435A1 (en) 2012-01-24 2013-08-01 Cooledge Lighting Inc. Light - emitting devices having discrete phosphor chips and fabrication methods
US8896010B2 (en) 2012-01-24 2014-11-25 Cooledge Lighting Inc. Wafer-level flip chip device packages and related methods
US9871167B2 (en) * 2013-04-11 2018-01-16 Koninklijke Philips N.V. Top emitting semiconductor light emitting device
JP5931006B2 (ja) * 2013-06-03 2016-06-08 日亜化学工業株式会社 発光装置
US9343443B2 (en) 2014-02-05 2016-05-17 Cooledge Lighting, Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods
DE102014116134A1 (de) * 2014-11-05 2016-05-12 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement
CN104752453B (zh) * 2015-03-30 2017-09-19 深圳市华星光电技术有限公司 一种发光装置及液晶显示装置
KR102463880B1 (ko) * 2015-10-13 2022-11-04 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102537073B1 (ko) * 2016-05-16 2023-05-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
FR3061358B1 (fr) * 2016-12-27 2021-06-11 Aledia Procede de fabrication d’un dispositif optoelectronique comportant des plots photoluminescents de photoresine
EP3396725B1 (de) * 2017-04-25 2021-01-13 Nichia Corporation Lichtemittierende vorrichtung und verfahren zu seiner herstellung
DE102017120385B4 (de) * 2017-09-05 2024-02-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Licht emittierendes Bauelement und Verfahren zur Herstellung eines Licht emittierenden Bauelements
KR102595821B1 (ko) * 2018-05-02 2023-10-30 서울바이오시스 주식회사 발광 소자 패키지
KR102539444B1 (ko) * 2018-05-16 2023-06-02 엘지전자 주식회사 반도체 발광 소자를 이용한 램프 및 그 제조 방법
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof
JP7545085B2 (ja) * 2022-01-07 2024-09-04 日亜化学工業株式会社 発光装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2162274A1 (en) 1971-12-08 1973-07-20 Ctre Nal Etu Telecommuni Solid state light emitter - using an infra-red to visible light converter
JPH0381653A (ja) * 1989-08-24 1991-04-08 Fuji Valve Co Ltd ワークの染色探傷方法
JP2934919B2 (ja) * 1991-03-19 1999-08-16 信越化学工業株式会社 放射線検出器用シンチレータブロック接合体
JP3065258B2 (ja) * 1996-09-30 2000-07-17 日亜化学工業株式会社 発光装置及びそれを用いた表示装置
JP3492178B2 (ja) * 1997-01-15 2004-02-03 株式会社東芝 半導体発光装置及びその製造方法
US6864861B2 (en) * 1997-12-31 2005-03-08 Brillian Corporation Image generator having a miniature display device
JP3185977B2 (ja) * 1998-08-12 2001-07-11 スタンレー電気株式会社 Ｌｅｄランプ
US6373188B1 (en) 1998-12-22 2002-04-16 Honeywell International Inc. Efficient solid-state light emitting device with excited phosphors for producing a visible light output
DE10020465A1 (de) 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
JP2003017751A (ja) 2001-06-28 2003-01-17 Toyoda Gosei Co Ltd 発光ダイオード
DE10153259A1 (de) * 2001-10-31 2003-05-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US20030141563A1 (en) 2002-01-28 2003-07-31 Bily Wang Light emitting diode package with fluorescent cover
JP2004103814A (ja) * 2002-09-10 2004-04-02 Showa Denko Kk 発光ダイオード、その製造方法および白色照明装置
JP2004111623A (ja) * 2002-09-18 2004-04-08 Toyoda Gosei Co Ltd 発光装置
JP4143732B2 (ja) * 2002-10-16 2008-09-03 スタンレー電気株式会社 車載用波長変換素子
US7102152B2 (en) * 2004-10-14 2006-09-05 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Device and method for emitting output light using quantum dots and non-quantum fluorescent material
JP4640248B2 (ja) * 2005-07-25 2011-03-02 豊田合成株式会社 光源装置
US8119028B2 (en) * 2007-11-14 2012-02-21 Cree, Inc. Cerium and europium doped single crystal phosphors

Also Published As

Publication number Publication date
US7777236B2 (en) 2010-08-17
JP2008519444A (ja) 2008-06-05
KR20070083919A (ko) 2007-08-24
KR101188566B1 (ko) 2012-10-05
EP1807877A1 (de) 2007-07-18
WO2006048064A1 (de) 2006-05-11
US20090194776A1 (en) 2009-08-06
DE102004053116A1 (de) 2006-05-04
CN101088172B (zh) 2010-08-25
CN101088172A (zh) 2007-12-12
EP1807877B1 (de) 2011-11-16

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