ATE365376T1 - Zusammensetzungen für die herstellung von materialien mit niedriger dielektrizitätskonstante - Google Patents

Zusammensetzungen für die herstellung von materialien mit niedriger dielektrizitätskonstante

Info

Publication number
ATE365376T1
ATE365376T1 AT03012119T AT03012119T ATE365376T1 AT E365376 T1 ATE365376 T1 AT E365376T1 AT 03012119 T AT03012119 T AT 03012119T AT 03012119 T AT03012119 T AT 03012119T AT E365376 T1 ATE365376 T1 AT E365376T1
Authority
AT
Austria
Prior art keywords
compositions
producing low
constant materials
performance
dilectric
Prior art date
Application number
AT03012119T
Other languages
German (de)
English (en)
Inventor
Brian Keith Peterson
John Francis Kirner
Scott Jeffrey Weigel
James Edward Macdougall
Deis Deis
Thomas Albert Braymer
Keith Douglas Campbell
Martin Devenney
C Eric Ramberg
Konstantinos Chondroudis
Keith Cendak
Original Assignee
Air Prod & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Prod & Chem filed Critical Air Prod & Chem
Application granted granted Critical
Publication of ATE365376T1 publication Critical patent/ATE365376T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • H10P14/6922—
    • H10P14/6342—
    • H10P14/665—
    • H10P14/6686—
    • H10P14/69215—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Inorganic Insulating Materials (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Oxide Ceramics (AREA)
AT03012119T 2002-05-30 2003-05-30 Zusammensetzungen für die herstellung von materialien mit niedriger dielektrizitätskonstante ATE365376T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38432102P 2002-05-30 2002-05-30
US10/638,942 US7122880B2 (en) 2002-05-30 2003-05-20 Compositions for preparing low dielectric materials

Publications (1)

Publication Number Publication Date
ATE365376T1 true ATE365376T1 (de) 2007-07-15

Family

ID=29718525

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03012119T ATE365376T1 (de) 2002-05-30 2003-05-30 Zusammensetzungen für die herstellung von materialien mit niedriger dielektrizitätskonstante

Country Status (10)

Country Link
US (3) US7122880B2 (show.php)
EP (2) EP1852903A3 (show.php)
JP (2) JP2004161601A (show.php)
KR (1) KR100561884B1 (show.php)
CN (1) CN100539037C (show.php)
AT (1) ATE365376T1 (show.php)
DE (1) DE60314475T2 (show.php)
IL (2) IL156231A (show.php)
SG (1) SG110057A1 (show.php)
TW (2) TWI303834B (show.php)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6800571B2 (en) * 1998-09-29 2004-10-05 Applied Materials Inc. CVD plasma assisted low dielectric constant films
US6541367B1 (en) * 2000-01-18 2003-04-01 Applied Materials, Inc. Very low dielectric constant plasma-enhanced CVD films
US20030211244A1 (en) * 2002-04-11 2003-11-13 Applied Materials, Inc. Reacting an organosilicon compound with an oxidizing gas to form an ultra low k dielectric
US6815373B2 (en) * 2002-04-16 2004-11-09 Applied Materials Inc. Use of cyclic siloxanes for hardness improvement of low k dielectric films
US7122880B2 (en) * 2002-05-30 2006-10-17 Air Products And Chemicals, Inc. Compositions for preparing low dielectric materials
US7307343B2 (en) * 2002-05-30 2007-12-11 Air Products And Chemicals, Inc. Low dielectric materials and methods for making same
US6972217B1 (en) * 2002-12-23 2005-12-06 Lsi Logic Corporation Low k polymer E-beam printable mechanical support
US6897163B2 (en) * 2003-01-31 2005-05-24 Applied Materials, Inc. Method for depositing a low dielectric constant film
US7288292B2 (en) * 2003-03-18 2007-10-30 International Business Machines Corporation Ultra low k (ULK) SiCOH film and method
US20050260420A1 (en) * 2003-04-01 2005-11-24 Collins Martha J Low dielectric materials and methods for making same
US7462678B2 (en) * 2003-09-25 2008-12-09 Jsr Corporation Film forming composition, process for producing film forming composition, insulating film forming material, process for forming film, and silica-based film
US8734906B2 (en) * 2003-11-21 2014-05-27 Brismat Inc. Films and method of production thereof
JP5183066B2 (ja) * 2003-11-21 2013-04-17 ブリスマット インコーポレイテッド シリカ膜およびその製造方法
JP4190538B2 (ja) * 2003-12-22 2008-12-03 ライオン株式会社 ハイパーブランチポリマー、ハイパーブランチポリマーの製造方法、およびレジスト組成物
US20050196974A1 (en) * 2004-03-02 2005-09-08 Weigel Scott J. Compositions for preparing low dielectric materials containing solvents
US7015061B2 (en) * 2004-08-03 2006-03-21 Honeywell International Inc. Low temperature curable materials for optical applications
JP4650885B2 (ja) * 2004-09-07 2011-03-16 株式会社神戸製鋼所 多孔質膜の形成方法及びその方法によって形成された多孔質膜
US7387973B2 (en) * 2004-09-30 2008-06-17 Taiwan Semiconductor Manufacturing Co., Ltd. Method for improving low-K dielectrics by supercritical fluid treatments
KR101137812B1 (ko) * 2004-12-20 2012-04-18 주식회사 동진쎄미켐 유기 반사방지막 형성용 유기 중합체 및 이를 포함하는유기 조성물
US20070299176A1 (en) * 2005-01-28 2007-12-27 Markley Thomas J Photodefinable low dielectric constant material and method for making and using same
US7867779B2 (en) 2005-02-03 2011-01-11 Air Products And Chemicals, Inc. System and method comprising same for measurement and/or analysis of particles in gas stream
US20060183055A1 (en) * 2005-02-15 2006-08-17 O'neill Mark L Method for defining a feature on a substrate
US7341788B2 (en) 2005-03-11 2008-03-11 International Business Machines Corporation Materials having predefined morphologies and methods of formation thereof
US7425350B2 (en) * 2005-04-29 2008-09-16 Asm Japan K.K. Apparatus, precursors and deposition methods for silicon-containing materials
EP1734016B1 (en) * 2005-05-31 2017-01-04 BrisMat Inc. Silica and silica-like films and method of production
JP4872246B2 (ja) * 2005-06-10 2012-02-08 住友電気工業株式会社 半絶縁性ＧａＡｓ基板及びエピタキシャル基板
KR100725460B1 (ko) * 2005-12-28 2007-06-07 삼성전자주식회사 금속 오염 분석용 표준 시료의 제조 방법
JP4949692B2 (ja) * 2006-02-07 2012-06-13 東京応化工業株式会社 低屈折率シリカ系被膜形成用組成物
US20070196773A1 (en) * 2006-02-22 2007-08-23 Weigel Scott J Top coat for lithography processes
US8399349B2 (en) 2006-04-18 2013-03-19 Air Products And Chemicals, Inc. Materials and methods of forming controlled void
US20080012074A1 (en) * 2006-07-14 2008-01-17 Air Products And Chemicals, Inc. Low Temperature Sol-Gel Silicates As Dielectrics or Planarization Layers For Thin Film Transistors
US7410916B2 (en) * 2006-11-21 2008-08-12 Applied Materials, Inc. Method of improving initiation layer for low-k dielectric film by digital liquid flow meter
KR101562681B1 (ko) * 2007-06-15 2015-10-22 에스비에이 머티어리얼스 인코포레이티드 저유전율 유전체
US7989033B2 (en) * 2007-07-12 2011-08-02 Applied Materials, Inc. Silicon precursors to make ultra low-K films with high mechanical properties by plasma enhanced chemical vapor deposition
US7998536B2 (en) 2007-07-12 2011-08-16 Applied Materials, Inc. Silicon precursors to make ultra low-K films of K<2.2 with high mechanical properties by plasma enhanced chemical vapor deposition
US20090093135A1 (en) * 2007-10-04 2009-04-09 Asm Japan K.K. Semiconductor manufacturing apparatus and method for curing material with uv light
US20090096106A1 (en) * 2007-10-12 2009-04-16 Air Products And Chemicals, Inc. Antireflective coatings
US8987039B2 (en) 2007-10-12 2015-03-24 Air Products And Chemicals, Inc. Antireflective coatings for photovoltaic applications
JP4598876B2 (ja) * 2008-04-02 2010-12-15 三井化学株式会社 組成物の製造方法、多孔質材料及びその形成方法、層間絶縁膜、半導体材料、半導体装置、並びに低屈折率表面保護膜
US20100151206A1 (en) 2008-12-11 2010-06-17 Air Products And Chemicals, Inc. Method for Removal of Carbon From An Organosilicate Material
US8557877B2 (en) 2009-06-10 2013-10-15 Honeywell International Inc. Anti-reflective coatings for optically transparent substrates
JP5708191B2 (ja) * 2010-05-19 2015-04-30 セントラル硝子株式会社 保護膜形成用薬液
TWI413185B (zh) * 2010-08-19 2013-10-21 國立交通大學 一種形成鍺半導體表面保護層的方法
TWI410087B (zh) 2010-12-20 2013-09-21 Ind Tech Res Inst 多核心晶片網路
US20120237676A1 (en) * 2011-03-14 2012-09-20 Intermolecular, Inc. Sol-gel based formulations and methods for preparation of hydrophobic ultra low refractive index anti-reflective coatings on glass
US8864898B2 (en) 2011-05-31 2014-10-21 Honeywell International Inc. Coating formulations for optical elements
WO2014071090A1 (en) 2012-10-31 2014-05-08 Sba Materials, Inc. Compositions of low-k dielectric sols containing nonmetallic catalysts
DE102013107240A1 (de) * 2013-07-09 2015-01-15 Institut Für Verbundwerkstoffe Gmbh Gemisch zur Herstellung von Nanopartikeln aus Siliziumdioxid, Verwendung eines solchen Gemisches, Verfahren zur Herstellung von Nanopartikeln aus Siliziumdioxid, Verwendung von nach dem Verfahren hergestellten Nanopartikeln aus Siliziumdioxid sowie nach dem Verfahren hergestellte Nanopartikel aus Siliziumdioxid
EP3194502A4 (en) 2015-04-13 2018-05-16 Honeywell International Inc. Polysiloxane formulations and coatings for optoelectronic applications
US9773698B2 (en) 2015-09-30 2017-09-26 International Business Machines Corporation Method of manufacturing an ultra low dielectric layer
US20190134663A1 (en) * 2017-10-27 2019-05-09 Versum Materials Us, Llc Silacyclic Compounds and Methods for Depositing Silicon-Containing Films Using Same
KR102267504B1 (ko) 2017-12-22 2021-06-21 주식회사 엘지화학 메조포러스 실리카 코팅층을 포함하는 광학 부재의 제조방법 및 이를 이용하여 제조된 광학 부재
US11158498B2 (en) * 2018-06-19 2021-10-26 Versum Materials Us, Llc Silicon compounds and methods for depositing films using same
CN110330235B (zh) * 2019-06-11 2021-10-01 惠科股份有限公司 多孔二氧化硅薄膜及其制备方法、以及显示面板

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US42210A (en) * 1864-04-05 Apparatus for upsetting tires
US189495A (en) * 1877-04-10 Improvement in piles for nail-plates
US5268193A (en) 1988-06-28 1993-12-07 Amoco Corporation Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings
US5206091A (en) 1988-06-28 1993-04-27 Amoco Corporation Low dielectric constant, low moisture uptake polyimides and copolyimides for interlevel dielectrics and substrate coatings
JPH09143420A (ja) 1995-09-21 1997-06-03 Asahi Glass Co Ltd 低誘電率樹脂組成物
US6126733A (en) 1997-10-31 2000-10-03 Alliedsignal Inc. Alcohol based precursors for producing nanoporous silica thin films
DK199800404U3 (da) 1998-10-28 1999-07-09 Joergen Holberg Fenger CD - system
US6329017B1 (en) 1998-12-23 2001-12-11 Battelle Memorial Institute Mesoporous silica film from a solution containing a surfactant and methods of making same
EP1144310B1 (en) * 1998-12-23 2007-05-30 Battelle Memorial Institute Mesoporous silica film from a solution containing a surfactant and methods of making same
DE60021476T2 (de) 1999-06-04 2006-05-24 Jsr Corp. Beschichtungszusammensetzung für die Filmherstellung und Material für isolierenden Schichten
US6495478B1 (en) * 1999-06-21 2002-12-17 Taiwan Semiconductor Manufacturing Company Reduction of shrinkage of poly(arylene ether) for low-K IMD
JP2001048977A (ja) * 1999-08-12 2001-02-20 Jsr Corp ポリアルキレンオキサイド誘導体の精製方法、膜形成用組成物、膜形成方法および低密度膜
US6410151B1 (en) 1999-09-29 2002-06-25 Jsr Corporation Composition for film formation, method of film formation, and insulating film
US6410150B1 (en) 1999-09-29 2002-06-25 Jsr Corporation Composition for film formation, method of film formation, and insulating film
US6592980B1 (en) * 1999-12-07 2003-07-15 Air Products And Chemicals, Inc. Mesoporous films having reduced dielectric constants
US6365266B1 (en) * 1999-12-07 2002-04-02 Air Products And Chemicals, Inc. Mesoporous films having reduced dielectric constants
KR100677782B1 (ko) * 2000-01-17 2007-02-05 제이에스알 가부시끼가이샤 절연막 형성용 재료의 제조 방법
EP1127929B1 (en) 2000-02-28 2009-04-15 JSR Corporation Composition for film formation, method of film formation, and silica-based film
US6576568B2 (en) 2000-04-04 2003-06-10 Applied Materials, Inc. Ionic additives for extreme low dielectric constant chemical formulations
JP2001287910A (ja) * 2000-04-04 2001-10-16 Asahi Kasei Corp 多孔質ケイ素酸化物塗膜の製造方法
US6559070B1 (en) * 2000-04-11 2003-05-06 Applied Materials, Inc. Mesoporous silica films with mobile ion gettering and accelerated processing
US6495479B1 (en) 2000-05-05 2002-12-17 Honeywell International, Inc. Simplified method to produce nanoporous silicon-based films
TW452920B (en) 2000-05-12 2001-09-01 Taiwan Semiconductor Mfg Method for forming low dielectric constant material
EP1197998A3 (en) 2000-10-10 2005-12-21 Shipley Company LLC Antireflective porogens
TW471108B (en) 2000-11-27 2002-01-01 Shr Min Preparation of ultra low dielectric constant silicon dioxide film with nanometer pores
US6406794B1 (en) 2001-02-08 2002-06-18 Jsr Corporation Film-forming composition
JP2002285086A (ja) 2001-03-26 2002-10-03 Jsr Corp 膜形成用組成物、膜の形成方法およびシリカ系膜
KR100432152B1 (ko) 2001-04-12 2004-05-17 한국화학연구원 다분지형 폴리알킬렌 옥시드 포로젠과 이를 이용한저유전성 절연막
US7307343B2 (en) * 2002-05-30 2007-12-11 Air Products And Chemicals, Inc. Low dielectric materials and methods for making same
US7122880B2 (en) * 2002-05-30 2006-10-17 Air Products And Chemicals, Inc. Compositions for preparing low dielectric materials

Also Published As

Publication number Publication date
IL156231A0 (en) 2004-01-04
US7482676B2 (en) 2009-01-27
US7122880B2 (en) 2006-10-17
EP1852903A2 (en) 2007-11-07
TWI265531B (en) 2006-11-01
JP2010123992A (ja) 2010-06-03
KR20030094056A (ko) 2003-12-11
US20060249713A1 (en) 2006-11-09
EP1376671B1 (en) 2007-06-20
TWI303834B (en) 2008-12-01
SG110057A1 (en) 2005-04-28
CN100539037C (zh) 2009-09-09
TW200401310A (en) 2004-01-16
IL188790A0 (en) 2008-04-13
JP2004161601A (ja) 2004-06-10
EP1852903A3 (en) 2008-12-10
US20040048960A1 (en) 2004-03-11
KR100561884B1 (ko) 2006-03-17
IL156231A (en) 2009-02-11
DE60314475D1 (de) 2007-08-02
TW200703375A (en) 2007-01-16
CN1487567A (zh) 2004-04-07
DE60314475T2 (de) 2008-02-28
US20060249818A1 (en) 2006-11-09
EP1376671A1 (en) 2004-01-02
US7294585B2 (en) 2007-11-13

Similar Documents

Publication Publication Date Title
ATE365376T1 (de) Zusammensetzungen für die herstellung von materialien mit niedriger dielektrizitätskonstante
DE602004017794D1 (de) Materialien mit niedriger Dielektrizitätskonstante und Herstellungsverfahren dafür
EP1369907A3 (en) Low dielectric materials and methods for making same
WO2002066485A3 (en) Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom
EP1637565A4 (en) HARDENING COMPOSITION
EP1709699B8 (de) Konjugierte polymere, deren darstellung und verwendung
BR9915582A (pt) Partìculas de pó baseado em metal isolado recozìvel, processo de preparo das mesmas, e, processo para produzir um componente de núcleo.
MY127991A (en) Polymer compositions which exhibit high hot tack
WO2003070809A3 (en) Organosiloxanes and their use in dielectric films of semiconductors
BR9809483A (pt) Composição de reticulação, processo para faze-la, e, uso da mesma.
BR0111139A (pt) Utilização de pelo menos uma hidrotalcita, composição de polìmero, artigo acabado, e, pneumático
EP1253172A4 (en) ELASTOMER MOLDING FOR SEMICONDUCTOR MANUFACTURING APPARATUS AND CROSSLINKABLE FLUORINE ELASTOMER COMPOSITION
DE60308508D1 (de) Extrudierbare thermoplastische zusammensetzungen
EP1420439A3 (en) Non-thermal process for forming porous low dielectric constant films
EP0961299A4 (en) PRODUCTION OF POSITIVE TEMPERATURE COEFFICIENT SEMICONDUCTOR CERAMIC
WO2002062897A8 (de) Polyorganosiloxan-zusammensetzung
ATE301687T1 (de) Harzzusammensetzung, verfahren zur herstellung und füllstoffmischungen zur verwendung darin
WO2005030460A3 (en) Molding composition and method of use
WO2004096902A3 (en) Antimicrobial pre-vulcanized rubber compositions and antimicrobial vuclanized rubber articles
WO2016072134A1 (ja) コンベアベルト用ゴム組成物、及びこれを用いるコンベアベルト
EP1411080A3 (en) Thermoplastic resin composition comprising a composition derived from a softening agent
CN115595799A (zh) 含有橡胶成分的耐光老化优异的聚烯烃人造革基材及人造革
KR100596626B1 (ko) 휴대기기 케이스용 고무 조성물 및 이를 이용한 휴대기기용케이스의 제조방법
CN104945691A (zh) 一种高抗疲劳性的阻燃型橡胶材料的配方
DE60103666D1 (de) Verwendung einer nano-füllstoff enthaltenden polyolefinzusammensetzung für die herstellung von verbesserten gegenständen

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties