ATE286284T1 - Verfahren zu durchführung einer ausrichtungsmessung von zwei mustern in unterschiedlichen schichten eines halbleiterwafers - Google Patents
Verfahren zu durchführung einer ausrichtungsmessung von zwei mustern in unterschiedlichen schichten eines halbleiterwafersInfo
- Publication number
- ATE286284T1 ATE286284T1 AT01111670T AT01111670T ATE286284T1 AT E286284 T1 ATE286284 T1 AT E286284T1 AT 01111670 T AT01111670 T AT 01111670T AT 01111670 T AT01111670 T AT 01111670T AT E286284 T1 ATE286284 T1 AT E286284T1
- Authority
- AT
- Austria
- Prior art keywords
- alignment
- exposure
- field
- patterns
- measurement
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
- G06T7/33—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01111670A EP1258834B1 (de) | 2001-05-14 | 2001-05-14 | Verfahren zu Durchführung einer Ausrichtungsmessung von zwei Mustern in unterschiedlichen Schichten eines Halbleiterwafers |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE286284T1 true ATE286284T1 (de) | 2005-01-15 |
Family
ID=8177420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01111670T ATE286284T1 (de) | 2001-05-14 | 2001-05-14 | Verfahren zu durchführung einer ausrichtungsmessung von zwei mustern in unterschiedlichen schichten eines halbleiterwafers |
Country Status (9)
Country | Link |
---|---|
US (1) | US6908775B2 (de) |
EP (1) | EP1258834B1 (de) |
JP (1) | JP2004531063A (de) |
KR (1) | KR100540629B1 (de) |
AT (1) | ATE286284T1 (de) |
DE (1) | DE60108082T2 (de) |
IL (1) | IL158875A0 (de) |
TW (1) | TW564510B (de) |
WO (1) | WO2002093485A1 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6864493B2 (en) * | 2001-05-30 | 2005-03-08 | Hitachi, Ltd. | Charged particle beam alignment method and charged particle beam apparatus |
US20050095515A1 (en) * | 2003-08-29 | 2005-05-05 | Inficon Lt, Inc. | Methods and systems for processing overlay data |
JP4289961B2 (ja) * | 2003-09-26 | 2009-07-01 | キヤノン株式会社 | 位置決め装置 |
DE10345466A1 (de) * | 2003-09-30 | 2005-04-28 | Infineon Technologies Ag | Verfahren zur Erfassung von Plazierungsfehlern von Schaltungsmustern bei der Übertragung mittels einer Maske in Schichten eines Substrats eines Halbleiterwafers |
JP4295748B2 (ja) * | 2004-06-21 | 2009-07-15 | アプライド マテリアルズ イスラエル リミテッド | 走査ビームアレイを使用する複数の重要領域を含む対象物を走査する方法 |
US7586609B2 (en) * | 2005-04-21 | 2009-09-08 | Macronix International Co., Ltd. | Method for analyzing overlay errors |
KR100598988B1 (ko) * | 2005-05-18 | 2006-07-12 | 주식회사 하이닉스반도체 | 오버레이 버니어 및 이를 이용한 반도체소자의 제조방법 |
JP2006337631A (ja) * | 2005-06-01 | 2006-12-14 | Mitsubishi Electric Corp | 検査方法及びこれを用いた液晶表示装置の製造方法 |
JP2007103658A (ja) * | 2005-10-04 | 2007-04-19 | Canon Inc | 露光方法および装置ならびにデバイス製造方法 |
KR100790826B1 (ko) * | 2006-06-30 | 2008-01-02 | 삼성전자주식회사 | 오버레이 계측방법 및 그가 사용되는 반도체 제조설비의관리시스템 |
US8730475B2 (en) * | 2007-12-10 | 2014-05-20 | Samsung Electronics Co., Ltd. | Method of aligning a substrate |
KR101305948B1 (ko) * | 2007-12-10 | 2013-09-12 | 삼성전자주식회사 | 기판 정렬 방법 및 이를 수행하기 위한 장치 |
KR101718359B1 (ko) * | 2010-11-29 | 2017-04-04 | 삼성전자주식회사 | 기판 정렬 방법 및 이를 수행하기 위한 장치 |
US9134627B2 (en) * | 2011-12-16 | 2015-09-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multiple-patterning overlay decoupling method |
US9176396B2 (en) | 2013-02-27 | 2015-11-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Overlay sampling methodology |
US9164398B2 (en) * | 2013-02-27 | 2015-10-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Overlay metrology method |
JP6381197B2 (ja) * | 2013-10-31 | 2018-08-29 | キヤノン株式会社 | 計測装置、計測方法、リソグラフィ装置、及び物品製造方法 |
US9633915B1 (en) * | 2016-03-01 | 2017-04-25 | Globalfoundries Inc. | Method of using dummy patterns for overlay target design and overlay control |
US9754895B1 (en) | 2016-03-07 | 2017-09-05 | Micron Technology, Inc. | Methods of forming semiconductor devices including determining misregistration between semiconductor levels and related apparatuses |
EP3404488A1 (de) * | 2017-05-19 | 2018-11-21 | ASML Netherlands B.V. | Verfahren zur messung eines ziels, metrologievorrichtung, lithographiezelle und ziel |
CN111354670B (zh) * | 2018-12-20 | 2023-05-26 | 夏泰鑫半导体(青岛)有限公司 | 对准方法、对准系统及计算机可读存储介质 |
WO2020186456A1 (zh) * | 2019-03-19 | 2020-09-24 | 京东方科技集团股份有限公司 | 转印方法和转印装置 |
CN111240162B (zh) * | 2020-03-10 | 2022-07-15 | 上海华力微电子有限公司 | 改善光刻机对准的方法 |
CN113823581B (zh) * | 2020-06-19 | 2023-09-22 | 长鑫存储技术有限公司 | 半导体工艺生产线派货方法、存储介质以及半导体设备 |
CN111900116A (zh) * | 2020-06-22 | 2020-11-06 | 中国科学院微电子研究所 | 晶圆的对准方法及对准系统 |
US11635680B2 (en) | 2020-08-14 | 2023-04-25 | Changxin Memory Technologies, Inc. | Overlay pattern |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5621913A (en) * | 1992-05-15 | 1997-04-15 | Micron Technology, Inc. | System with chip to chip communication |
US5621813A (en) * | 1993-01-14 | 1997-04-15 | Ultratech Stepper, Inc. | Pattern recognition alignment system |
US6181302B1 (en) * | 1996-04-24 | 2001-01-30 | C. Macgill Lynde | Marine navigation binoculars with virtual display superimposing real world image |
US6023338A (en) * | 1996-07-12 | 2000-02-08 | Bareket; Noah | Overlay alignment measurement of wafers |
KR19980030438A (ko) * | 1996-10-29 | 1998-07-25 | 김영환 | 반도체 버어니어 구조 및 그것을 이용한 오버레이 정확도 측정방법 |
JP3757551B2 (ja) * | 1997-06-25 | 2006-03-22 | ソニー株式会社 | マスクパターン作成方法およびこの方法により形成されたマスク |
US6077756A (en) * | 1998-04-24 | 2000-06-20 | Vanguard International Semiconductor | Overlay target pattern and algorithm for layer-to-layer overlay metrology for semiconductor processing |
US6043134A (en) * | 1998-08-28 | 2000-03-28 | Micron Technology, Inc. | Semiconductor wafer alignment processes |
US6068954A (en) * | 1998-09-01 | 2000-05-30 | Micron Technology, Inc. | Semiconductor wafer alignment methods |
US6357131B1 (en) * | 1999-12-20 | 2002-03-19 | Taiwan Semiconductor Manufacturing Company | Overlay reliability monitor |
US6486954B1 (en) * | 2000-09-01 | 2002-11-26 | Kla-Tencor Technologies Corporation | Overlay alignment measurement mark |
-
2001
- 2001-05-14 DE DE60108082T patent/DE60108082T2/de not_active Expired - Fee Related
- 2001-05-14 EP EP01111670A patent/EP1258834B1/de not_active Expired - Lifetime
- 2001-05-14 AT AT01111670T patent/ATE286284T1/de not_active IP Right Cessation
-
2002
- 2002-05-02 WO PCT/EP2002/004834 patent/WO2002093485A1/en active Application Filing
- 2002-05-02 IL IL15887502A patent/IL158875A0/xx unknown
- 2002-05-02 JP JP2002590084A patent/JP2004531063A/ja active Pending
- 2002-05-02 KR KR1020037014733A patent/KR100540629B1/ko not_active IP Right Cessation
- 2002-05-06 TW TW091109332A patent/TW564510B/zh not_active IP Right Cessation
-
2003
- 2003-11-14 US US10/713,690 patent/US6908775B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20040101984A1 (en) | 2004-05-27 |
KR20040029993A (ko) | 2004-04-08 |
TW564510B (en) | 2003-12-01 |
WO2002093485A1 (en) | 2002-11-21 |
EP1258834A1 (de) | 2002-11-20 |
IL158875A0 (en) | 2004-05-12 |
EP1258834B1 (de) | 2004-12-29 |
KR100540629B1 (ko) | 2006-01-11 |
US6908775B2 (en) | 2005-06-21 |
DE60108082T2 (de) | 2005-10-13 |
DE60108082D1 (de) | 2005-02-03 |
JP2004531063A (ja) | 2004-10-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |