ATE355933T1 - Schleifartikel zur modifizierung einer halbleiterscheibe - Google Patents

Schleifartikel zur modifizierung einer halbleiterscheibe

Info

Publication number
ATE355933T1
ATE355933T1 AT01948381T AT01948381T ATE355933T1 AT E355933 T1 ATE355933 T1 AT E355933T1 AT 01948381 T AT01948381 T AT 01948381T AT 01948381 T AT01948381 T AT 01948381T AT E355933 T1 ATE355933 T1 AT E355933T1
Authority
AT
Austria
Prior art keywords
modifying
semiconductor disc
grinding article
grinding
article
Prior art date
Application number
AT01948381T
Other languages
German (de)
English (en)
Inventor
Wesley J Bruxvoort
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE355933T1 publication Critical patent/ATE355933T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT01948381T 2001-02-07 2001-06-14 Schleifartikel zur modifizierung einer halbleiterscheibe ATE355933T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/778,530 US6612917B2 (en) 2001-02-07 2001-02-07 Abrasive article suitable for modifying a semiconductor wafer

Publications (1)

Publication Number Publication Date
ATE355933T1 true ATE355933T1 (de) 2007-03-15

Family

ID=25113664

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01948381T ATE355933T1 (de) 2001-02-07 2001-06-14 Schleifartikel zur modifizierung einer halbleiterscheibe

Country Status (9)

Country Link
US (1) US6612917B2 (enExample)
EP (1) EP1360033B1 (enExample)
JP (1) JP2004524683A (enExample)
KR (1) KR100721883B1 (enExample)
AT (1) ATE355933T1 (enExample)
DE (1) DE60127179T2 (enExample)
MY (1) MY122784A (enExample)
TW (1) TW586986B (enExample)
WO (1) WO2002062527A1 (enExample)

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US6684704B1 (en) * 2002-09-12 2004-02-03 Psiloquest, Inc. Measuring the surface properties of polishing pads using ultrasonic reflectance
US6632129B2 (en) * 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
US7160173B2 (en) * 2002-04-03 2007-01-09 3M Innovative Properties Company Abrasive articles and methods for the manufacture and use of same
DE10228344B4 (de) * 2002-06-25 2007-02-08 Infineon Technologies Ag Verfahren zur Herstellung von Mikrostrukturen sowie Anordnung von Mikrostrukturen
US6838169B2 (en) * 2002-09-11 2005-01-04 Psiloquest, Inc. Polishing pad resistant to delamination
CN100551623C (zh) 2003-01-10 2009-10-21 3M创新有限公司 应用于化学机械平面化的垫结构
US6908366B2 (en) 2003-01-10 2005-06-21 3M Innovative Properties Company Method of using a soft subpad for chemical mechanical polishing
US7089081B2 (en) * 2003-01-31 2006-08-08 3M Innovative Properties Company Modeling an abrasive process to achieve controlled material removal
KR100504941B1 (ko) * 2003-05-09 2005-08-02 매그나칩 반도체 유한회사 화학적 기계적 연마 장치
US6997777B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
KR100590202B1 (ko) * 2003-08-29 2006-06-15 삼성전자주식회사 연마 패드 및 그 형성방법
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
CN100341667C (zh) * 2003-11-21 2007-10-10 联华电子股份有限公司 研磨构件
US6951509B1 (en) * 2004-03-09 2005-10-04 3M Innovative Properties Company Undulated pad conditioner and method of using same
US7086939B2 (en) * 2004-03-19 2006-08-08 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring with integral polymer backing
US7485028B2 (en) 2004-03-19 2009-02-03 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same
US20050227590A1 (en) * 2004-04-09 2005-10-13 Chien-Min Sung Fixed abrasive tools and associated methods
US7198549B2 (en) * 2004-06-16 2007-04-03 Cabot Microelectronics Corporation Continuous contour polishing of a multi-material surface
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
US7837888B2 (en) * 2006-11-13 2010-11-23 Cabot Microelectronics Corporation Composition and method for damascene CMP
US20100009606A1 (en) * 2008-07-10 2010-01-14 3M Innovative Properties Company Conversion assemblage adaptable for use in combination with a surface modifying apparatus and method thereof
US20100009607A1 (en) * 2008-07-10 2010-01-14 3M Innovative Properties Company Conversion assemblage adaptable for use in combination with a surface modifying apparatus and method thereof
US8469775B2 (en) * 2008-07-10 2013-06-25 3M Innovative Properties Company Conversion assemblage adaptable for use in combination with a surface modifying apparatus and method thereof
KR20100096459A (ko) * 2009-02-24 2010-09-02 삼성전자주식회사 화학적 기계적 연마장치
US9221148B2 (en) 2009-04-30 2015-12-29 Rdc Holdings, Llc Method and apparatus for processing sliders for disk drives, and to various processing media for the same
US20110104989A1 (en) * 2009-04-30 2011-05-05 First Principles LLC Dressing bar for embedding abrasive particles into substrates
US8801497B2 (en) * 2009-04-30 2014-08-12 Rdc Holdings, Llc Array of abrasive members with resilient support
US20100330890A1 (en) 2009-06-30 2010-12-30 Zine-Eddine Boutaghou Polishing pad with array of fluidized gimballed abrasive members
JP5617387B2 (ja) * 2010-07-06 2014-11-05 富士電機株式会社 垂直磁気記録媒体用基板の製造方法、および、該製造方法により製造される垂直磁気記録媒体用基板
JP5687118B2 (ja) * 2011-04-15 2015-03-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
CN102658522A (zh) * 2012-05-16 2012-09-12 南京英星光学仪器有限公司 球面光学元件加工用固结磨料研磨抛光垫
JP6279309B2 (ja) * 2013-12-20 2018-02-14 スリーエム イノベイティブ プロパティズ カンパニー 研磨用クッション、研磨装置、研磨方法、及び当該研磨方法により研磨された対象物を含む物品
CN106457508B (zh) * 2014-05-21 2019-05-31 富士纺控股株式会社 研磨垫及其制造方法
US10613258B2 (en) * 2016-09-13 2020-04-07 Ubright Optronics Corporation Optical assembly and the method to make the same
JP7273796B2 (ja) * 2017-08-25 2023-05-15 スリーエム イノベイティブ プロパティズ カンパニー 表面突起研磨パッド
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods

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US4244775A (en) 1979-04-30 1981-01-13 Bell Telephone Laboratories, Incorporated Process for the chemical etch polishing of semiconductors
US4374077A (en) 1980-02-01 1983-02-15 Minnesota Mining And Manufacturing Company Process for making information carrying discs
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US4588258A (en) 1983-09-12 1986-05-13 Minnesota Mining And Manufacturing Company Cube-corner retroreflective articles having wide angularity in multiple viewing planes
US5183597A (en) 1989-02-10 1993-02-02 Minnesota Mining And Manufacturing Company Method of molding microstructure bearing composite plastic articles
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US5020283A (en) 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
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US5212910A (en) 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5287663A (en) 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers
US6022264A (en) 1997-02-10 2000-02-08 Rodel Inc. Polishing pad and methods relating thereto
CA2113318A1 (en) * 1993-01-28 1994-07-29 Robert J. Jantschek Abrasive attachment system for rotative abrading applications
JPH06262532A (ja) * 1993-03-05 1994-09-20 Fuji Photo Film Co Ltd 研磨体
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US5607341A (en) 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
BR9509116A (pt) * 1994-09-30 1997-11-18 Minnesota Mining & Mfg Artigo abrasivo revestido processos para produzir o mesmo e processo para desbastar uma peça dura
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DE69606168T2 (de) 1995-03-02 2000-09-28 Minnesota Mining And Mfg. Co., Saint Paul Verfahren zur strukturierung eines substates unter verwendung eines strukturierten schleifartikels
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JP3329644B2 (ja) * 1995-07-21 2002-09-30 株式会社東芝 研磨パッド、研磨装置及び研磨方法
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5609517A (en) 1995-11-20 1997-03-11 International Business Machines Corporation Composite polishing pad
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JPH09248756A (ja) * 1996-03-08 1997-09-22 Chiyoda Kk 研磨布
TW349896B (en) 1996-05-02 1999-01-11 Applied Materials Inc Apparatus and chemical mechanical polishing system for polishing a substrate
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US5897930A (en) 1996-12-31 1999-04-27 Minnesota Mining And Manufacturing Company Multiple embossed webs
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JPH10329005A (ja) * 1997-06-03 1998-12-15 Toshiba Corp 研磨布及び研磨装置
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US6234875B1 (en) * 1999-06-09 2001-05-22 3M Innovative Properties Company Method of modifying a surface

Also Published As

Publication number Publication date
HK1061375A1 (en) 2004-09-17
US6612917B2 (en) 2003-09-02
MY122784A (en) 2006-05-31
DE60127179T2 (de) 2007-11-08
DE60127179D1 (de) 2007-04-19
EP1360033A1 (en) 2003-11-12
KR100721883B1 (ko) 2007-05-25
JP2004524683A (ja) 2004-08-12
US20020106980A1 (en) 2002-08-08
EP1360033B1 (en) 2007-03-07
TW586986B (en) 2004-05-11
KR20030074802A (ko) 2003-09-19
WO2002062527A8 (en) 2003-11-06
WO2002062527A1 (en) 2002-08-15

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties