DE102012215251A1 - Micro-electro-mechanical systems component e.g. valve component, has anchorage structure setting counter-element under tensile stress so that deflections of counter-element counteract perpendicular to layer planes - Google Patents

Micro-electro-mechanical systems component e.g. valve component, has anchorage structure setting counter-element under tensile stress so that deflections of counter-element counteract perpendicular to layer planes

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Publication number
DE102012215251A1
DE102012215251A1 DE201210215251 DE102012215251A DE102012215251A1 DE 102012215251 A1 DE102012215251 A1 DE 102012215251A1 DE 201210215251 DE201210215251 DE 201210215251 DE 102012215251 A DE102012215251 A DE 102012215251A DE 102012215251 A1 DE102012215251 A1 DE 102012215251A1
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Germany
Prior art keywords
counter
membrane
sealing
mems
component
Prior art date
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Ceased
Application number
DE201210215251
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German (de)
Inventor
Jochen Zoellin
Christoph Schelling
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Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
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Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE201210215251 priority Critical patent/DE102012215251A1/en
Publication of DE102012215251A1 publication Critical patent/DE102012215251A1/en
Ceased legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067Mechanical properties
    • B81B3/0072For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0257Microphones or microspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use

Abstract

The present invention proposes measures for fixing the position of an optionally also thin counter element in the layer structure of a MEMS component, which also contribute to the sealing effect of the sealing structure between the membrane and the counter element. The component structure of the MEMS component (10) is realized in a layer construction on a substrate (1) and comprises a deflectable membrane (11) which spans an opening (12) in the substrate rear side and with at least one deflectable electrode (13) of a capacitor arrangement is provided. Further, the component structure comprises a fixed counter element (14) with passage openings (16), which is arranged in layer construction over the membrane (11) and acts as a support for at least one fixed electrode (15) of the capacitor arrangement. Between the membrane (11) and the counter element (14), a sealing structure is formed over the edge region of the membrane (11). According to the invention, the counter element (14) is connected via an anchoring structure (18) to the substrate (1), which sets the counter element (14) under tensile stress and thus counteracts pressure or acceleration induced deflections of the counter element (14) perpendicular to the layer planes.

Description

  • State of the art
  • The invention relates to a MEMS component whose component structure is realized in a layer structure on a substrate. The MEMS device comprises a deflectable membrane which spans an opening in the back of the substrate and is provided with at least one deflectable electrode of a capacitor arrangement. Furthermore, the MEMS component comprises a fixed counter element with passage openings, which is arranged in the layer structure over the membrane and acts as a support for at least one fixed electrode of the capacitor arrangement. Over the edge region of the membrane, between the membrane and the counter element, a sealing structure is formed.
  • Such MEMS components can - depending on the design of the component structure - take over both actuator functions and sensor functions. Thus, a MEMS component of the type in question here can be designed, for example, as a valve component in which the membrane serves as a closure element. In this case, the capacitor arrangement is used for targeted activation or actuation of the closure element. However, a MEMS component of the type in question can also be designed as a pressure sensor or microphone component. In this case, the membrane is deflected due to the action of pressure. These membrane deflections can then be detected as capacitance changes of the capacitor arrangement.
  • In the US 6,535,460 B2 a microphone component of the type mentioned is described. The structure of this microphone component comprises a substrate with a passage opening, which acts as a sound opening and is covered by a membrane. A perforated counter element, which is connected to the substrate in the edge region of the sound opening, is arranged above the membrane and at a distance therefrom. Membrane and counter element together form a microphone capacitor, wherein the membrane acts as a movable electrode, while the fixed counter element is equipped with a rigid counter electrode. In the known microphone component, an annular support structure for the membrane, which serves for the acoustic seal, is formed over the edge region of the sound opening, on the underside of the fixed counter element facing the membrane. For this purpose, the membrane is electrostatically drawn against the support structure.
  • As a carrier of the fixed electrode of the capacitor arrangement, the counter element of a MEMS component of the type in question should be as rigidly bound as possible to the layer structure of the component or connected thereto. This applies equally to actuator as well as sensor applications, since the positional fixation of the counter electrode to the membrane electrode is both a prerequisite for a targeted control of the membrane and for a reliable signal acquisition. In addition, the sealing effect of the sealing structure between the membrane and the counter element is based to a large extent on the positional fixation of the counter element.
  • The counter-element is therefore usually formed in a relatively thick layer of the layer structure, such as e.g. in an epi polysilicon layer. Accordingly, the counter element known MEMS devices contributes significantly to the height of the device. The thicker the counter-element is, the greater the manufacturing expense for the structuring of the counter-element. In some applications, a thick mating element also adversely affects the function of the device. For example, the counter element of a microphone component should be as thin as possible with regard to a good noise performance.
  • Disclosure of the invention
  • The present invention proposes measures for fixing the position of a possibly also thin counter element in the layer structure of a MEMS component of the type in question, which also contribute to the sealing effect of the sealing structure between the membrane and the counter element.
  • According to the invention, the counter element is connected to the substrate via an anchoring structure, which sets the counter element under tensile stress and thus counteracts pressure or acceleration-related deflections of the counter element perpendicular to the layer planes. In this way, even a comparatively thin counter element can be reliably stabilized in its position parallel to the layer planes.
  • In a first embodiment of the invention, the anchoring structure comprises at least one circumferential anchoring wall in the edge region of the counter element, which is stabilized by a plurality of substantially radially or vertically arranged support walls. This anchoring wall may be closed or provided with openings. In any case, give her the supporting walls the necessary Kippsteifigkeit.
  • A particularly good position stabilization of the counter element can be achieved with an anchoring structure, the at least two in the Includes peripheral edge of the counter-element encircling and substantially concentric or mutually parallel anchoring walls, if they are connected to each other via a plurality of support walls.
  • As already mentioned, not only the capacitive control or signal detection is very significantly based on the positional stability of the counter element, but also the sealing effect of the sealing device between the membrane and the counter element.
  • In a preferred embodiment of the invention, this sealing structure comprises at least one first sealing element projecting from the membrane in the direction of the counter element. The height of this sealing element limits the diaphragm deflection in the direction of the counter element and thus defines the distance between the diaphragm and the counter element. Advantageously, the mechanical contact region is formed on the counter-element of an electrically non-conductive material or coated with such a material in order to avoid a short circuit between the electrodes of the capacitor arrangement. Additionally or alternatively, however, the sealing element may also be formed on the membrane of such a non-conductive material or be connected to a non-conductive region of the membrane.
  • The expression of the sealing structure and in particular the shape, number and arrangement of the first sealing elements, which project from the membrane in the direction of the counter element, depends essentially on the function of the MEMS component and the desired sealing effect.
  • For example, in the case of a valve component, it proves to be advantageous if the sealing structure comprises at least one first sealing element in the form of a closed circumferential wall. If the passage openings are arranged in the counter element within the region thus enclosed, then the flow path between the opening in the substrate and these passage openings in the counter element can then be completely closed or opened simply by actuating the membrane.
  • In contrast, the sealing structure in the case of a microphone component is not necessarily a complete interruption of the flow path, but the realization of a slow pressure equalization between the membrane front side and the membrane rear side. Namely, a microphone diaphragm not only responds to sound pressure but also to variations in ambient pressure and to pressure fluctuations due to air flow, for example in the case of wind. Such interference on the microphone signal can be reduced by a slow pressure equalization between the two sides of the membrane. This pressure compensation takes place via flow paths between the passage openings in the counter element and the sound opening in the substrate. How quickly such pressure equalization takes place depends essentially on the flow resistance of the flow paths. The smaller the flow resistance, the faster pressure equalization takes place between the membrane front side and the membrane rear side and the less influence atmospheric pressure fluctuations and air currents have on the microphone signal. However, the microphone sensitivity for low-frequency acoustic signals is also reduced. The flow resistance during pressure equalization between the membrane front side and the membrane rear side should therefore be set in accordance with the desired frequency range of the microphone component.
  • In this context, it proves to be advantageous if the sealing structure comprises a plurality of burr-like and / or columnar first sealing elements, which are optionally arranged radially offset from one another in one or more juxtapositions on the membrane edge. Since the sealing elements must be flowed around during pressure equalization between the membrane front side and the membrane rear side, the length of the flow path can here be influenced simply by size, shape, arrangement and number of the burr-like or columnar sealing elements. In this way, the flow resistance can be influenced largely independently of the chip area in a relatively large area in order to realize a specific microphone characteristic.
  • Both the mechanical and the acoustic sealing effect of the at least one first sealing element can be improved if it is equipped with an end face enlarged contact surface for the counter element. As a result, not only the mechanical contact surface between the sealing element and the counter element but also the flow path between the membrane and the through holes in the counter element is increased.
  • In a particularly advantageous development of the invention, the sealing structure comprises, in addition to the at least one first sealing element projecting from the membrane in the direction of the counter element, a limiting structure complementary thereto. As a result, the sealing effect of the sealing structure can be significantly improved. The greater the degree of gearing between the first sealing element and the complementary limiting structure, the better the sealing effect. In order to achieve a uniform sealing effect, regardless of the degree of membrane deflection, should engage the first sealing element and the limiting structure in all possible states of movement of the membrane and thus also in the resting state. Furthermore, the limiting structure can be designed and used as overload protection for the lateral movement of the membrane. In this case, the limiting structure also contributes to the robustness of the entire component structure.
  • The delimiting structure is realized in the form of at least one second sealing element formed in the counter element, wherein the manufacturing method and thus also the shape of the second sealing element essentially depends on the type of counter element and in particular on its thickness.
  • In a first embodiment of the invention, which is independent of the thickness of the counter-element, the at least one second sealing element is simply realized in the form of a structural element which protrudes from the counter-element in the direction of the membrane. It makes sense for the first and second sealing elements to be offset relative to one another so that they are guided past one another when the diaphragm is deflected in the direction of the counter element and do not impair the diaphragm deflection, while diaphragm deflections in the diaphragm plane are limited by the second sealing element.
  • In a further advantageous embodiment of the invention, the at least one second sealing element is realized in the form of a trench or blind hole-like recess in the counter element, which requires a certain minimum thickness of the counter element. In the case of very thin counter-elements, the at least one second sealing element can also be realized in the form of a protuberance of the counter-element pointing away from the membrane. In these embodiments, the at least one first sealing element is introduced in a deflection of the membrane in the direction counter element in the complementary recess or protuberance of the counter element, without affecting this membrane deflection, while membrane deflections are limited in the membrane plane by the recess or protuberance in the counter element.
  • Mechanical stresses in the device structure may affect the function of a MEMS device of the type in question and are therefore to be avoided as much as possible. In this context, it proves to be advantageous if the membrane is integrated via at least one bending beam or at least one spring element in the layer structure of the MEMS device. Any mechanical stresses in the membrane structure are derived here via the membrane suspension, so that the membrane itself is largely stress-free. The bending beam or the spring element can either be connected to the substrate or else with the counter element.
  • This type of membrane suspension also offers the possibility to realize a simple substrate-side overload protection for the membrane structure. For this purpose, the membrane surface is designed so that the membrane at least partially extends beyond the edge region of the opening in the substrate. In this case, therefore, the edge region of the opening in the substrate forms a substrate-side stop for the membrane.
  • The above-described variants of the component structure of a MEMS component according to the invention can be produced using semiconductor processes and methods of micromechanics in a semiconductor layer structure on a semiconductor substrate.
  • However, it is also possible to realize the component structure on a CMOS substrate. In this case, the membrane and the at least one first sealing element are realized in the backend stack, in particular in the metal planes of the backend stack.
  • Brief description of the drawings
  • As already discussed above, there are various possibilities for embodying and developing the present invention in an advantageous manner. For this purpose, reference is made on the one hand to the claims subordinate to claim 1 and on the other hand to the following description of several embodiments of the invention with reference to FIGS.
  • 1a shows a schematic sectional view through the component structure of a first MEMS device according to the invention 10 .
  • 1b shows a plan view of the counter element of this device 10 and
  • 1c shows a plan view of the membrane of this device 10 ,
  • 2a shows a schematic sectional view through the component structure of a second MEMS device according to the invention 20 .
  • 2 B shows a plan view of the counter element of this device 20 , and
  • 2c shows a plan view of the membrane of this device 20 ,
  • 3a shows a schematic sectional view through the component structure of a third inventive MEMS device 30 and
  • 3b shows a plan view of the counter element 34 this device 30 ,
  • 4 shows a schematic sectional view through the component structure of a fourth MEMS device according to the invention 40 which is implemented in a CMOS substrate.
  • Embodiments of the invention
  • The component structure of the in the 1a to 1c represented MEMS device 10 is in a layer structure on a semiconductor substrate 1 realized, especially by 1a is illustrated.
  • It includes a membrane 11 that have an opening 12 spans in the back of the substrate. The membrane 11 is with an electrode 13 equipped with the membrane 11 from the in 1a shown rest position is deflectable. Because the membrane 11 here over the edge of the opening 12 extends beyond the diaphragm deflection substrate side through the edge region of the opening 12 limited. The edge area of the opening 12 So here acts as a stop for the membrane 11 and thus forms a substrate-side overload protection for the component structure. In the present embodiment, the electrode 13 on the opening 12 facing bottom of the membrane 11 arranged. Likewise, the membrane electrode could 13 but also on the top of the membrane 11 be arranged.
  • Furthermore, the component structure of the MEMS component comprises 10 a fixed counter element 14 that in layer construction over the membrane 11 is arranged. In the middle region of the counter element 14 are through holes 16 educated. On the membrane 11 facing bottom of the counter element 14 is a fixed electrode 15 arranged, together with the deflectable membrane electrode 13 forms a capacitor arrangement. Alternatively, the fixed counter electrode could 15 but also on the side facing away from the membrane top of the mating element 14 be arranged. Depending on the function of the MEMS device 10 can this
  • Capacitor arrangement either for driving and operating the membrane 11 be used or for detecting deflections of the membrane 11 in the form of a capacitance change of the capacitor arrangement.
  • The device structure of the MEMS device 10 further comprises a sealing structure between the membrane 11 and the counter element 14 that over the edge of the membrane 11 is trained. In the illustrated embodiment, columnar sealing elements serve 171 as a sealing structure. These sealing elements 171 protrude from the membrane 11 towards counter element 14 From and end have an enlarged contact surface 170 for the counter element 14 on. The arrangement of the sealing elements 171 in the edge region of the membrane 11 will be described below in connection with 1c explained in more detail.
  • According to the invention, the relatively thin counter element 14 of the MEMS device 10 via an anchoring structure 18 to the substrate 1 Tied, so that the counter element 14 is under a position-stabilizing tensile stress. The structure of the anchoring structure 18 is especially by 1b illustrated. It comprises two anchoring walls in the present embodiment 181 and 182 , which are in the edge area of the circular counter element 14 are arranged circumferentially and concentrically with each other. These circular anchoring walls 181 and 182 are over several radially oriented retaining walls 183 connected to each other, the anchoring walls 181 and 182 give a certain tilting stiffness.
  • 1b also illustrates the grid-shaped arrangement of the through holes 16 in the central region of the counter element 14 , over which also the counter electrode 15 the capacitor arrangement extends.
  • Like the counter element 14 so is the membrane 11 of the MEMS device 10 circular, which in particular by 1c is illustrated. The membrane 11 Here is just a bending beam 19 connected to the layer structure of the component structure, so that it is largely free of mechanical stresses. The also circular membrane electrode 13 is in the middle region of the membrane 11 arranged while the border area 111 the membrane 11 is not conductive. The electrical connection cable 131 the membrane electrode 13 runs over the bending beam 19 outward. The columnar sealing elements 171 are in non-conductive border area 111 the membrane 11 arranged, on two concentric circular lines, radially offset from each other so that they form a relatively large flow resistance. The sealing elements 171 are here in the form of protuberances in the membrane structure in the direction counter element 14 realized. Because no electrical connection between the sealing elements 171 and the membrane electrode 13 exists, it can not come even in the case of contact to a short circuit of the capacitor arrangement.
  • The device structure of the MEMS device 10 is particularly suitable for microphone applications. So affects the relatively thin but still stable in its position counter element 14 favorable to the noise performance. In addition, the largely stress-free suspension of the membrane favors 11 a high signal-to-noise ratio as well as the acoustic sealing effect of the sealing elements 171 ,
  • Also, the component structure of the in the 2a to 2c represented MEMS device 20 is in a layer structure on a semiconductor substrate 1 realized and includes a circular membrane 21 that have an opening 22 spans in the substrate back, as well as a fixed counter element 24 that in layer construction over the membrane 21 is arranged. The membrane 21 is - as well as the membrane 11 of the MEMS device 10 - over a bending beam 29 integrated into the layer structure of the component structure and extends beyond the edge region of the opening 22 in addition, so that the diaphragm deflection on the substrate side by the edge region of the opening 22 is limited.
  • In the case of the MEMS device 20 is the membrane 21 However, a total of a conductive material and acts accordingly as a total deflectable electrode of a capacitor array. The fixed counter electrode 25 This capacitor arrangement covers the middle region of the counter element 24 , where also passage openings 26 are formed. The connection of the relatively thin counter element 24 to the substrate 1 via an anchoring structure 28 is especially by 2 B illustrated. The anchoring structure 28 consists essentially of an annular anchoring wall 281 , which are in the edge area of the circular counter element 24 is arranged circumferentially and via a plurality of radially outwardly oriented support walls 283 is supported.
  • Also the MEMS device 20 includes a sealing structure between the membrane 21 and the counter element 24 that over the edge of the membrane 21 is trained. In the case of the MEMS device 20 this sealing structure comprises a first sealing element 271 and a complementary boundary structure 272 , As the first sealing element 271 serves a closed circular wall, which is in the edge area of the membrane 21 is formed and towards the counter element 24 protrudes from this. This is especially through 2 B illustrated. The complementary boundary structure 272 comprises two circular closed walls, which are in the edge region of the counter element 24 are formed and towards the membrane 21 protrude from this. All three walls 271 and 272 are arranged concentrically to one another, wherein the one wall 272 within the sealing element 271 is arranged and the other outside of the sealing element 271 , 2a illustrates that the sealing element 271 and the complementary bounding structure 272 even in the resting state of the membrane 21 mesh. The border area 241 of the counter element 24 with the complementary boundary structure 272 is made of an electrically non-conductive material, so that no electrical connection to the counter electrode 25 consists. As a result, even in the case of a mechanical contact between the sealing elements 271 . 272 and the respectively opposite structural element prevents a short circuit of the capacitor arrangement.
  • The device structure of the MEMS device 20 can be used as a valve, for example. In this case, the membrane is used 21 as a closure element, which is actuated by means of the capacitor arrangement to the flow between the rear side opening 22 and the passage openings 26 in the counter element 24 to control. The relatively thin but still stable in its position counter element 24 in connection with the largely tension-free suspension of the membrane 21 favors a precise control of the sealing membrane 21 , In addition, can be with the above-described sealing structure 271 . 272 achieve a very good sealing or sealing effect.
  • This in 3a illustrated MEMS device 30 is also in a layered construction on a semiconductor substrate 1 realized. It includes a circular membrane 31 that have an opening 32 spans in the substrate back, as well as a fixed counter element 34 with passage openings 36 that in layer construction over the membrane 31 is arranged. The membrane 31 that extends up over the edge of the opening 32 extends beyond is several spring elements 39 involved in the layer structure of the component structure. The spring elements 39 are here with the counter element 34 but can also work well with the substrate 1 be connected. In the middle region of the membrane 31 there is an electrode 33 that together with an electrode 35 on the central region of the counter element 34 forms a capacitor arrangement. The connection of the relatively thin counter element 34 to the substrate 1 via an anchoring structure 38 that is the counter element 34 stabilized in its position parallel to the layer planes of the component structure, in particular by 3b illustrated. The anchoring structure 38 is here by a on the circumference of the counter element 34 circumferential anchoring wall 38 formed in which circular segment-shaped wall sections 381 . 382 and radially outwardly or inwardly oriented wall sections 383 alternate. This alternating juxtaposition of circular segment-shaped and radially oriented wall sections gives the anchoring wall 38 the required tilting rigidity and sets the counter element 34 overall under a tensile stress parallel to the layer planes.
  • The sealing structure of the MEMS device 30 between the membrane 31 and the counter element 34 includes first sealing elements 371 in the form of burr-like protuberances, in the edge region of the membrane 31 strung together and towards the counter element 34 protrude from this. In the counter element 34 is one to the sealing elements 371 complementary boundary structure 372 formed in the form of protuberances. 3 illustrates that the first sealing elements 371 even in the resting state of the membrane 31 into the complementary boundary structure 372 of the counter element 34 protrude.
  • The component structure of in 4 represented MEMS device 40 Although also in a layer structure on a substrate 1 realized, however, the layer structure is the back-end stack of a CMOS substrate.
  • Again, the membrane spans 41 an opening 42 in the substrate back. The entire membrane structure with the membrane 41 and first sealing elements 47 is limited by the metal levels of the backend stack and correspondingly arranged vias between these metal levels. This is how the membrane becomes 41 essentially by two superposed metal layers 411 . 412 defined, which also act as a membrane electrode. The shape of the first sealing elements 47 coming from the membrane 41 Abrasive, is essentially due to the arrangement and design of the vias 413 determined between the metal levels of the backend stack. The relatively thin fixed counter element 44 with the counter electrode 45 and passage openings 46 is formed in further layers on the backend stack. The counter element 44 can also be attached to the substrate via an anchoring structure 1 or the backend stack are tied, as already in connection with 1b has been described and explained.
  • QUOTES INCLUDE IN THE DESCRIPTION
  • This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
  • Cited patent literature
    • US 6535460 B2 [0003]

Claims (15)

  1. MEMS device ( 10 ), whose component structure in a layer structure on a substrate ( 1 ) is realized, with a deflectable membrane ( 11 ), which has an opening ( 12 ) spanned in the substrate back and with at least one deflectable electrode ( 13 ) is provided with a capacitor arrangement, • with a fixed counter element ( 14 ) with passage openings ( 16 ), which in the layer structure over the membrane ( 11 ) and as a support for at least one fixed electrode ( 15 ) of the capacitor arrangement, and • having a sealing structure between the membrane ( 11 ) and the counter element ( 14 ), which over the edge region of the membrane ( 11 ) is trained; characterized in that the counter element ( 14 ) via an anchoring structure ( 18 ) to the substrate ( 1 ), which is the counter element ( 14 ) under tensile stress sets and pressure or acceleration-related deflections of the counter element ( 14 ) counteracts perpendicular to the layer planes.
  2. MEMS device ( 20 ) according to claim 1, characterized in that the anchoring structure ( 28 ) at least one in the edge region of the counter element ( 24 ) circumferential anchoring wall ( 281 ) arranged over a plurality of substantially radially or perpendicular thereto arranged support walls ( 283 ) is stabilized.
  3. MEMS device ( 10 ) according to claim 1 or 2, characterized in that the anchoring structure ( 18 ) at least two in the edge region of the counter element ( 14 ) circumferential and substantially concentric or parallel to each other anchoring walls ( 181 . 182 ), which has several retaining walls ( 183 ) are interconnected.
  4. MEMS device ( 10 ) according to one of claims 1 to 3, characterized in that the sealing structure at least one of the membrane in the direction counter element ( 14 ) protruding first sealing element ( 171 ).
  5. MEMS device ( 20 ) according to one of claims 1 to 4, characterized in that the sealing structure at least a first sealing element ( 271 ) in the form of a closed circumferential wall.
  6. MEMS device ( 10 ) according to one of claims 1 to 5, characterized in that the sealing structure a plurality of burr-like and / or columnar first sealing elements ( 171 ), which are arranged in one or more juxtapositions on the edge of the membrane optionally radially offset from one another.
  7. MEMS device ( 10 ) according to one of claims 1 to 6, characterized in that the at least one first sealing element ( 171 ) an end enlarged contact surface ( 170 ) for the counter element ( 14 ) having.
  8. MEMS device ( 20 ) according to one of claims 1 to 7, characterized in that the sealing structure at least one in the counter element ( 24 ) formed second sealing element ( 272 ) in the form of a first sealing element ( 271 ) complementary boundary structure ( 272 ).
  9. MEMS device ( 20 ) according to one of claims 1 to 8, characterized in that the at least one second sealing element ( 272 ) in the form of a counter element ( 24 ) towards the membrane ( 21 ) projecting structural element is realized.
  10. MEMS device ( 30 ) according to one of claims 1 to 9, characterized in that the at least one second sealing element ( 372 ) in the form of a trench or blind hole-like recess in the counter element or a protuberance pointing away from the membrane (US Pat. 372 ) of the counter element ( 34 ) is realized.
  11. MEMS device ( 10 ; 30 ) according to one of claims 1 to 10, characterized in that the membrane ( 11 ) via at least one bending beam ( 19 ) or at least one spring element ( 39 ) in the layer structure of the MEMS device ( 10 ; 30 ) is involved.
  12. MEMS device ( 10 ) according to claim 11, characterized in that the membrane ( 11 ) at least partially over the edge region of the opening ( 12 ) in the substrate ( 1 ) extends.
  13. MEMS device ( 40 ) according to one of claims 1 to 12, characterized in that the component structure on a CMOS substrate ( 1 ) is realized, wherein the membrane ( 41 ) and the at least one first sealing element ( 47 ) are implemented in the backend stack, in particular in the metal levels of the backend stack.
  14. Valve component ( 20 ) according to any one of claims 1 to 13, wherein the membrane ( 21 ) serves as a closure element and the capacitor arrangement for driving the membrane ( 21 ) is being used.
  15. Microphone component ( 10 ) according to one of claims 1 to 13, wherein the capacitor arrangement is used for signal detection.
DE201210215251 2012-08-28 2012-08-28 Micro-electro-mechanical systems component e.g. valve component, has anchorage structure setting counter-element under tensile stress so that deflections of counter-element counteract perpendicular to layer planes Ceased DE102012215251A1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140105428A1 (en) * 2012-10-11 2014-04-17 Robert Bosch Gmbh Component having a micromechanical microphone structure
WO2014194062A1 (en) * 2013-05-29 2014-12-04 Robert Bosch Gmbh Mesh in mesh backplate for micromechanical microphone
DE102013224718A1 (en) * 2013-12-03 2015-06-03 Robert Bosch Gmbh MEMS microphone component and device having such a MEMS microphone component
DE102017217151B3 (en) 2017-09-27 2019-01-03 Robert Bosch Gmbh Micromechanical sensor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140105428A1 (en) * 2012-10-11 2014-04-17 Robert Bosch Gmbh Component having a micromechanical microphone structure
US9131319B2 (en) * 2012-10-11 2015-09-08 Robert Bosch Gmbh Component having a micromechanical microphone structure
WO2014194062A1 (en) * 2013-05-29 2014-12-04 Robert Bosch Gmbh Mesh in mesh backplate for micromechanical microphone
US9820059B2 (en) 2013-05-29 2017-11-14 Robert Bosch Gmbh Mesh in mesh backplate for micromechanical microphone
DE102013224718A1 (en) * 2013-12-03 2015-06-03 Robert Bosch Gmbh MEMS microphone component and device having such a MEMS microphone component
US9571938B2 (en) 2013-12-03 2017-02-14 Robert Bosch Gmbh Microphone element and device for detecting acoustic and ultrasound signals
DE102017217151B3 (en) 2017-09-27 2019-01-03 Robert Bosch Gmbh Micromechanical sensor

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