ATE69910T1 - Verfahren und vorrichtung zur herstellung einer halbleiterschicht. - Google Patents
Verfahren und vorrichtung zur herstellung einer halbleiterschicht.Info
- Publication number
- ATE69910T1 ATE69910T1 AT84111152T AT84111152T ATE69910T1 AT E69910 T1 ATE69910 T1 AT E69910T1 AT 84111152 T AT84111152 T AT 84111152T AT 84111152 T AT84111152 T AT 84111152T AT E69910 T1 ATE69910 T1 AT E69910T1
- Authority
- AT
- Austria
- Prior art keywords
- semiconductor layer
- manufacturing
- electrode
- satisfactory
- electrodes
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/517—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02425—Conductive materials, e.g. metallic silicides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Photovoltaic Devices (AREA)
- Formation Of Insulating Films (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58174759A JPS6066422A (ja) | 1983-09-21 | 1983-09-21 | 半導体製造法 |
EP84111152A EP0140130B1 (de) | 1983-09-21 | 1984-09-19 | Verfahren und Vorrichtung zur Herstellung einer Halbleiterschicht |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE69910T1 true ATE69910T1 (de) | 1991-12-15 |
Family
ID=15984177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT84111152T ATE69910T1 (de) | 1983-09-21 | 1984-09-19 | Verfahren und vorrichtung zur herstellung einer halbleiterschicht. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4869976A (de) |
EP (1) | EP0140130B1 (de) |
JP (1) | JPS6066422A (de) |
AT (1) | ATE69910T1 (de) |
CA (1) | CA1227288A (de) |
DE (1) | DE3485300D1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1227877B (it) * | 1988-11-25 | 1991-05-14 | Eniricerche S P A Agip S P A | Procedimento per la deposizione via plasma di strati multipli dimate riale amorfo a composizione variabile |
US5316639A (en) * | 1989-06-05 | 1994-05-31 | Sachiko Okazaki | Dielectric material used for an ozone generator and a method of forming a film to the dielectric material |
EP0428161B1 (de) * | 1989-11-15 | 1999-02-17 | Kokusai Electric Co., Ltd. | Trocken-Behandlungsvorrichtung |
JPH07245332A (ja) * | 1994-03-04 | 1995-09-19 | Hitachi Ltd | 半導体製造装置および半導体装置の製造方法ならびに半導体装置 |
US5970907A (en) * | 1997-01-27 | 1999-10-26 | Canon Kabushiki Kaisha | Plasma processing apparatus |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2941559C2 (de) * | 1979-10-13 | 1983-03-03 | Messerschmitt-Bölkow-Blohm GmbH, 8000 München | Verfahren zum Abscheiden von Silizium auf einem Substrat |
US4333814A (en) * | 1979-12-26 | 1982-06-08 | Western Electric Company, Inc. | Methods and apparatus for improving an RF excited reactive gas plasma |
US4361595A (en) * | 1981-01-28 | 1982-11-30 | Rca Corporation | Method for preparing an abrasive lapping disc |
JPS57153436A (en) * | 1981-03-17 | 1982-09-22 | Fujitsu Ltd | Semiconductor device |
JPS57161057A (en) * | 1981-03-30 | 1982-10-04 | Mitsubishi Electric Corp | Chemical vapor phase growth device using plasma |
EP0066787B1 (de) * | 1981-05-29 | 1989-11-15 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Verfahren zur Herstellung von Halbleitern aus amorphem Silizium |
US4466380A (en) * | 1983-01-10 | 1984-08-21 | Xerox Corporation | Plasma deposition apparatus for photoconductive drums |
US4481230A (en) * | 1983-10-27 | 1984-11-06 | Rca Corporation | Method of depositing a semiconductor layer from a glow discharge |
-
1983
- 1983-09-21 JP JP58174759A patent/JPS6066422A/ja active Pending
-
1984
- 1984-09-19 CA CA000463624A patent/CA1227288A/en not_active Expired
- 1984-09-19 EP EP84111152A patent/EP0140130B1/de not_active Expired - Lifetime
- 1984-09-19 AT AT84111152T patent/ATE69910T1/de not_active IP Right Cessation
- 1984-09-19 DE DE8484111152T patent/DE3485300D1/de not_active Expired - Lifetime
- 1984-09-21 US US06/653,007 patent/US4869976A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6066422A (ja) | 1985-04-16 |
DE3485300D1 (de) | 1992-01-09 |
EP0140130A2 (de) | 1985-05-08 |
EP0140130B1 (de) | 1991-11-27 |
CA1227288A (en) | 1987-09-22 |
EP0140130A3 (en) | 1987-05-13 |
US4869976A (en) | 1989-09-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification | ||
REN | Ceased due to non-payment of the annual fee |