ATE323130T1 - Härtbare epoxidharzzusammensetzung enthaltend bromierte triazine-flammschutzmittel - Google Patents

Härtbare epoxidharzzusammensetzung enthaltend bromierte triazine-flammschutzmittel

Info

Publication number
ATE323130T1
ATE323130T1 AT00307502T AT00307502T ATE323130T1 AT E323130 T1 ATE323130 T1 AT E323130T1 AT 00307502 T AT00307502 T AT 00307502T AT 00307502 T AT00307502 T AT 00307502T AT E323130 T1 ATE323130 T1 AT E323130T1
Authority
AT
Austria
Prior art keywords
epoxy resin
preferred
resin composition
composition containing
flame retardants
Prior art date
Application number
AT00307502T
Other languages
German (de)
English (en)
Inventor
Gary William Yeager
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Application granted granted Critical
Publication of ATE323130T1 publication Critical patent/ATE323130T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
AT00307502T 1999-09-10 2000-08-31 Härtbare epoxidharzzusammensetzung enthaltend bromierte triazine-flammschutzmittel ATE323130T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/393,772 US6387990B1 (en) 1999-09-10 1999-09-10 Curable epoxy resin compositions with brominated triazine flame retardants

Publications (1)

Publication Number Publication Date
ATE323130T1 true ATE323130T1 (de) 2006-04-15

Family

ID=23556189

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00307502T ATE323130T1 (de) 1999-09-10 2000-08-31 Härtbare epoxidharzzusammensetzung enthaltend bromierte triazine-flammschutzmittel

Country Status (7)

Country Link
US (4) US6387990B1 (US06770691-20040803-C00001.png)
EP (1) EP1083198B1 (US06770691-20040803-C00001.png)
JP (1) JP2001192538A (US06770691-20040803-C00001.png)
KR (1) KR100707572B1 (US06770691-20040803-C00001.png)
AT (1) ATE323130T1 (US06770691-20040803-C00001.png)
DE (1) DE60027239T2 (US06770691-20040803-C00001.png)
TW (1) TW546334B (US06770691-20040803-C00001.png)

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WO2009117345A2 (en) 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
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US8698320B2 (en) * 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
US20110315435A1 (en) * 2010-06-28 2011-12-29 Ming Jen Tzou Acid anhydride curable thermosetting resin composition
US8859672B2 (en) 2011-06-27 2014-10-14 Sabic Global Technologies B.V. Poly(arylene ether)-poly(hydroxy ether) block copolymer and method of making
US8552105B2 (en) 2012-03-08 2013-10-08 Sabic Innovative Plastics Ip B.V. Compatibilized composition, method for the formation thereof, and article comprising same
US8686079B2 (en) 2012-04-13 2014-04-01 Sabic Innovative Plastics Ip B.V. Compatibilized composition, method for the formation thereof, and article comprising same
KR101730283B1 (ko) * 2012-10-31 2017-04-25 셍기 테크놀로지 코. 엘티디. 열경화성 수지 조성물 및 그 용도
US8865823B2 (en) 2013-02-01 2014-10-21 Sabic Global Technologies B.V. Triblock copolymer, method for its formation, and compatibilized compositions comprising it
CN104177828A (zh) * 2014-07-30 2014-12-03 同济大学 一种改性的双马来酰亚胺树脂胶膜的制备方法
JP7008331B2 (ja) * 2018-07-18 2022-01-25 学校法人加計学園 難燃性化合物、その難燃性化合物で化学修飾したリグノセルロース及び木粉、並びにそれらを含有する樹脂組成物
CN110317433A (zh) * 2019-07-15 2019-10-11 山东金宝电子股份有限公司 一种半固化片及其制备方法
WO2021106847A1 (ja) * 2019-11-28 2021-06-03 東洋紡株式会社 接着フィルム、積層体およびプリント配線板

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Also Published As

Publication number Publication date
EP1083198A3 (en) 2001-10-17
US20020111398A1 (en) 2002-08-15
KR100707572B1 (ko) 2007-04-13
DE60027239T2 (de) 2007-03-15
JP2001192538A (ja) 2001-07-17
EP1083198A2 (en) 2001-03-14
US20020107308A1 (en) 2002-08-08
DE60027239D1 (de) 2006-05-24
EP1083198B1 (en) 2006-04-12
TW546334B (en) 2003-08-11
US6767639B2 (en) 2004-07-27
US6387990B1 (en) 2002-05-14
KR20010050370A (ko) 2001-06-15
US6770691B2 (en) 2004-08-03
US6774160B2 (en) 2004-08-10
US20020107307A1 (en) 2002-08-08

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