ATE323130T1 - Härtbare epoxidharzzusammensetzung enthaltend bromierte triazine-flammschutzmittel - Google Patents
Härtbare epoxidharzzusammensetzung enthaltend bromierte triazine-flammschutzmittelInfo
- Publication number
- ATE323130T1 ATE323130T1 AT00307502T AT00307502T ATE323130T1 AT E323130 T1 ATE323130 T1 AT E323130T1 AT 00307502 T AT00307502 T AT 00307502T AT 00307502 T AT00307502 T AT 00307502T AT E323130 T1 ATE323130 T1 AT E323130T1
- Authority
- AT
- Austria
- Prior art keywords
- epoxy resin
- preferred
- resin composition
- composition containing
- flame retardants
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31518—Next to glass or quartz
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Polyethers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/393,772 US6387990B1 (en) | 1999-09-10 | 1999-09-10 | Curable epoxy resin compositions with brominated triazine flame retardants |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE323130T1 true ATE323130T1 (de) | 2006-04-15 |
Family
ID=23556189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00307502T ATE323130T1 (de) | 1999-09-10 | 2000-08-31 | Härtbare epoxidharzzusammensetzung enthaltend bromierte triazine-flammschutzmittel |
Country Status (7)
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001072887A1 (en) * | 2000-03-28 | 2001-10-04 | Parlex Corporation | Screen printable flame retardant coating |
US6906120B1 (en) * | 2000-06-20 | 2005-06-14 | General Electric | Poly(arylene ether) adhesive compositions |
KR100792099B1 (ko) * | 2001-01-30 | 2008-01-04 | 히다치 가세고교 가부시끼가이샤 | 열경화성 수지 조성물 및 그의 용도 |
JP2003332749A (ja) * | 2002-01-11 | 2003-11-21 | Denso Corp | 受動素子内蔵基板、その製造方法及び受動素子内蔵基板形成用素板 |
JP4102112B2 (ja) * | 2002-06-06 | 2008-06-18 | 株式会社東芝 | 半導体装置及びその製造方法 |
KR100561070B1 (ko) * | 2003-09-05 | 2006-03-15 | 주식회사 엘지화학 | 고속전송 회로기판용 열경화성 수지 조성물 |
US7101933B2 (en) * | 2003-12-10 | 2006-09-05 | Uniplus Electronics Co., Ltd. | Process for producing high speed transmitting dielectric material |
US20070004871A1 (en) * | 2005-06-30 | 2007-01-04 | Qiwei Lu | Curable composition and method |
US7378455B2 (en) * | 2005-06-30 | 2008-05-27 | General Electric Company | Molding composition and method, and molded article |
US7429800B2 (en) | 2005-06-30 | 2008-09-30 | Sabic Innovative Plastics Ip B.V. | Molding composition and method, and molded article |
US20070287983A1 (en) * | 2006-06-07 | 2007-12-13 | Richard Worthington Lodge | Absorbent article having an anchored core assembly |
US20080071035A1 (en) * | 2006-09-15 | 2008-03-20 | Delsman Erik R | Curable poly(arylene ether) composition and method |
US20080071036A1 (en) * | 2006-09-15 | 2008-03-20 | Delsman Erik R | Cured poly(arylene ether) composition, method, and article |
US9056031B2 (en) | 2007-09-07 | 2015-06-16 | The Procter & Gamble Company | Disposable wearable absorbent articles with anchoring subsystems |
WO2009117345A2 (en) | 2008-03-17 | 2009-09-24 | Henkel Corporation | Adhesive compositions for use in die attach applications |
CN102597089B (zh) * | 2009-08-28 | 2015-08-19 | 帕克电气化学有限公司 | 热固性树脂组合物及物件 |
US8698320B2 (en) * | 2009-12-07 | 2014-04-15 | Henkel IP & Holding GmbH | Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices |
US20110315435A1 (en) * | 2010-06-28 | 2011-12-29 | Ming Jen Tzou | Acid anhydride curable thermosetting resin composition |
US8859672B2 (en) | 2011-06-27 | 2014-10-14 | Sabic Global Technologies B.V. | Poly(arylene ether)-poly(hydroxy ether) block copolymer and method of making |
US8552105B2 (en) | 2012-03-08 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Compatibilized composition, method for the formation thereof, and article comprising same |
US8686079B2 (en) | 2012-04-13 | 2014-04-01 | Sabic Innovative Plastics Ip B.V. | Compatibilized composition, method for the formation thereof, and article comprising same |
KR101730283B1 (ko) * | 2012-10-31 | 2017-04-25 | 셍기 테크놀로지 코. 엘티디. | 열경화성 수지 조성물 및 그 용도 |
US8865823B2 (en) | 2013-02-01 | 2014-10-21 | Sabic Global Technologies B.V. | Triblock copolymer, method for its formation, and compatibilized compositions comprising it |
CN104177828A (zh) * | 2014-07-30 | 2014-12-03 | 同济大学 | 一种改性的双马来酰亚胺树脂胶膜的制备方法 |
JP7008331B2 (ja) * | 2018-07-18 | 2022-01-25 | 学校法人加計学園 | 難燃性化合物、その難燃性化合物で化学修飾したリグノセルロース及び木粉、並びにそれらを含有する樹脂組成物 |
CN110317433A (zh) * | 2019-07-15 | 2019-10-11 | 山东金宝电子股份有限公司 | 一种半固化片及其制备方法 |
WO2021106847A1 (ja) * | 2019-11-28 | 2021-06-03 | 東洋紡株式会社 | 接着フィルム、積層体およびプリント配線板 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US403938A (en) * | 1889-05-28 | Stove-oven | ||
US2444536A (en) | 1946-05-14 | 1948-07-06 | Du Pont | Synthesis of nu-aryl-maleimides |
US3595900A (en) | 1968-07-01 | 1971-07-27 | Minnesota Mining & Mfg | Cyanatophenyl-terminated polyarylene ethers |
US3590042A (en) * | 1968-09-05 | 1971-06-29 | Universal Oil Prod Co | N-s-triazyl imides of halo substituted polyhydropolycyclicdicarboxylic acids |
US3733349A (en) | 1971-03-30 | 1973-05-15 | Minnesota Mining & Mfg | Fluorocarbon cyanates |
JPS5082082A (US06770691-20040803-C00010.png) * | 1973-11-14 | 1975-07-03 | ||
JPS5328200B2 (US06770691-20040803-C00010.png) | 1973-12-21 | 1978-08-12 | ||
JPS5114995A (en) | 1974-07-29 | 1976-02-05 | Mitsubishi Gas Chemical Co | Shiansanesuterukiganjufuenoorujushino seizohoho |
JPS51114494A (en) | 1975-04-02 | 1976-10-08 | Mitsubishi Gas Chem Co Inc | Preparation of cyanic acid eaters of aromatic polycarbonate |
DE2620423B2 (de) | 1976-05-08 | 1978-06-22 | Stopinc Ag, Zug (Schweiz) | Schieberplatteneinheit fur Schieberverschlüsse |
DE2628417C2 (de) | 1976-06-24 | 1985-08-14 | Bayer Ag, 5090 Leverkusen | Härtbare Mischungen |
DE3111403A1 (de) | 1980-03-24 | 1982-01-14 | Mitsubishi Gas Chemical Co., Inc., Tokyo | Haertbare polyphenylenaetherharzmasse |
US4528366A (en) | 1982-09-28 | 1985-07-09 | The Dow Chemical Company | Production of polytriazines from aromatic polycyanates with cobalt salt of a carboxylic acid as catalyst |
US4849486A (en) | 1985-07-10 | 1989-07-18 | Nippon Oil Co., Ltd. | Polyphenylene ether resin composition |
US4604452A (en) | 1985-10-21 | 1986-08-05 | Celanese Corporation | Metal carboxylate/alkylphenol curing catalyst for polycyanate esters of polyhydric phenols |
US4709008A (en) | 1986-06-30 | 1987-11-24 | Interez, Inc. | Blend of tris (cyanatophenyl) alkane and bis(cyanatophenyl) alkane |
US4740584A (en) | 1986-09-08 | 1988-04-26 | Interez, Inc. | Blend of dicyanate esters of dihydric phenols |
JPH01272619A (ja) | 1987-07-22 | 1989-10-31 | Mitsubishi Gas Chem Co Inc | エポキシ樹脂組成物 |
US4785075A (en) | 1987-07-27 | 1988-11-15 | Interez, Inc. | Metal acetylacetonate/alkylphenol curing catalyst for polycyanate esters of polyhydric phenols |
US4902752A (en) | 1987-10-05 | 1990-02-20 | Hi-Tek Polymers, Inc. | Polycyanate esters of polyhydric phenols blended with thermoplastic polymers |
US4983683A (en) | 1987-10-05 | 1991-01-08 | Hi-Tek Polymers, Inc. | Polycyanate esters of polyhydric phenols blended with thermoplastic polymers |
US4975319A (en) | 1988-07-14 | 1990-12-04 | General Electric Company | Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether |
US5141791A (en) | 1988-10-11 | 1992-08-25 | General Electric Company | Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom |
US5043367A (en) | 1988-12-22 | 1991-08-27 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production |
US5218030A (en) | 1989-02-08 | 1993-06-08 | Asahi Kasei Kogyo Kabushiki Kaisha | Curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom |
US5213886A (en) | 1989-02-17 | 1993-05-25 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions |
US5068309A (en) | 1990-03-29 | 1991-11-26 | Hi-Tek Polymers, Inc. | Low temperature curable dicyanate ester of dihydric phenol composition |
US5149863A (en) | 1990-03-29 | 1992-09-22 | Hi-Tek Polymers, Inc. | Low temperature curable dicyanate esters of dihydric phenols |
CN1036402C (zh) | 1991-01-11 | 1997-11-12 | 旭化成工业株式会社 | 可固化的聚苯氧树脂组合物及由它制成的薄膜 |
JPH083398A (ja) * | 1994-06-21 | 1996-01-09 | Idemitsu Petrochem Co Ltd | 難燃性樹脂組成物 |
US5834565A (en) | 1996-11-12 | 1998-11-10 | General Electric Company | Curable polyphenylene ether-thermosetting resin composition and process |
JPH11209723A (ja) | 1998-01-30 | 1999-08-03 | Hitachi Chem Co Ltd | 難燃化接着剤、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
-
1999
- 1999-09-10 US US09/393,772 patent/US6387990B1/en not_active Expired - Fee Related
-
2000
- 2000-08-31 DE DE60027239T patent/DE60027239T2/de not_active Expired - Fee Related
- 2000-08-31 AT AT00307502T patent/ATE323130T1/de not_active IP Right Cessation
- 2000-08-31 EP EP00307502A patent/EP1083198B1/en not_active Expired - Lifetime
- 2000-09-01 TW TW089117926A patent/TW546334B/zh not_active IP Right Cessation
- 2000-09-07 KR KR1020000053014A patent/KR100707572B1/ko not_active IP Right Cessation
- 2000-09-08 JP JP2000272402A patent/JP2001192538A/ja active Pending
-
2002
- 2002-02-27 US US09/683,880 patent/US6774160B2/en not_active Expired - Fee Related
- 2002-02-27 US US09/683,887 patent/US6770691B2/en not_active Expired - Fee Related
- 2002-02-27 US US09/683,883 patent/US6767639B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1083198A3 (en) | 2001-10-17 |
US20020111398A1 (en) | 2002-08-15 |
KR100707572B1 (ko) | 2007-04-13 |
DE60027239T2 (de) | 2007-03-15 |
JP2001192538A (ja) | 2001-07-17 |
EP1083198A2 (en) | 2001-03-14 |
US20020107308A1 (en) | 2002-08-08 |
DE60027239D1 (de) | 2006-05-24 |
EP1083198B1 (en) | 2006-04-12 |
TW546334B (en) | 2003-08-11 |
US6767639B2 (en) | 2004-07-27 |
US6387990B1 (en) | 2002-05-14 |
KR20010050370A (ko) | 2001-06-15 |
US6770691B2 (en) | 2004-08-03 |
US6774160B2 (en) | 2004-08-10 |
US20020107307A1 (en) | 2002-08-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60027239D1 (de) | Härtbare Epoxidharzzusammensetzung enthaltend bromierte Triazine-Flammschutzmittel | |
BR9913002B1 (pt) | composto de fenoxifosfazeno reticulado, seu processo de preparação, retardante de chama compreendendo o referido composto, composições de resina retardante de chama e artigos moldados de resina retardante de chama. | |
TW200736317A (en) | Non-halogen flame-retardant resin compositions | |
ATE370991T1 (de) | Polyphenylenoxid-harze, prepregs, schichtplatten, gedruckte leiterplatten und gedruckte multilayer- leiterplatten | |
CA2275247A1 (en) | Crosslinked phenoxyphosphazene compounds, flame retardant, flame-retardant resin compositions, and moldings of flame-retardant resins | |
DE60023752D1 (de) | Feuerhemmende phosporenthaltende epoxidharzzusammensetzung | |
FI901084A0 (fi) | Epoksidihartsimuovausmassoja | |
EP1167484A3 (en) | Poly(arylene ether) adhesive compositions | |
EP1063262A4 (en) | THERMO-CURABLE POLYPHENYLENE ETHER COMPOSITION, HARD RESIN COMPOSITION THEREOF AND LAYER STRUCTURE | |
KR102403614B1 (ko) | 수지 조성물, 바니시, 적층판 및 인쇄회로기판 | |
JPS59113055A (ja) | ポリフエニレンスルフイド樹脂組成物 | |
EP0921158A3 (en) | Poly(phenylene ether) thermoset compositions | |
KR940003263B1 (ko) | 리이드 프레임 삽입용 수지재료와 그 성형부품 | |
US5206340A (en) | Integrated circuit socket comprising a polyimide polymer | |
TW200613437A (en) | Highly flame-retardant and uv-blocking modified epoxy resin compositions | |
JP2702814B2 (ja) | 金属をインサートした成形品 | |
KR100361973B1 (ko) | 난연 폴리카보네이트 수지 조성물 | |
JPS6330578A (ja) | エポキシ樹脂系レジストインク組成物 | |
JPS6431862A (en) | Polymer composition having excellent heat resistance and solvent resistance | |
US4870138A (en) | Semi-interpenetrating polymer networks | |
JP3135371B2 (ja) | 金属端子をインサートした樹脂成形部品 | |
MY121156A (en) | Thermosetting resin composition for build-up method | |
SU855741A1 (ru) | Электроизол ционный пропиточный состав | |
KR100419064B1 (ko) | 에폭시 수지 조성물 | |
KR940007080A (ko) | 에폭시수지조성물 및 구리피복적층판 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |