ATE256085T1 - Verfahren zur reduktion von kupferoxid zu metallischem kupfer - Google Patents
Verfahren zur reduktion von kupferoxid zu metallischem kupferInfo
- Publication number
- ATE256085T1 ATE256085T1 AT97935217T AT97935217T ATE256085T1 AT E256085 T1 ATE256085 T1 AT E256085T1 AT 97935217 T AT97935217 T AT 97935217T AT 97935217 T AT97935217 T AT 97935217T AT E256085 T1 ATE256085 T1 AT E256085T1
- Authority
- AT
- Austria
- Prior art keywords
- copper
- reducing
- metallic
- metallic copper
- copper oxide
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 title abstract 2
- 239000005751 Copper oxide Substances 0.000 title abstract 2
- 229910000431 copper oxide Inorganic materials 0.000 title abstract 2
- YJROYUJAFGZMJA-UHFFFAOYSA-N boron;morpholine Chemical compound [B].C1COCCN1 YJROYUJAFGZMJA-UHFFFAOYSA-N 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B6/00—Hydrides of metals including fully or partially hydrided metals, alloys or intermetallic compounds ; Compounds containing at least one metal-hydrogen bond, e.g. (GeH3)2S, SiH GeH; Monoborane or diborane; Addition complexes thereof
- C01B6/06—Hydrides of aluminium, gallium, indium, thallium, germanium, tin, lead, arsenic, antimony, bismuth or polonium; Monoborane; Diborane; Addition complexes thereof
- C01B6/10—Monoborane; Diborane; Addition complexes thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Chemically Coating (AREA)
- Chemical Treatment Of Metals (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US1997/013423 WO1999002452A1 (en) | 1995-12-19 | 1997-07-10 | Composition and method for reducing copper oxide to metallic copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE256085T1 true ATE256085T1 (de) | 2003-12-15 |
Family
ID=22261368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT97935217T ATE256085T1 (de) | 1997-07-10 | 1997-07-10 | Verfahren zur reduktion von kupferoxid zu metallischem kupfer |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0938447B1 (https=) |
| JP (1) | JP3431170B2 (https=) |
| KR (1) | KR100375589B1 (https=) |
| AT (1) | ATE256085T1 (https=) |
| CA (1) | CA2254106C (https=) |
| DE (1) | DE69726752T2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3718722B2 (ja) * | 1998-02-20 | 2005-11-24 | モートン インターナショナル，インコーポレイティド | 銅酸化物を金属銅に還元するための組成物および方法 |
| JP3387893B2 (ja) | 2000-05-26 | 2003-03-17 | マクダーミッド インコーポレーテッド | 金属表面へのポリマー材料の接着性改良方法 |
| JP6926120B2 (ja) * | 2016-05-04 | 2021-08-25 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ | 基板表面の活性化を含む基板表面に金属または金属合金を析出させるための方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4255194A (en) * | 1979-01-15 | 1981-03-10 | Mine Safety Appliances Company | Palladium alloy baths for the electroless deposition |
| JPS6267192A (ja) * | 1985-09-17 | 1987-03-26 | Shinko Electric Ind Co Ltd | 電解ニツケル−ホウ素合金めつき浴 |
| IT1256851B (it) * | 1992-01-21 | 1995-12-27 | Procedimento per promuovere l'aderenza fra diversi strati nella fabbricazione di circuiti stampati multistrato. e composizioni per l'attuazione di tale procedimento. | |
| US5721014A (en) * | 1995-12-19 | 1998-02-24 | Surface Tek Specialty Products, Inc. | Composition and method for reducing copper oxide to metallic copper |
| US5750087B1 (en) * | 1996-06-27 | 1999-12-14 | Mine Safety Appliances Co | Process for the reduction of copper oxide |
-
1997
- 1997-07-10 JP JP53606398A patent/JP3431170B2/ja not_active Expired - Fee Related
- 1997-07-10 KR KR10-1998-0710167A patent/KR100375589B1/ko not_active Expired - Fee Related
- 1997-07-10 DE DE69726752T patent/DE69726752T2/de not_active Expired - Fee Related
- 1997-07-10 EP EP97935217A patent/EP0938447B1/en not_active Expired - Lifetime
- 1997-07-10 AT AT97935217T patent/ATE256085T1/de not_active IP Right Cessation
- 1997-07-10 CA CA002254106A patent/CA2254106C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3431170B2 (ja) | 2003-07-28 |
| EP0938447A4 (https=) | 1999-09-01 |
| KR20000065233A (ko) | 2000-11-06 |
| KR100375589B1 (ko) | 2003-06-09 |
| JP2000502518A (ja) | 2000-02-29 |
| DE69726752T2 (de) | 2004-11-11 |
| EP0938447B1 (en) | 2003-12-10 |
| CA2254106A1 (en) | 1999-01-10 |
| EP0938447A1 (en) | 1999-09-01 |
| DE69726752D1 (de) | 2004-01-22 |
| CA2254106C (en) | 2003-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |