ATE319174T1 - Verfahren zur herstellung eines bauelements mit mehrfacher schutzfunktion - Google Patents

Verfahren zur herstellung eines bauelements mit mehrfacher schutzfunktion

Info

Publication number
ATE319174T1
ATE319174T1 AT97946227T AT97946227T ATE319174T1 AT E319174 T1 ATE319174 T1 AT E319174T1 AT 97946227 T AT97946227 T AT 97946227T AT 97946227 T AT97946227 T AT 97946227T AT E319174 T1 ATE319174 T1 AT E319174T1
Authority
AT
Austria
Prior art keywords
multilayer
component
condenser
multilayer ceramic
new component
Prior art date
Application number
AT97946227T
Other languages
English (en)
Inventor
Zoran Zivic
Original Assignee
Keko Varicon D O O
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keko Varicon D O O filed Critical Keko Varicon D O O
Application granted granted Critical
Publication of ATE319174T1 publication Critical patent/ATE319174T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores
    • H01C7/108—Metal oxide
    • H01C7/112—ZnO type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
AT97946227T 1996-11-11 1997-11-10 Verfahren zur herstellung eines bauelements mit mehrfacher schutzfunktion ATE319174T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SI9600330A SI9600330A (sl) 1996-11-11 1996-11-11 Zaščitna komponenta z več funkcijami

Publications (1)

Publication Number Publication Date
ATE319174T1 true ATE319174T1 (de) 2006-03-15

Family

ID=20431944

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97946227T ATE319174T1 (de) 1996-11-11 1997-11-10 Verfahren zur herstellung eines bauelements mit mehrfacher schutzfunktion

Country Status (7)

Country Link
US (2) US6328176B1 (de)
EP (2) EP0875067B1 (de)
KR (1) KR19990077149A (de)
AT (1) ATE319174T1 (de)
DE (1) DE69735378T2 (de)
SI (1) SI9600330A (de)
WO (1) WO1998021731A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060151A (ja) * 2001-08-10 2003-02-28 Fujitsu Ltd 半導体装置
KR100490500B1 (ko) * 2002-09-04 2005-05-17 주식회사 이노칩테크놀로지 도금 특성이 우수한 칩부품 및 그 제조방법
ATE454138T1 (de) * 2003-08-08 2010-01-15 Biovail Lab Int Srl Tablette mit modifizierter freisetzung von bupropion hydrochlorid
DE102004045009B4 (de) * 2004-09-16 2008-03-27 Epcos Ag Elektrisches Bauelement und dessen Verwendung
US9968120B2 (en) * 2006-05-17 2018-05-15 Dsm Nutritional Products Ag Homogenized formulations containing microcapsules and methods of making and using thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02105404A (ja) * 1988-10-13 1990-04-18 Nec Corp セラミックコンデンサ
JPH02304910A (ja) * 1989-05-19 1990-12-18 Tama Electric Co Ltd 複合チップ素子
JPH0371614A (ja) * 1989-08-10 1991-03-27 Marcon Electron Co Ltd 面実装形複合部品
US5714802A (en) * 1991-06-18 1998-02-03 Micron Technology, Inc. High-density electronic module
JPH06283301A (ja) * 1993-03-29 1994-10-07 Mitsubishi Materials Corp チップ型複合電子部品及びその製造方法

Also Published As

Publication number Publication date
KR19990077149A (ko) 1999-10-25
WO1998021731A1 (en) 1998-05-22
DE69735378T2 (de) 2006-11-30
SI9600330A (sl) 1998-06-30
DE69735378D1 (de) 2006-04-27
US6395605B1 (en) 2002-05-28
EP0875067B1 (de) 2006-03-01
EP1632959A3 (de) 2006-09-20
EP0875067A1 (de) 1998-11-04
EP1632959A2 (de) 2006-03-08
US6328176B1 (en) 2001-12-11

Similar Documents

Publication Publication Date Title
DE69535266D1 (de) Mikroelektronische montage mit mehrfachen leiterverformungen
TW342582B (en) Method of wire bonding an integrated circuit to an ultraflexible substrate
EP1010228A4 (de) Schutzvorrichtung gegen transiente spannungen und verfahren zu deren herstellung
ATE493760T1 (de) Bilden einer integrierten mehrsegmentschaltung mit isolierten substraten
DE69401108T2 (de) Oberflächenmontierte Lötanordnung von integrierten Schaltungspackungen ohne Drahtanschlüsse
TW270228B (en) Semiconductor chip and electronic module with integrated surface interconnects/components and fabrication methods therefore
WO1997024752A3 (en) A method of manufacturing a high voltage gan-aln based semiconductor device and semiconductor device made
DE69734571D1 (de) Überspannungsschutzanordnung und herstellungsverfahren
EP0794572A3 (de) Elektronisches Bauelement, Herstellungsverfahren dafür und Leiterrahmen und Giessformzusammenbau dafür
EP1389820A3 (de) Induktivitätsarme Schaltungsanordnung für Leistungshalbleitermodule
DE69516328T2 (de) Integrierte Halbleiterschaltung zur Erzeugung einer internen Speisespannung mit reduzierten Spannungsschwankungen
WO2004095695A3 (en) Tunable bridge circuit
ATE319174T1 (de) Verfahren zur herstellung eines bauelements mit mehrfacher schutzfunktion
CA2239343A1 (en) A matching circuit and a method for matching a transistor circuit
ATE381246T1 (de) Elektronische schaltung und verfahren zum betrieb einer hochdrucklampe
TW200511343A (en) Jig for producing capacitor, production method for capacitor and capacitor
EP1013625A3 (de) Nichtlineare dielektrische keramische Zusammensetzung, impulserzeugender Kondensator, Schaltung für Hochdruckdampfentladungslampe und Hochdruckdampfentladungslampe
WO2002103789A3 (en) Electronic assembly with laterally connected capacitors and manufacturing method
EP1248297A3 (de) Induktives Element und Halbleiterbauelement
TW428419B (en) Support body for electronic components
EP1160867A3 (de) Inbesondere zur Verkleinerung geeignete elektronische Schaltung mit hervorragenden Hochfrequenzeigenschaften
AU776346B2 (en) Rectifier circuit suited to power factor correction
ATE459984T1 (de) Halbleiter-leuchteinheit und verfahren zur herstellung derselben
ATE69910T1 (de) Verfahren und vorrichtung zur herstellung einer halbleiterschicht.
DE10158195B4 (de) Chipkarte und ein Verfahren zur Herstellung einer Chipkarte

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties