ATE321429T1 - BROADBAND MINIATURE CONVERTER - Google Patents

BROADBAND MINIATURE CONVERTER

Info

Publication number
ATE321429T1
ATE321429T1 AT01959715T AT01959715T ATE321429T1 AT E321429 T1 ATE321429 T1 AT E321429T1 AT 01959715 T AT01959715 T AT 01959715T AT 01959715 T AT01959715 T AT 01959715T AT E321429 T1 ATE321429 T1 AT E321429T1
Authority
AT
Austria
Prior art keywords
miniature converter
broadband miniature
broadband
converter
film
Prior art date
Application number
AT01959715T
Other languages
German (de)
Inventor
Michael Pedersen
Peter V Loeppert
Sung Bok Lee
Original Assignee
Knowles Electronics Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/910,110 external-priority patent/US6987859B2/en
Application filed by Knowles Electronics Llc filed Critical Knowles Electronics Llc
Application granted granted Critical
Publication of ATE321429T1 publication Critical patent/ATE321429T1/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts

Abstract

A raised micro-structure is disclosed for use in a silicon based device. The raised micro-structure comprises a generally planar film having a ribbed sidewall supporting the film.
AT01959715T 2000-08-11 2001-08-10 BROADBAND MINIATURE CONVERTER ATE321429T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63740100A 2000-08-11 2000-08-11
US09/910,110 US6987859B2 (en) 2001-07-20 2001-07-20 Raised microstructure of silicon based device

Publications (1)

Publication Number Publication Date
ATE321429T1 true ATE321429T1 (en) 2006-04-15

Family

ID=27092826

Family Applications (2)

Application Number Title Priority Date Filing Date
AT01959715T ATE321429T1 (en) 2000-08-11 2001-08-10 BROADBAND MINIATURE CONVERTER
AT04076015T ATE392790T1 (en) 2000-08-11 2001-08-10 RAISED MICROSTRUCTURES

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT04076015T ATE392790T1 (en) 2000-08-11 2001-08-10 RAISED MICROSTRUCTURES

Country Status (9)

Country Link
EP (2) EP1469701B1 (en)
JP (3) JP4338395B2 (en)
KR (1) KR100571967B1 (en)
CN (2) CN1498513B (en)
AT (2) ATE321429T1 (en)
AU (1) AU2001281241A1 (en)
DE (2) DE60118208T2 (en)
DK (2) DK1469701T3 (en)
WO (1) WO2002015636A2 (en)

Families Citing this family (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535460B2 (en) 2000-08-11 2003-03-18 Knowles Electronics, Llc Miniature broadband acoustic transducer
US6987859B2 (en) 2001-07-20 2006-01-17 Knowles Electronics, Llc. Raised microstructure of silicon based device
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7439616B2 (en) 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US8629005B1 (en) 2000-11-28 2014-01-14 Knowles Electronics, Llc Methods of manufacture of bottom port surface mount silicon condenser microphone packages
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US7023066B2 (en) 2001-11-20 2006-04-04 Knowles Electronics, Llc. Silicon microphone
KR100437681B1 (en) * 2002-04-15 2004-06-30 부전전자부품 주식회사 Directional microphone
DE10238523B4 (en) 2002-08-22 2014-10-02 Epcos Ag Encapsulated electronic component and method of manufacture
US6781231B2 (en) 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
JP2004356707A (en) * 2003-05-27 2004-12-16 Hosiden Corp Sound detection mechanism
US7030536B2 (en) * 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
JP4201723B2 (en) * 2004-02-13 2008-12-24 東京エレクトロン株式会社 Capacitance detection type sensor element
DE102004020204A1 (en) 2004-04-22 2005-11-10 Epcos Ag Encapsulated electrical component and method of manufacture
US7346178B2 (en) * 2004-10-29 2008-03-18 Silicon Matrix Pte. Ltd. Backplateless silicon microphone
US7329933B2 (en) 2004-10-29 2008-02-12 Silicon Matrix Pte. Ltd. Silicon microphone with softly constrained diaphragm
JP4539450B2 (en) 2004-11-04 2010-09-08 オムロン株式会社 Capacitive vibration sensor and manufacturing method thereof
KR100685092B1 (en) * 2005-03-14 2007-02-22 주식회사 케이이씨 Micro-phone using Micro Electro Mechanical Systems process and manufacturing method the same
US7825484B2 (en) 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US7449356B2 (en) 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
US7885423B2 (en) 2005-04-25 2011-02-08 Analog Devices, Inc. Support apparatus for microphone diaphragm
SG127754A1 (en) 2005-05-16 2006-12-29 Sensfab Pte Ltd Silicon microphone
DE102005031601B4 (en) * 2005-07-06 2016-03-03 Robert Bosch Gmbh Capacitive micromechanical microphone
US8351632B2 (en) 2005-08-23 2013-01-08 Analog Devices, Inc. Noise mitigating microphone system and method
KR20080009735A (en) 2005-09-09 2008-01-29 야마하 가부시키가이샤 Capacitor microphone
KR100765149B1 (en) * 2005-10-05 2007-10-15 전자부품연구원 Micro acoustic sensing apparatus and manufacturing thereof
KR100785803B1 (en) * 2005-12-07 2007-12-13 한국전자통신연구원 Spring structure embedded microphone, speaker and speech recognition/synthesizing device
DE102006001493B4 (en) * 2006-01-11 2007-10-18 Austriamicrosystems Ag MEMS sensor and method of manufacture
CN101371614A (en) * 2006-01-20 2009-02-18 模拟设备公司 Support apparatus for condenser microphone diaphragm
JP4811035B2 (en) * 2006-01-31 2011-11-09 パナソニック電工株式会社 Acoustic sensor
JP4737721B2 (en) * 2006-03-10 2011-08-03 ヤマハ株式会社 Condenser microphone
JP2007228345A (en) * 2006-02-24 2007-09-06 Yamaha Corp Capacitor microphone
JP4737720B2 (en) * 2006-03-06 2011-08-03 ヤマハ株式会社 Diaphragm, manufacturing method thereof, condenser microphone having the diaphragm, and manufacturing method thereof
JP4737719B2 (en) * 2006-02-24 2011-08-03 ヤマハ株式会社 Condenser microphone
JP2007267049A (en) * 2006-03-29 2007-10-11 Yamaha Corp Condenser microphone
JP4605470B2 (en) * 2006-03-31 2011-01-05 ヤマハ株式会社 Condenser microphone
GB0605576D0 (en) * 2006-03-20 2006-04-26 Oligon Ltd MEMS device
TW200746869A (en) 2006-03-29 2007-12-16 Yamaha Corp Condenser microphone
JP4605544B2 (en) * 2006-03-29 2011-01-05 ヤマハ株式会社 Condenser microphone
WO2008014324A2 (en) 2006-07-25 2008-01-31 Analog Devices, Inc. Multiple microphone system
JP4567643B2 (en) * 2006-08-24 2010-10-20 パナソニック株式会社 Capacitor and manufacturing method thereof
CN101141832B (en) * 2006-09-06 2011-04-20 歌尔声学股份有限公司 Single membrane capacitance type microphone chip
JP2010506532A (en) * 2006-10-11 2010-02-25 メムス テクノロジー ビーエイチディー Extremely low pressure sensor and method for manufacturing the same
JP4144640B2 (en) 2006-10-13 2008-09-03 オムロン株式会社 Method for manufacturing vibration sensor
US7894622B2 (en) 2006-10-13 2011-02-22 Merry Electronics Co., Ltd. Microphone
EP1931173B1 (en) * 2006-12-06 2011-07-20 Electronics and Telecommunications Research Institute Condenser microphone having flexure hinge diaphragm and method of manufacturing the same
CN101584226B (en) 2007-01-17 2013-08-21 美国亚德诺半导体公司 Microphone with pressure relief
JP5034692B2 (en) * 2007-06-04 2012-09-26 オムロン株式会社 Acoustic sensor
JP5029147B2 (en) * 2007-06-04 2012-09-19 オムロン株式会社 Acoustic sensor
JP5412031B2 (en) * 2007-07-24 2014-02-12 ローム株式会社 MEMS sensor
GB2453104B (en) 2007-09-19 2012-04-25 Wolfson Microelectronics Plc Mems device and process
GB2453105B (en) 2007-09-19 2011-01-12 Wolfson Microelectronics Plc MEMS device and process
GB2452941B (en) * 2007-09-19 2012-04-11 Wolfson Microelectronics Plc Mems device and process
US20090136064A1 (en) 2007-09-28 2009-05-28 Yamaha Corporation Vibration transducer and manufacturing method therefor
JP2009089100A (en) * 2007-09-28 2009-04-23 Yamaha Corp Vibrating transducer
US8045733B2 (en) * 2007-10-05 2011-10-25 Shandong Gettop Acoustic Co., Ltd. Silicon microphone with enhanced impact proof structure using bonding wires
KR100932754B1 (en) * 2007-12-12 2009-12-21 에스텍 주식회사 Multifunction speaker
US7888754B2 (en) 2007-12-28 2011-02-15 Yamaha Corporation MEMS transducer
KR101113366B1 (en) * 2008-02-20 2012-03-02 오므론 가부시키가이샤 Electrostatic capacitive vibrating sensor
JP5332373B2 (en) 2008-07-25 2013-11-06 オムロン株式会社 Capacitance type vibration sensor
JP4419103B1 (en) 2008-08-27 2010-02-24 オムロン株式会社 Capacitance type vibration sensor
JP2010074523A (en) * 2008-09-18 2010-04-02 Rohm Co Ltd Method of etching sacrificial layer, method of manufacturing mems device, and mems device
JP2010155306A (en) 2008-12-26 2010-07-15 Panasonic Corp Microelectromechanical systems (mems) device and method of manufacturing the same
GB2467848B (en) * 2009-02-13 2011-01-12 Wolfson Microelectronics Plc MEMS device and process
US8363860B2 (en) 2009-03-26 2013-01-29 Analog Devices, Inc. MEMS microphone with spring suspended backplate
EP2239961A1 (en) * 2009-04-06 2010-10-13 Nxp B.V. Backplate for microphone
DE102009026682A1 (en) * 2009-06-03 2010-12-09 Robert Bosch Gmbh Component with a micromechanical microphone structure and method for its production
JP5513813B2 (en) * 2009-08-31 2014-06-04 新日本無線株式会社 MEMS microphone and manufacturing method thereof
CN102056061A (en) * 2009-10-29 2011-05-11 苏州敏芯微电子技术有限公司 Capacitive miniature silicon microphone and manufacturing method thereof
DE102010000666A1 (en) * 2010-01-05 2011-07-07 Robert Bosch GmbH, 70469 Component with a micromechanical microphone structure and method for its production
CN102223591B (en) * 2010-04-19 2015-04-01 联华电子股份有限公司 Wafer level packaging structure of micro electro mechanical system microphone and manufacturing method thereof
JP4947220B2 (en) 2010-05-13 2012-06-06 オムロン株式会社 Acoustic sensor and microphone
JP5402823B2 (en) 2010-05-13 2014-01-29 オムロン株式会社 Acoustic sensor
JP5400708B2 (en) 2010-05-27 2014-01-29 オムロン株式会社 Acoustic sensor, acoustic transducer, microphone using the acoustic transducer, and method of manufacturing the acoustic transducer
JP2012070120A (en) * 2010-09-22 2012-04-05 Panasonic Corp Sensor
CN102740203A (en) * 2011-04-06 2012-10-17 美律实业股份有限公司 Combined micro-electrical-mechanical-system microphone and manufacturing method of same
US20120328132A1 (en) * 2011-06-27 2012-12-27 Yunlong Wang Perforated Miniature Silicon Microphone
EP2774390A4 (en) 2011-11-04 2015-07-22 Knowles Electronics Llc Embedded dielectric as a barrier in an acoustic device and method of manufacture
JP5177309B1 (en) * 2012-01-31 2013-04-03 オムロン株式会社 Capacitive sensor
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
DE102012215251A1 (en) * 2012-08-28 2013-03-21 Robert Bosch Gmbh Micro-electro-mechanical systems component e.g. valve component, has anchorage structure setting counter-element under tensile stress so that deflections of counter-element counteract perpendicular to layer planes
JP5987572B2 (en) 2012-09-11 2016-09-07 オムロン株式会社 Acoustic transducer
JP5991475B2 (en) 2012-09-14 2016-09-14 オムロン株式会社 Acoustic transducer
CN102873020B (en) * 2012-10-12 2015-05-06 北京七星华创电子股份有限公司 Connection cover of mega sound wave energy transducer
KR101496817B1 (en) * 2013-08-09 2015-02-27 삼성전기주식회사 Acoustic Transducer
JP6179300B2 (en) 2013-09-13 2017-08-16 オムロン株式会社 Acoustic transducer and microphone
JP6345926B2 (en) * 2013-10-07 2018-06-20 新日本無線株式会社 MEMS device and manufacturing method thereof
US20150162523A1 (en) 2013-12-06 2015-06-11 Murata Manufacturing Co., Ltd. Piezoelectric device
DE102014202009A1 (en) * 2014-02-05 2015-08-06 Robert Bosch Gmbh Method and means for regulating the electrical bias on the measuring capacitor of a MEMS sensor element
US20150296306A1 (en) * 2014-04-10 2015-10-15 Knowles Electronics, Llc. Mems motors having insulated substrates
CN105359553A (en) 2014-06-27 2016-02-24 歌尔声学股份有限公司 Silicon microphone with suspended diaphragm and system with the same
CN105323687A (en) * 2014-07-14 2016-02-10 北京卓锐微技术有限公司 Silicon capacitance microphone with polycrystalline silicon layer being provided with bulges and preparation method thereof
CN104105041B (en) * 2014-07-31 2019-01-04 歌尔股份有限公司 Silicon substrate MEMS microphone and preparation method thereof
US9743191B2 (en) 2014-10-13 2017-08-22 Knowles Electronics, Llc Acoustic apparatus with diaphragm supported at a discrete number of locations
US9872116B2 (en) 2014-11-24 2018-01-16 Knowles Electronics, Llc Apparatus and method for detecting earphone removal and insertion
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
US9859879B2 (en) 2015-09-11 2018-01-02 Knowles Electronics, Llc Method and apparatus to clip incoming signals in opposing directions when in an off state
US9401158B1 (en) 2015-09-14 2016-07-26 Knowles Electronics, Llc Microphone signal fusion
CN106841396B (en) * 2015-12-03 2019-05-28 中国科学院上海微系统与信息技术研究所 Silicone base capacitance acoustic emission sensor and preparation method thereof
US9830930B2 (en) 2015-12-30 2017-11-28 Knowles Electronics, Llc Voice-enhanced awareness mode
US9779716B2 (en) 2015-12-30 2017-10-03 Knowles Electronics, Llc Occlusion reduction and active noise reduction based on seal quality
US9812149B2 (en) 2016-01-28 2017-11-07 Knowles Electronics, Llc Methods and systems for providing consistency in noise reduction during speech and non-speech periods
KR101807071B1 (en) 2016-10-06 2017-12-08 현대자동차 주식회사 Microphone and manufacturing method thereof
KR101807069B1 (en) * 2016-10-21 2017-12-08 현대자동차 주식회사 Microphone and manufacturing the same
JP6930101B2 (en) * 2016-12-12 2021-09-01 オムロン株式会社 Acoustic sensors and capacitive transducers
KR102322258B1 (en) * 2017-05-19 2021-11-04 현대자동차 주식회사 Microphone and manufacturing method thereof
DE102017217151B3 (en) 2017-09-27 2019-01-03 Robert Bosch Gmbh Micromechanical sensor
JP7067891B2 (en) 2017-10-18 2022-05-16 Ｍｍｉセミコンダクター株式会社 Transducer
DE112019004970T5 (en) 2018-10-05 2021-06-24 Knowles Electronics, Llc Microphone device with ingress protection
WO2020072904A1 (en) * 2018-10-05 2020-04-09 Knowles Electronics, Llc Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance
DE112019004979T5 (en) 2018-10-05 2021-06-17 Knowles Electronics, Llc Process for making MEMS membranes comprising corrugations
CN110657880B (en) * 2019-09-19 2022-05-03 天津大学 Novel hydrophone based on resonant air cavity
CN111405444B (en) * 2020-03-20 2022-01-25 西人马联合测控（泉州）科技有限公司 Capacitor microphone with diaphragm with holes and manufacturing method thereof
US11528546B2 (en) 2021-04-05 2022-12-13 Knowles Electronics, Llc Sealed vacuum MEMS die
US11540048B2 (en) 2021-04-16 2022-12-27 Knowles Electronics, Llc Reduced noise MEMS device with force feedback
US11649161B2 (en) 2021-07-26 2023-05-16 Knowles Electronics, Llc Diaphragm assembly with non-uniform pillar distribution
US11772961B2 (en) 2021-08-26 2023-10-03 Knowles Electronics, Llc MEMS device with perimeter barometric relief pierce
US11780726B2 (en) 2021-11-03 2023-10-10 Knowles Electronics, Llc Dual-diaphragm assembly having center constraint

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4360955A (en) * 1978-05-08 1982-11-30 Barry Block Method of making a capacitive force transducer
JPS5938621A (en) * 1982-08-27 1984-03-02 Nissan Motor Co Ltd Analyzing device for vibration
JPS6055655A (en) * 1983-09-07 1985-03-30 Nissan Motor Co Ltd Semiconductor device having beam structure
JPS61105861A (en) * 1985-06-05 1986-05-23 Nissan Motor Co Ltd Semiconductor device with beam structure
JPH0726887B2 (en) * 1986-05-31 1995-03-29 株式会社堀場製作所 Condenser Microphone type detector diaphragm
NL8702589A (en) * 1987-10-30 1989-05-16 Microtel Bv ELECTRO-ACOUSTIC TRANSDUCENT OF THE KIND OF ELECTRET, AND A METHOD FOR MANUFACTURING SUCH TRANSDUCER.
JPH05172843A (en) * 1991-12-25 1993-07-13 Omron Corp Semiconductor acceleration sensor
EP0561566B1 (en) * 1992-03-18 1999-07-28 Knowles Electronics, Inc. Solid state condenser and microphone
US5452268A (en) * 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
JP3472493B2 (en) * 1998-11-30 2003-12-02 ホシデン株式会社 Semiconductor electret condenser microphone

