ATE331055T1 - Komposit-plattierungsverfahren - Google Patents
Komposit-plattierungsverfahrenInfo
- Publication number
- ATE331055T1 ATE331055T1 AT01908353T AT01908353T ATE331055T1 AT E331055 T1 ATE331055 T1 AT E331055T1 AT 01908353 T AT01908353 T AT 01908353T AT 01908353 T AT01908353 T AT 01908353T AT E331055 T1 ATE331055 T1 AT E331055T1
- Authority
- AT
- Austria
- Prior art keywords
- fine particles
- composite plating
- plating process
- present
- metal
- Prior art date
Links
- 238000007747 plating Methods 0.000 title abstract 3
- 239000002131 composite material Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 239000010419 fine particle Substances 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 2
- -1 aromatic azo compound Chemical group 0.000 abstract 1
- 238000005868 electrolysis reaction Methods 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/10—Electrophoretic coating characterised by the process characterised by the additives used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000061264A JP3945956B2 (ja) | 2000-03-06 | 2000-03-06 | 複合めっき方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE331055T1 true ATE331055T1 (de) | 2006-07-15 |
Family
ID=18581425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01908353T ATE331055T1 (de) | 2000-03-06 | 2001-03-06 | Komposit-plattierungsverfahren |
Country Status (9)
Country | Link |
---|---|
US (1) | US6635166B2 (de) |
EP (1) | EP1201792B1 (de) |
JP (1) | JP3945956B2 (de) |
KR (1) | KR100503574B1 (de) |
CN (1) | CN1260400C (de) |
AT (1) | ATE331055T1 (de) |
DE (1) | DE60120874T2 (de) |
TW (1) | TWI228547B (de) |
WO (1) | WO2001066831A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4862192B2 (ja) * | 2005-09-29 | 2012-01-25 | Dowaメタルテック株式会社 | 複合めっき材の製造方法 |
US8585885B2 (en) * | 2007-08-28 | 2013-11-19 | Rohm And Haas Electronic Materials Llc | Electrochemically deposited indium composites |
US9217205B2 (en) * | 2007-12-11 | 2015-12-22 | Enthone Inc. | Electrolytic deposition of metal-based composite coatings comprising nano-particles |
US8226807B2 (en) * | 2007-12-11 | 2012-07-24 | Enthone Inc. | Composite coatings for whisker reduction |
EP2543750B1 (de) * | 2010-02-04 | 2019-06-05 | Nippon Precision Jewel Industry Co., Ltd | Kühlkörpermaterial |
TWI539034B (zh) | 2012-03-02 | 2016-06-21 | 羅門哈斯電子材料有限公司 | 碳黑及金屬之複合物 |
JP5907302B1 (ja) * | 2015-05-15 | 2016-04-26 | 住友金属鉱山株式会社 | 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法 |
JP5907301B1 (ja) | 2015-05-15 | 2016-04-26 | 住友金属鉱山株式会社 | 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法 |
CN105350056B (zh) * | 2015-11-24 | 2017-12-01 | 安徽天思朴超精密模具股份有限公司 | 耐磨损电镀液材料组合物和耐磨损电镀液的制备方法及应用 |
CN106399990B (zh) * | 2016-08-16 | 2019-09-20 | 深圳市诚达科技股份有限公司 | 一种基于不锈钢表面的抗结焦纳米材料及其制备方法 |
DE102018005348A1 (de) * | 2018-07-05 | 2020-01-09 | Dr.-Ing. Max Schlötter GmbH & Co KG | Silberelektrolyt zur Abscheidung von Dispersions-Silberschichten und Kontaktoberflächen mit Dispersions-Silberschichten |
CN110983393A (zh) * | 2019-12-27 | 2020-04-10 | 广东电网有限责任公司电力科学研究院 | 一种银-碳化铌复合镀层及其制备方法 |
CN113584535B (zh) * | 2021-07-27 | 2022-08-16 | 哈尔滨银光电镀有限公司 | 一种铝合金用镀镍液 |
CN113502518B (zh) * | 2021-07-27 | 2022-05-06 | 临沂利信铝业有限公司 | 一种耐磨损铝合金复合材料 |
CN113584542B (zh) * | 2021-07-27 | 2022-07-26 | 东莞普瑞得五金塑胶制品有限公司 | 一种在铝合金表面镀镍的方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5855236B2 (ja) * | 1975-07-17 | 1983-12-08 | ソニー株式会社 | 酸性Ni電気メッキ浴 |
US3996114A (en) * | 1975-12-17 | 1976-12-07 | John L. Raymond | Electroplating method |
US4036711A (en) * | 1975-12-18 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
ATE436T1 (de) * | 1978-06-06 | 1981-12-15 | Akzo N.V. | Verfahren zum absetzen von anorganische partikel enthaltenden zusammengesetzten schichten aus einem elektrolytischen bad. |
DE3313871C1 (de) * | 1983-04-16 | 1984-05-24 | MTU Motoren- und Turbinen-Union München GmbH, 8000 München | Bad zur galvanischen Dispersionsabscheidung |
JP2607681B2 (ja) | 1989-05-19 | 1997-05-07 | 三菱重工業株式会社 | 複合メッキ方法 |
DE19654953A1 (de) * | 1996-06-01 | 1998-03-26 | Glyco Metall Werke | Schichtwerkstoff für Gleitelemente |
-
2000
- 2000-03-06 JP JP2000061264A patent/JP3945956B2/ja not_active Expired - Fee Related
-
2001
- 2001-03-06 DE DE60120874T patent/DE60120874T2/de not_active Expired - Fee Related
- 2001-03-06 US US09/959,722 patent/US6635166B2/en not_active Expired - Fee Related
- 2001-03-06 TW TW090105087A patent/TWI228547B/zh not_active IP Right Cessation
- 2001-03-06 CN CNB018003842A patent/CN1260400C/zh not_active Expired - Fee Related
- 2001-03-06 WO PCT/JP2001/001732 patent/WO2001066831A1/ja active IP Right Grant
- 2001-03-06 KR KR10-2001-7014089A patent/KR100503574B1/ko not_active IP Right Cessation
- 2001-03-06 EP EP01908353A patent/EP1201792B1/de not_active Expired - Lifetime
- 2001-03-06 AT AT01908353T patent/ATE331055T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1363000A (zh) | 2002-08-07 |
JP2001247998A (ja) | 2001-09-14 |
EP1201792A1 (de) | 2002-05-02 |
EP1201792A4 (de) | 2005-03-23 |
WO2001066831A1 (fr) | 2001-09-13 |
TWI228547B (en) | 2005-03-01 |
DE60120874T2 (de) | 2006-12-28 |
US20020157957A1 (en) | 2002-10-31 |
DE60120874D1 (de) | 2006-08-03 |
CN1260400C (zh) | 2006-06-21 |
KR20020007399A (ko) | 2002-01-26 |
JP3945956B2 (ja) | 2007-07-18 |
EP1201792B1 (de) | 2006-06-21 |
KR100503574B1 (ko) | 2005-07-29 |
US6635166B2 (en) | 2003-10-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |