ATE316293T1 - Plattierungsverfahren für halbleitermaterialien - Google Patents

Plattierungsverfahren für halbleitermaterialien

Info

Publication number
ATE316293T1
ATE316293T1 AT97934851T AT97934851T ATE316293T1 AT E316293 T1 ATE316293 T1 AT E316293T1 AT 97934851 T AT97934851 T AT 97934851T AT 97934851 T AT97934851 T AT 97934851T AT E316293 T1 ATE316293 T1 AT E316293T1
Authority
AT
Austria
Prior art keywords
cup
fluid
reservoir
processing
semiconductor materials
Prior art date
Application number
AT97934851T
Other languages
English (en)
Inventor
Wayne J Schmidt
Robert W Berner
Daniel J Woodruff
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc filed Critical Semitool Inc
Priority claimed from PCT/US1997/010939 external-priority patent/WO1998039796A1/en
Application granted granted Critical
Publication of ATE316293T1 publication Critical patent/ATE316293T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemically Coating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AT97934851T 1997-07-15 1997-07-15 Plattierungsverfahren für halbleitermaterialien ATE316293T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1997/010939 WO1998039796A1 (en) 1996-07-15 1997-07-15 Plating system for semiconductor materials

Publications (1)

Publication Number Publication Date
ATE316293T1 true ATE316293T1 (de) 2006-02-15

Family

ID=36062496

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97934851T ATE316293T1 (de) 1997-07-15 1997-07-15 Plattierungsverfahren für halbleitermaterialien

Country Status (3)

Country Link
EP (1) EP1647614A3 (de)
AT (1) ATE316293T1 (de)
DE (1) DE69735135T2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110422596A (zh) * 2019-09-19 2019-11-08 中国农业科学院农业信息研究所 上料装置
CN112079365A (zh) * 2020-09-09 2020-12-15 湖南海联三一小苏打有限公司 一种生产大粒度小苏打的装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106205380A (zh) * 2016-08-31 2016-12-07 无锡市万里实业发展有限公司 在线卫生系统显示装置
US10698320B2 (en) * 2016-12-14 2020-06-30 Taiwan Semiconductor Manufacturing Co., Ltd. Method for optimized wafer process simulation
CN106841573A (zh) * 2017-04-12 2017-06-13 中铁西北科学研究院有限公司 一种泥石流模拟试验装置及试验方法
CN107365980B (zh) * 2017-07-10 2019-01-11 深圳丰盛装备股份有限公司 一种石墨舟自动装卸片设备
CN107677333A (zh) * 2017-10-17 2018-02-09 三胜智慧科技（北京）有限公司 一种用于金属管道信号传递的耦合装置
CN111001606B (zh) * 2019-12-27 2022-03-11 上海至纯洁净系统科技股份有限公司 一种半导体清洗设备
CN112193826B (zh) * 2020-09-29 2025-05-27 烟台正海磁性材料股份有限公司 一种磁钢自动载入圆形挂具的设备
US11585008B2 (en) * 2020-12-29 2023-02-21 Taiwan Semiconductor Manufacturing Company, Ltd. Plating apparatus for plating semiconductor wafer and plating method
CN112853442A (zh) * 2021-01-13 2021-05-28 杨木兰 一种半导体集成电路封装器件加工装置
CN113652646B (zh) * 2021-08-11 2023-04-28 河源市蓝海米克模具刀具有限公司 一种用于刀具表面镀层处理的工艺方法及其处理装置
CN115505973B (zh) * 2022-11-04 2025-05-30 灵宝宝鑫电子科技有限公司 一种生箔机高效环流阳极槽

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4828654A (en) * 1988-03-23 1989-05-09 Protocad, Inc. Variable size segmented anode array for electroplating
JPH04147991A (ja) * 1990-10-08 1992-05-21 Olympic Co Ltd メッキ装置
JP2734269B2 (ja) * 1991-12-26 1998-03-30 日本電気株式会社 半導体製造装置
JP2885564B2 (ja) * 1992-03-11 1999-04-26 日本電気株式会社 噴流式電解金メッキ成長装置
JP2953193B2 (ja) * 1992-05-20 1999-09-27 富士通株式会社 基板のメッキ方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110422596A (zh) * 2019-09-19 2019-11-08 中国农业科学院农业信息研究所 上料装置
CN112079365A (zh) * 2020-09-09 2020-12-15 湖南海联三一小苏打有限公司 一种生产大粒度小苏打的装置

Also Published As

Publication number Publication date
EP1647614A2 (de) 2006-04-19
EP1647614A3 (de) 2006-06-07
DE69735135D1 (de) 2006-04-06
DE69735135T2 (de) 2006-09-07

Similar Documents

Publication Publication Date Title
DE69735135D1 (de) Plattierungsverfahren für halbleitermaterialien
DE3783783D1 (de) Plastikumhuellter chiptraeger und verfahren zu dessen herstellung.
DE69320391D1 (de) Reinigungsflüssigkeit für Halbleitersubstrate
DE69031350D1 (de) Mehrschichtpackung mit einer vertieften höhlung für einen halbleiter-chip
DE3685124D1 (de) Integriertes halbleiterschaltungsbauelement und verfahren zu seiner herstellung.
EP0662705A3 (de) Reinigungsmittel für Halbleiter-Anordnung und Verfahren zur Herstellung einer Halbleiter-Anordnung.
FI915716A7 (fi) Menetelmä työkappaleiden työstämiseksi ja automattinen valmistuslaitos
FR2555364B1 (fr) Procede de fabrication de connexions d'un dispositif a circuits integres a semi-conducteurs comportant en particulier un mitset
KR960015801A (ko) 집적화된 표면 상호접속부 및 소자들을 갖는 반도체 칩 및 전자적 모듈과 이를 제조하는 방법
ES538359A0 (es) Perfeccionamientos en la lubricacion de herramientas para mecanizacion de piezas.
FR2571901B1 (fr) Laser a semi-conducteur et procede de fabrication d'un tel laser ou les parties photodetectrices sont formees sur le support semi-conducteur
FR2559088B1 (fr) Table de machine-outil construite en modules pour installations de fabrication
IT1200881B (it) Accessorio per il rovesciamento di parti per macchine utensili automatiche
FR2643193B1 (fr) Procede pour fabriquer des circuits integres a semi-conducteurs
DE69501690D1 (de) Elektroplattierungslösung zur Herstellung von Elektrodenhöckern aus Pb-Sn Legierungen auf der Oberfläche von Halbleiterwafern
IL83642A0 (en) Schottky diode logic units for e-mode fet/d-mode fet vlsi circuits
EP0383198A3 (de) Einbauspüle
SG36692G (en) Method for forming a metal sieve material,device for performing said method and metal sieve material formed
GB8821635D0 (en) Fabrication method for semiconductor integrated circuits
ATE33649T1 (de) Gegen magengeschwuer wirkende 2-guanidino-4-(2substituierte-amino-4-imidazolyl)thiazole und verfahren zu deren herstellung.
JPS6457624A (en) Cleaning equipment
FR2606212B1 (fr) Procede de fabrication d'un composant bicmos
DE3788482D1 (de) Halbleiteranordnung mit einem MOS-Transistor und Verfahren zu deren Herstellung.
IT8603515A0 (it) Macchina automatica per il confezionamento in scatola di articoli vari
DE3854710D1 (de) Verfahren zum Herstellen von monolithischen Halbleiterschaltungen.

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1027722

Country of ref document: EP