CN102740203A - Combined micro-electrical-mechanical-system microphone and manufacturing method of same - Google Patents
Combined micro-electrical-mechanical-system microphone and manufacturing method of same Download PDFInfo
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- CN102740203A CN102740203A CN2011100875387A CN201110087538A CN102740203A CN 102740203 A CN102740203 A CN 102740203A CN 2011100875387 A CN2011100875387 A CN 2011100875387A CN 201110087538 A CN201110087538 A CN 201110087538A CN 102740203 A CN102740203 A CN 102740203A
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Abstract
The invention provides a combined micro-electrical-mechanical-system microphone, comprising a first base plate, a second base plate, a diaphragm, a rear board and a containing groove. The first base plate is provided with a first cavity, the diaphragm is arranged on the first cavity, the second base plate is provided with a second cavity, one side of the rear board is arranged on the second cavity, and the other side is arranged on the diaphragm, so as to make the second base plate combined on the first base plate. The rear board is provided with a plurality of sound holes. The containing groove is arranged between the first base plate and the second base plate, so as to form space between the diaphragm and the rear board. The technical scheme in the invention can guarantee that a central part of the diaphragm is contained in the containing groove preformed on the base plate, so the diaphragm is protected in the containing groove and the strength of the whole structure can be enhanced. The product and the method are very practical.
Description
Technical field
The present invention relates to a kind of micro-electro-mechanical microphone, particularly relate to a kind of convolution micro-electro-mechanical microphone and manufacturing approach thereof.
Background technology
Micro-electro-mechanical microphone is the product that present electroacoustic industry does one's utmost to develop, and it can be applied on each item portable electronic devices widely, so as to meeting microminiaturization and having the effect of radio reception concurrently.
As shown in Figure 1, be existing convention micro-electro-mechanical microphone sketch map, it includes one first chip 1 and one second chip 2 that is provided with on it; And a vibrating diaphragm 3, the second chips 2 are set on first chip 1, and that a backboard 4 is set is corresponding with vibrating diaphragm 3, and is provided with a supporting construction 5 between first chip 1 and second chip 2; In order to admit vibrating diaphragm 3; Keeping vibrating diaphragm 3 in the zone that 5 circles of supporting construction are established, and not influenced by stress, wherein supporting construction 5 mainly is arranged in the groove 6 of backboard 4.
Yet; The height of supporting construction 5 must precisely cooperate with the degree of depth of groove 6, otherwise first chip 1 and second chip 2 be after combining, the as easy as rolling off a log actuating pressure when combining of supporting construction 5; Be out of shape or damage and produce, so structure control yield on making is quite difficult; Moreover; Owing to the practice that the supporting construction 5 and second chip 2 directly combine, eutectic reaction can take place with silicon (Si) layer of second chip 2 in its material that must consider supporting construction 5, and is therefore very limited on material chosen; In addition; The vibrating diaphragm 3 that should have the convention micro-electro-mechanical microphone now is to be a floating structure, and it needs to adopt sacrifice layer usually in technology the practice so seems not to be easy on implementation of processes.
Because the defective that above-mentioned existing micro-electro-mechanical microphone exists; The inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge; And cooperate the utilization of studying the science, actively study innovation, in the hope of founding a kind of convolution micro-electro-mechanical microphone and manufacturing approach thereof of new structure; Can improve general existing micro electronmechanical Mike, make it have more practicality.Through constantly research, design, and, found out the present invention of true tool practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Because above-mentioned problem the objective of the invention is to, overcome the defective that existing micro-electro-mechanical microphone exists; And a kind of convolution micro-electro-mechanical microphone and manufacturing approach thereof are provided; Technical problem to be solved is that the central part of vibrating diaphragm is placed in the storage tank of substrate moulding in advance, makes vibrating diaphragm in groove, be protected; Promote overall construction intensity according to this, be very suitable for practicality.
The object of the invention and to solve its technical problem be that technical scheme below adopting realizes.According to the present invention a kind of convolution micro-electro-mechanical microphone is provided, it includes one first substrate, one second substrate, a vibrating diaphragm, a backboard and a storage tank.First substrate has one first chamber, and vibrating diaphragm is provided with on first chamber, and second substrate has one second chamber; Backboard one side is arranged on second chamber; Opposite side is arranged at vibrating diaphragm, so that second substrate bonded is on first substrate, and backboard has several sound holes; Storage tank is arranged between first substrate and this second substrate, uses so that form a space between vibrating diaphragm and the backboard.
The object of the invention and solve its technical problem and can also adopt following technical measures to come further to realize.
Preferable, aforesaid convolution micro-electro-mechanical microphone, wherein this storage tank is arranged at this first substrate, and is communicated with this first chamber so that the central part of this vibrating diaphragm be installed with place in.
Preferable, aforesaid convolution micro-electro-mechanical microphone, wherein this storage tank is arranged at this second substrate, and is communicated with this second chamber so that the central part of this backboard be installed with place in.
Preferable, aforesaid convolution micro-electro-mechanical microphone, wherein this vibrating diaphragm is provided with a conductive layer, and this conductive layer is located between this backboard and this vibrating diaphragm, and these conductive layer both sides are as the routing zone.
Preferable; Aforesaid convolution micro-electro-mechanical microphone; Wherein be provided with between this vibrating diaphragm and this first substrate one select earth silicon material for use first insulating barrier, this vibrating diaphragm is provided with one second insulating barrier, be provided with between this backboard and this second substrate one select earth silicon material for use the 3rd insulating barrier.
Preferable, aforesaid convolution micro-electro-mechanical microphone, wherein this vibrating diaphragm is to select silicon nitride material for use.
The object of the invention and to solve its technical problem be that technical scheme below adopting realizes.According to the present invention a kind of manufacturing approach of convolution micro-electro-mechanical microphone is provided, comprises one first substrate is provided, make a storage tank above that; And make a vibrating diaphragm on first substrate, the central authorities of vibrating diaphragm are placed in storage tank, and one second substrate is provided; Making one has the backboard of several sound holes on it, with first substrate and second substrate bonded, makes and forms a space between vibrating diaphragm and the backboard; The both sides of second substrate are removed,, go out one first chamber and one second chamber at first substrate and second substrate manufacture respectively so that first substrate exposes; Utilize mechanical system that the both sides of first substrate are removed, to produce the convolution micro-electro-mechanical microphone.
Preferable, the manufacturing approach of aforesaid convolution micro-electro-mechanical microphone, wherein the side of this first substrate side or this second substrate can be made a groove structure.
Preferable, the manufacturing approach of aforesaid convolution micro-electro-mechanical microphone, wherein this groove structure is to utilize the etching mode moulding.
Preferable, the manufacturing approach of aforesaid convolution micro-electro-mechanical microphone, wherein this storage tank is to utilize the etching mode moulding.
Preferable, the manufacturing approach of aforesaid convolution micro-electro-mechanical microphone, the both sides that wherein remove this second substrate can be mechanical system.
The object of the invention and to solve its technical problem be that technical scheme below adopting realizes.Manufacturing approach according to a kind of convolution micro-electro-mechanical microphone provided by the invention comprises the following steps: to provide one first substrate, makes a vibrating diaphragm on this first substrate; One second substrate is provided, makes a storage tank above that, and make on this second substrate one have several sound holes backboard, these backboard central authorities are placed in this storage tank; With this first substrate and this second substrate bonded, make and form a space between this vibrating diaphragm and this backboard; The both sides of this second substrate are removed, so that this first substrate exposes; Go out one first chamber and one second chamber at this first substrate and this second substrate manufacture respectively; And utilize the both sides cutting of mechanical system with this first substrate, to produce this convolution micro-electro-mechanical microphone.
Preferable, the manufacturing approach of aforesaid convolution micro-electro-mechanical microphone, wherein the side of this first substrate side or this second substrate can be made a groove structure.
Preferable, the manufacturing approach of aforesaid convolution micro-electro-mechanical microphone, wherein this groove structure is to utilize the etching mode moulding.
Preferable, the manufacturing approach of aforesaid convolution micro-electro-mechanical microphone, wherein this storage tank is to utilize the etching mode moulding.
Preferable, the manufacturing approach of aforesaid convolution micro-electro-mechanical microphone, the both sides that wherein remove this second substrate can be mechanical system.
The object of the invention and to solve its technical problem be that technical scheme below adopting realizes.Manufacturing approach according to a kind of convolution micro-electro-mechanical microphone provided by the invention comprises the following steps: to provide one first substrate, etches a storage tank above that, and makes a vibrating diaphragm on this first substrate, and the central authorities of this vibrating diaphragm are placed in this storage tank; One second substrate is provided, make above that one have several sound holes backboard; With this first substrate and this second substrate bonded, make and form a space between this vibrating diaphragm and this backboard; Go out one first chamber at this first substrate manufacture, and remove simultaneously at second substrate manufacture, one second chamber with the both sides of second substrate; And utilize the both sides cutting of mechanical system with this first substrate, to produce this convolution micro-electro-mechanical microphone.
The object of the invention and to solve its technical problem be that technical scheme below adopting realizes.Manufacturing approach according to a kind of convolution micro-electro-mechanical microphone provided by the invention comprises the following steps: to provide one first substrate, makes a vibrating diaphragm on this first substrate; One second substrate is provided, one storage tank of etching above that; The backboard that making one has several sound holes is placed in this storage tank these backboard central authorities at this second substrate; With this first substrate and this second substrate bonded, make and form a space between this vibrating diaphragm and this backboard; Go out one first chamber at this first substrate manufacture, and remove simultaneously at second substrate manufacture, one second chamber with the both sides of second substrate; And utilize the both sides cutting of mechanical system with this first substrate, to produce this convolution micro-electro-mechanical microphone.
Beneficial effect of the present invention and advantage comprise at least:
1. when storage tank was arranged at first substrate, the central part of vibrating diaphragm was able to be placed in storage tank, can make that vibrating diaphragm is protected in groove; Promote overall construction intensity; By the design of storage tank, also can reach the reduction of whole height simultaneously, help realizing microminiaturized purpose.
2. storage tank of the present invention can be arranged at second substrate, in order to the central part of ccontaining backboard, with the structure of protection backboard.
The side of first substrate 3. of the present invention or second substrate can be made groove structure; During so as to the technology of mechanical system cutting, groove structure is stopped the district as cutting, deep as conventional construction so that depth of cut needn't surpass; So the process time can be saved, to promote the yield of product.
4. the present invention makes backboard on second substrate, and chemical mode also capable of using is produced several sound holes with backboard simultaneously and its both sides removed when second molding substrate, second chamber, so as to simplifying technology.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention; Understand technological means of the present invention in order can more to know; And can implement according to the content of specification, and for let of the present invention above-mentioned with other purposes, feature and advantage can be more obviously understandable, below special act preferred embodiment; And conjunction with figs., specify as follows.
Description of drawings
Fig. 1 is the sketch map of existing convention micro-electro-mechanical microphone.
Fig. 2 takes shape in the sketch map of first substrate for vibrating diaphragm in the first embodiment of the invention.
Fig. 3 takes shape in the sketch map of second substrate for the first embodiment of the invention dorsulum.
Fig. 4 is the sketch map that two substrates combines in the first embodiment of the invention.
Fig. 5 is the sketch map of cutting second substrate in the first embodiment of the invention.
Fig. 6 is the sketch map of another kind of processing step in the first embodiment of the invention.
Fig. 7 is the sketch map of first embodiment of the invention middle chamber shaping structures.
Fig. 8 is the sketch map of cutting first substrate in the first embodiment of the invention.
Fig. 9 is the sketch map of second embodiment of the invention.
[main element symbol description]
1 first chip, 2 second chips
3 vibrating diaphragms, 4 backboards
5 supporting constructions, 6 grooves
10 first substrates, 11 storage tanks
12 first insulating barriers, 13 first chambers
20 vibrating diaphragms, 21 conductive layers
22 second insulating barriers, 30 second substrates
31 groove structures 32 the 3rd insulating barrier
33 second chambers, 34 storage tanks
40 backboards, 41 sound holes
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention; Below in conjunction with accompanying drawing and preferred embodiment; To convolution micro-electro-mechanical microphone and its embodiment of manufacturing approach, structure, characteristic and the effect thereof that proposes according to the present invention, specify as after.
Consult shown in Figure 2ly, take shape in the sketch map of first substrate for vibrating diaphragm in the first embodiment of the invention.One first substrate 10 of Si material at first is provided, and one rectangular-shaped storage tank 11 is arranged in the upper surface etching.And first substrate, 10 upper surfaces deposit one first insulating barrier 12, and it is deposited on first substrate, 10 upper surfaces and storage tank 11, and wherein first insulating barrier 12 is selected silicon dioxide (SiO2) material for use.Then on first insulating barrier 12, deposit a vibrating diaphragm 20, it can select silicon nitride (SiNx) material or metal material for use.Wherein vibrating diaphragm 20 middle sections are just dived and are sunken in the storage tank 11.In addition, on vibrating diaphragm 20, deposit a conductive layer 21 in addition, and one second insulating barrier 22 that is positioned at central part, it can select silicon dioxide (SiO2) material or other insulating material for use.
Consult shown in Figure 3ly, take shape in the sketch map of second substrate for the first embodiment of the invention dorsulum.Provide one second substrate 30 at this, it selects silicon (Si) material for use, and etches a groove structure 31 respectively in the lower surface both sides of second substrate 30, and wherein groove structure 31 can be a geometry such as rectangle, trapezoidal or circle for example.And depositing one the 3rd insulating barrier 32 at the lower surface of second substrate 30, it selects silicon dioxide (SiO2) material for use, and is deposited on the lower surface of the groove structure 31 and second substrate 30.The backboard 40 that then has sound hole 41 in smooth central area making one.
Consult shown in Figure 4ly, be the sketch map that two substrates combines in the first embodiment of the invention.Second substrate 30 is to utilize backboard 40 to be incorporated on the conductive layer 21 of first substrate 10; Make between vibrating diaphragm 20 and the backboard 40 and to form a suitable space; Wherein first substrate 10 and second substrate 30 combines; Can adopt that convolution combination, melt and dissolved combination, anode combine, gluing closes or mode such as hot ultrasonic waves combination, or adopt other similar combinations.And be to depend on that groove 11 degree of depth define between above-mentioned proper air, and because of the storage tank 11 of first substrate 10 designs, the present invention's first substrate 10 can be little than existing convention micro-electro-mechanical microphone with the height of second substrate 30 after combining, and helps the microminiaturization of product.Then as shown in Figure 5; Be to utilize the mechanical type cutting mode to descend respectively in the zone of groove structure 31 of cutter to the second substrate 30; So that groove structure 31 stops the district for cutting; So can second substrate 30 be cut off from wafer, and produce preliminary dimension, and the conductive layer 21 of the substrate 10 of winning is exposed for routing.Because groove structure 31 of the present invention can make the depth of cut of second substrate 30 needn't surpass integral thickness for the event of moulding in advance, so can effectively lower the process time, and the yield that product is provided.In like manner can demonstrate,prove, groove structure 31 of the present invention also can need and will be imposed on first substrate 10 according to making, has identical effect equally.What deserves to be mentioned is in addition,, so can exempt the step of cutting second substrate 30, be beneficial to simplify technology if the technology that adopts aforesaid chemical mode that second substrate 30 is removed from wafer then can directly be incorporated into second substrate 30 on first substrate 10.
Consult shown in Figure 6ly, be the sketch map of another kind of processing step in the first embodiment of the invention.Provide second substrate 30 that is not provided with as the aforementioned recess structure, and it is incorporated on first substrate 10.
Consult shown in Figure 7ly, be the sketch map of first embodiment of the invention middle chamber shaping structures.Moulding one first chamber 13 and one second chamber 33 respectively at the back of first substrate 10 and second substrate 30, and be communicated in the space between vibrating diaphragm 20 and the backboard 40 are with vibrating diaphragm 20 moulding one suspension structure.If adopt the processing step of Fig. 6, then when making second chamber 33, the both sides of etching second substrate 30 so that second substrate 30 removes from wafer, so are different from the step of aforesaid making groove structure 31.
Consult shown in Figure 8ly, be the sketch map of cutting first substrate in the first embodiment of the invention.Last in technology is to utilize mechanical system to cut the both sides of first substrate 10, so that it is cut off from wafer; And because second substrate 30 is implemented cutting technique for the first time in advance; Make the cutting of micro-electro-mechanical microphone global formation of the present invention be divided into cutter twice time, and the non-once excision forming so make micro-electro-mechanical microphone of the present invention can not receive the technology of once cutting; And it is reduce the yield of product, and comparatively simple and easy and be not subject to the restriction of cutting tool on making.And if the technology that adopts chemical mode that second substrate 30 is removed from wafer then as long as directly cut the both sides of first substrate 10, can be exempted unnecessary influence in the middle of the technology.The upper surface of this external second substrate 30 can electronic component is set above that to give, and electronic component can comprise electric capacity, resistance, inductance, integral chip or the like according to the demand of electronic product.
Consult shown in Figure 9ly, be the sketch map of second embodiment of the invention.Present embodiment and aforementioned difference be, storage tank 34 changes and is arranged at second substrate 30, so that backboard 40 central parts stay under water in storage tank 34, has the effect of aforementioned technology equally.
Convolution micro-electro-mechanical microphone of the present invention and manufacturing approach thereof are mainly to etch storage tank at first substrate, in can being placed in the central part that vibrating diaphragm is provided; Make vibrating diaphragm in storage tank, be protected; So overall construction intensity is preferable, and the degree of depth of storage tank is to determine the backboard of second substrate and the distance between the vibrating diaphragm, in view of the above; It is low that the present invention can make first substrate of convolution and the existing conventional construction of height of second substrate, to realize microminiaturized purpose.In addition, storage tank of the present invention also can change and is arranged at second substrate, in order to the central part of ccontaining backboard, has the effect of protection backboard equally.
And convolution micro-electro-mechanical microphone manufacturing approach of the present invention; Can etch groove structure in the second substrate both sides, make the present invention when cutting second substrate, groove structure stops the district for cutting; So that depth of cut needn't surpass the thickness of second substrate; So can save the integrated artistic time, the parameter that is not subject to cutting tool influences, and can promote the yield of product.In addition, groove structure of the present invention also can be arranged at the both sides of this first substrate, has aforesaid effect equally.
In addition, convolution micro-electro-mechanical microphone manufacturing approach of the present invention can when second substrate manufacture, second chamber, be moved both sides in second substrate bonded behind first substrate simultaneously from the wafer erosion, also have the effect of simplifying subsequent technique.
The above; Only being preferred embodiment of the present invention, is not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment; Yet be not in order to limit the present invention; Any professional and technical personnel of being familiar with makes a little change or is modified to the equivalent embodiment of equivalent variations when the technology contents of above-mentioned announcement capable of using in not breaking away from technical scheme scope of the present invention, is the content that does not break away from technical scheme of the present invention in every case;, all still belong in the scope of technical scheme of the present invention any simple modification, equivalent variations and modification that above embodiment did according to technical spirit of the present invention.
Claims (18)
1. convolution micro-electro-mechanical microphone is characterized in that comprising:
One first substrate is to have one first chamber;
One vibrating diaphragm is to be provided with on this first chamber;
One second substrate is to have one second chamber;
One backboard is that a side is arranged on this second chamber, and opposite side is arranged at this vibrating diaphragm, so that this second substrate bonded is on this first substrate, and this backboard has several sound holes;
And
One storage tank is to be arranged between this first substrate and this second substrate, uses so that form a space between this vibrating diaphragm and this backboard.
2. convolution micro-electro-mechanical microphone as claimed in claim 1 is characterized in that wherein this storage tank is arranged at this first substrate, and is communicated with this first chamber so that the central part of this vibrating diaphragm be installed with place in.
3. convolution micro-electro-mechanical microphone as claimed in claim 1 is characterized in that wherein this storage tank is arranged at this second substrate, and is communicated with this second chamber so that the central part of this backboard be installed with place in.
4. convolution micro-electro-mechanical microphone as claimed in claim 1 is characterized in that wherein this vibrating diaphragm is provided with a conductive layer, and this conductive layer is located between this backboard and this vibrating diaphragm, and these conductive layer both sides are as the routing zone.
5. convolution micro-electro-mechanical microphone as claimed in claim 4; It is characterized in that wherein being provided with between this vibrating diaphragm and this first substrate one select earth silicon material for use first insulating barrier; This vibrating diaphragm is provided with one second insulating barrier, be provided with between this backboard and this second substrate one select earth silicon material for use the 3rd insulating barrier.
6. convolution micro-electro-mechanical microphone as claimed in claim 1 is characterized in that wherein this vibrating diaphragm is to select silicon nitride material for use.
7. the manufacturing approach of a convolution micro-electro-mechanical microphone is characterized in that comprising the following steps:
One first substrate is provided, makes a storage tank above that, and make a vibrating diaphragm on this first substrate, the central authorities of this vibrating diaphragm are placed in this storage tank;
One second substrate is provided, and making one has the backboard of several sound holes on it;
With this first substrate and this second substrate bonded, make and form a space between this vibrating diaphragm and this backboard;
The both sides of this second substrate are removed, so that this first substrate exposes;
Go out one first chamber and one second chamber at this first substrate and this second substrate manufacture respectively; And
Utilize mechanical system that the both sides of this first substrate are removed, to produce this convolution micro-electro-mechanical microphone.
8. the manufacturing approach of convolution micro-electro-mechanical microphone as claimed in claim 7 is characterized in that the side of this first substrate side wherein or this second substrate can be made a groove structure.
9. the manufacturing approach of convolution micro-electro-mechanical microphone as claimed in claim 8 is characterized in that wherein this groove structure is to utilize the etching mode moulding.
10. the manufacturing approach of convolution micro-electro-mechanical microphone as claimed in claim 8 is characterized in that wherein this storage tank is to utilize the etching mode moulding.
11. the manufacturing approach of convolution micro-electro-mechanical microphone as claimed in claim 8 is characterized in that the both sides that wherein remove this second substrate can be mechanical system.
12. the manufacturing approach of a convolution micro-electro-mechanical microphone is characterized in that comprising the following steps:
One first substrate is provided, makes a vibrating diaphragm on this first substrate;
One second substrate is provided, makes a storage tank above that, and make on this second substrate one have several sound holes backboard, these backboard central authorities are placed in this storage tank;
With this first substrate and this second substrate bonded, make and form a space between this vibrating diaphragm and this backboard;
The both sides of this second substrate are removed, so that this first substrate exposes;
Go out one first chamber and one second chamber at this first substrate and this second substrate manufacture respectively; And
Utilize the both sides cutting of mechanical system, to produce this convolution micro-electro-mechanical microphone with this first substrate.
13. the manufacturing approach of convolution micro-electro-mechanical microphone as claimed in claim 12 is characterized in that the side of this first substrate side wherein or this second substrate can be made a groove structure.
14. the manufacturing approach of convolution micro-electro-mechanical microphone as claimed in claim 13 is characterized in that wherein this groove structure is to utilize the etching mode moulding.
15. the manufacturing approach of convolution micro-electro-mechanical microphone as claimed in claim 13 is characterized in that wherein this storage tank is to utilize the etching mode moulding.
16. the manufacturing approach of convolution micro-electro-mechanical microphone as claimed in claim 13 is characterized in that the both sides that wherein remove this second substrate can be mechanical system.
17. the manufacturing approach of a convolution micro-electro-mechanical microphone is characterized in that comprising the following steps:
One first substrate is provided, etches a storage tank above that, and make a vibrating diaphragm on this first substrate, the central authorities of this vibrating diaphragm are placed in this storage tank;
One second substrate is provided, make above that one have several sound holes backboard;
With this first substrate and this second substrate bonded, make and form a space between this vibrating diaphragm and this backboard;
Go out one first chamber at this first substrate manufacture, and remove simultaneously at second substrate manufacture, one second chamber with the both sides of second substrate; And
Utilize the both sides cutting of mechanical system, to produce this convolution micro-electro-mechanical microphone with this first substrate.
18. the manufacturing approach of a convolution micro-electro-mechanical microphone is characterized in that comprising the following steps:
One first substrate is provided, makes a vibrating diaphragm on this first substrate;
One second substrate is provided, one storage tank of etching above that;
The backboard that making one has several sound holes is placed in this storage tank these backboard central authorities at this second substrate;
With this first substrate and this second substrate bonded, make and form a space between this vibrating diaphragm and this backboard;
Go out one first chamber at this first substrate manufacture, and remove simultaneously at second substrate manufacture, one second chamber with the both sides of second substrate; And
Utilize the both sides cutting of mechanical system, to produce this convolution micro-electro-mechanical microphone with this first substrate.
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| CN2011100875387A CN102740203A (en) | 2011-04-06 | 2011-04-06 | Combined micro-electrical-mechanical-system microphone and manufacturing method of same |
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| US9998843B2 (en) | 2013-03-14 | 2018-06-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for manufacturing a microphone |
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Application publication date: 20121017 |