Also Published As

Publication number Publication date
ATE392790T1 (en) 2008-05-15
JP2004506394A (en) 2004-02-26
KR100571967B1 (en) 2006-04-18
DE60118208T2 (en) 2007-04-12
DE60118208D1 (en) 2006-05-11
CN101867858B (en) 2012-02-22
JP2007116721A (en) 2007-05-10
JP2009153203A (en) 2009-07-09
WO2002015636A3 (en) 2002-10-24
EP1310136B1 (en) 2006-03-22
CN101867858A (en) 2010-10-20
CN1498513B (en) 2010-07-14
DK1469701T3 (en) 2008-08-18
WO2002015636A2 (en) 2002-02-21
EP1469701B1 (en) 2008-04-16
EP1469701A3 (en) 2005-11-16
DE60133679D1 (en) 2008-05-29
EP1310136A2 (en) 2003-05-14
AU2001281241A1 (en) 2002-02-25
JP5049312B2 (en) 2012-10-17
DE60133679T2 (en) 2009-06-10
CN1498513A (en) 2004-05-19
EP1469701A2 (en) 2004-10-20
KR20030033026A (en) 2003-04-26
DK1310136T3 (en) 2006-07-31
JP4338395B2 (en) 2009-10-07

Similar Documents

Publication Publication Date Title
ATE321429T1 (en) BROADBAND MINIATURE CONVERTER
DE60126377D1 (en) Hybrid drive device
DE60112708D1 (en) Representation generation device
FR2817658B1 (en) SEMICONDUCTOR DEVICE
DE60142141D1 (en) Semiconductor device
DE60041439D1 (en) LIFT DEVICE
DE60043516D1 (en) LIFT DEVICE
ITTO20010424A0 (en) LASER DEVICE BASED ON SILICON NANOSTRUCTURES.
FR2810160B1 (en) SEMICONDUCTOR DEVICE
DE10191585B8 (en) Semiconductor device
DE60041514D1 (en) INVERTER DEVICE
DE60116208D1 (en) Optical scanning device
DE60132147D1 (en) Optical scanning device
NO20035329D0 (en) Device for pulling on socks
DE60129984D1 (en) PLATE RETAINING DEVICE
DE60041420D1 (en) LIFT DEVICE
FR2806540B1 (en) TELEMANIPULABLE SHEET
DE50114700D1 (en) sheet guiding device
DE60027333D1 (en) POWER CONVERTER DEVICE
DE60017628D1 (en) A semiconductor device
FR2818450B1 (en) TELEMANIPULABLE SHEET
NO20004000L (en) A holding device
DE19983978T1 (en) Sheet stacking device
IT1319829B1 (en) OSCILLATING CIRCUIT TRANSDUCER DEVICE.
ATA20772000A (en) STACK DEVICE

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties