ATE316293T1 - Plattierungsverfahren für halbleitermaterialien - Google Patents

Plattierungsverfahren für halbleitermaterialien

Info

Publication number
ATE316293T1
ATE316293T1 AT97934851T AT97934851T ATE316293T1 AT E316293 T1 ATE316293 T1 AT E316293T1 AT 97934851 T AT97934851 T AT 97934851T AT 97934851 T AT97934851 T AT 97934851T AT E316293 T1 ATE316293 T1 AT E316293T1
Authority
AT
Austria
Prior art keywords
cup
fluid
reservoir
processing
semiconductor materials
Prior art date
Application number
AT97934851T
Other languages
English (en)
Inventor
Wayne J Schmidt
Robert W Berner
Daniel J Woodruff
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc filed Critical Semitool Inc
Priority claimed from PCT/US1997/010939 external-priority patent/WO1998039796A1/en
Application granted granted Critical
Publication of ATE316293T1 publication Critical patent/ATE316293T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AT97934851T 1997-07-15 1997-07-15 Plattierungsverfahren für halbleitermaterialien ATE316293T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1997/010939 WO1998039796A1 (en) 1996-07-15 1997-07-15 Plating system for semiconductor materials

Publications (1)

Publication Number Publication Date
ATE316293T1 true ATE316293T1 (de) 2006-02-15

Family

ID=36062496

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97934851T ATE316293T1 (de) 1997-07-15 1997-07-15 Plattierungsverfahren für halbleitermaterialien

Country Status (3)

Country Link
EP (1) EP1647614A3 (de)
AT (1) ATE316293T1 (de)
DE (1) DE69735135T2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110422596A (zh) * 2019-09-19 2019-11-08 中国农业科学院农业信息研究所 上料装置
CN112079365A (zh) * 2020-09-09 2020-12-15 湖南海联三一小苏打有限公司 一种生产大粒度小苏打的装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106205380A (zh) * 2016-08-31 2016-12-07 无锡市万里实业发展有限公司 在线卫生系统显示装置
US10698320B2 (en) * 2016-12-14 2020-06-30 Taiwan Semiconductor Manufacturing Co., Ltd. Method for optimized wafer process simulation
CN106841573A (zh) * 2017-04-12 2017-06-13 中铁西北科学研究院有限公司 一种泥石流模拟试验装置及试验方法
CN107365980B (zh) * 2017-07-10 2019-01-11 深圳丰盛装备股份有限公司 一种石墨舟自动装卸片设备
CN107677333A (zh) * 2017-10-17 2018-02-09 三胜智慧科技（北京）有限公司 一种用于金属管道信号传递的耦合装置
CN111001606B (zh) * 2019-12-27 2022-03-11 上海至纯洁净系统科技股份有限公司 一种半导体清洗设备
CN112193826A (zh) * 2020-09-29 2021-01-08 烟台正海磁性材料股份有限公司 一种磁钢自动载入圆形挂具的设备
US11585008B2 (en) * 2020-12-29 2023-02-21 Taiwan Semiconductor Manufacturing Company, Ltd. Plating apparatus for plating semiconductor wafer and plating method
CN112853442A (zh) * 2021-01-13 2021-05-28 杨木兰 一种半导体集成电路封装器件加工装置
CN113652646B (zh) * 2021-08-11 2023-04-28 河源市蓝海米克模具刀具有限公司 一种用于刀具表面镀层处理的工艺方法及其处理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4828654A (en) * 1988-03-23 1989-05-09 Protocad, Inc. Variable size segmented anode array for electroplating
JPH04147991A (ja) * 1990-10-08 1992-05-21 Olympic Co Ltd メッキ装置
JP2734269B2 (ja) * 1991-12-26 1998-03-30 日本電気株式会社 半導体製造装置
JP2885564B2 (ja) * 1992-03-11 1999-04-26 日本電気株式会社 噴流式電解金メッキ成長装置
JP2953193B2 (ja) * 1992-05-20 1999-09-27 富士通株式会社 基板のメッキ方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110422596A (zh) * 2019-09-19 2019-11-08 中国农业科学院农业信息研究所 上料装置
CN112079365A (zh) * 2020-09-09 2020-12-15 湖南海联三一小苏打有限公司 一种生产大粒度小苏打的装置

Also Published As

Publication number Publication date
DE69735135D1 (de) 2006-04-06
EP1647614A3 (de) 2006-06-07
EP1647614A2 (de) 2006-04-19
DE69735135T2 (de) 2006-09-07

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