ATE379819T1 - Verfahren zur herstellung einer mit kontakten versehenen ic-karte und nach diesem verfahren hergestellte ic-karte - Google Patents

Verfahren zur herstellung einer mit kontakten versehenen ic-karte und nach diesem verfahren hergestellte ic-karte

Info

Publication number
ATE379819T1
ATE379819T1 AT99914591T AT99914591T ATE379819T1 AT E379819 T1 ATE379819 T1 AT E379819T1 AT 99914591 T AT99914591 T AT 99914591T AT 99914591 T AT99914591 T AT 99914591T AT E379819 T1 ATE379819 T1 AT E379819T1
Authority
AT
Austria
Prior art keywords
substrate
card
molding
injection
precut
Prior art date
Application number
AT99914591T
Other languages
English (en)
Inventor
Didier Elbaz
Original Assignee
Gemplus Card Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card Int filed Critical Gemplus Card Int
Application granted granted Critical
Publication of ATE379819T1 publication Critical patent/ATE379819T1/de

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07724Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
AT99914591T 1998-04-22 1999-04-15 Verfahren zur herstellung einer mit kontakten versehenen ic-karte und nach diesem verfahren hergestellte ic-karte ATE379819T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9805625A FR2778002B1 (fr) 1998-04-22 1998-04-22 Procede de fabrication d'une carte a circuit integre a contact et une carte obtenue selon ce procede

Publications (1)

Publication Number Publication Date
ATE379819T1 true ATE379819T1 (de) 2007-12-15

Family

ID=9526004

Family Applications (2)

Application Number Title Priority Date Filing Date
AT07112462T ATE553451T1 (de) 1998-04-22 1999-04-15 Gussform zur herstellung einer mit kontakten versehenen ic-karte
AT99914591T ATE379819T1 (de) 1998-04-22 1999-04-15 Verfahren zur herstellung einer mit kontakten versehenen ic-karte und nach diesem verfahren hergestellte ic-karte

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT07112462T ATE553451T1 (de) 1998-04-22 1999-04-15 Gussform zur herstellung einer mit kontakten versehenen ic-karte

Country Status (6)

Country Link
EP (2) EP1857969B1 (de)
AT (2) ATE553451T1 (de)
DE (1) DE69937635T2 (de)
ES (1) ES2297922T3 (de)
FR (1) FR2778002B1 (de)
WO (1) WO1999054846A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2817064B1 (fr) * 2000-11-20 2004-06-04 Alain Feingold Carte a memoire a circuit encastre
FR2872946B1 (fr) * 2004-07-08 2006-09-22 Gemplus Sa Procede de fabrication d'un support de carte a puce mini uicc avec adaptateur plug-in uicc associe et support obtenu
GB2463236A (en) * 2008-09-03 2010-03-10 Beautiful Card Corp SIM card forming structure
EP2343174A1 (de) 2010-01-11 2011-07-13 Gemalto SA Gepresste Chipkarten und Herstellungsverfahren
CN107498780A (zh) * 2017-07-31 2017-12-22 华勤通讯技术有限公司 模内注塑钢片

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5681356A (en) * 1991-05-10 1997-10-28 Gao Gesellschaft Fur Automation Und Organisation Mbh Method and apparatus for producing a plastic molded chip card having reduced wall thickness
FR2678753B1 (fr) * 1991-07-02 1996-12-20 Gemplus Card Int Fabrication de cartes a puce a module autodetachable.
US5581065A (en) * 1993-08-02 1996-12-03 Dai Nippon Printing Co., Ltd. Sheet-framed IC carrier, method for producing the same, and IC carrier case
DE19736082C1 (de) * 1997-08-20 1999-01-14 Orga Kartensysteme Gmbh Verfahren und Herstellen einer Chipkarte und Vorrichtung zur Durchführung des Verfahrens

Also Published As

Publication number Publication date
WO1999054846A1 (fr) 1999-10-28
EP1857969B1 (de) 2012-04-11
EP1073998A1 (de) 2001-02-07
FR2778002B1 (fr) 2000-06-30
ATE553451T1 (de) 2012-04-15
DE69937635T2 (de) 2008-10-30
EP1857969A2 (de) 2007-11-21
EP1073998B1 (de) 2007-11-28
EP1857969A3 (de) 2007-12-05
DE69937635D1 (de) 2008-01-10
ES2297922T3 (es) 2008-05-01
FR2778002A1 (fr) 1999-10-29

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