ATE197219T1 - Herstellungsverfahren einer vorrichtung zur abfuhr von wärme,die von auf einer leiterplatte angeordneten schaltkreisen erzeugt wird - Google Patents

Herstellungsverfahren einer vorrichtung zur abfuhr von wärme,die von auf einer leiterplatte angeordneten schaltkreisen erzeugt wird

Info

Publication number
ATE197219T1
ATE197219T1 AT97937646T AT97937646T ATE197219T1 AT E197219 T1 ATE197219 T1 AT E197219T1 AT 97937646 T AT97937646 T AT 97937646T AT 97937646 T AT97937646 T AT 97937646T AT E197219 T1 ATE197219 T1 AT E197219T1
Authority
AT
Austria
Prior art keywords
drain
pct
layer
card
manufacturing
Prior art date
Application number
AT97937646T
Other languages
English (en)
Inventor
Emmanuel Moreau
Christophe Dessaux
Original Assignee
Giat Ind Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giat Ind Sa filed Critical Giat Ind Sa
Application granted granted Critical
Publication of ATE197219T1 publication Critical patent/ATE197219T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Ceramic Capacitors (AREA)
AT97937646T 1996-08-23 1997-08-21 Herstellungsverfahren einer vorrichtung zur abfuhr von wärme,die von auf einer leiterplatte angeordneten schaltkreisen erzeugt wird ATE197219T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9610405A FR2752661B1 (fr) 1996-08-23 1996-08-23 Procede de fabrication d'un dispositif de dissipation de l'energie thermique produite par des composants electroniques implantes sur une carte a circuits imprimes, et dispositif ainsi obtenu
PCT/FR1997/001510 WO1998008363A1 (fr) 1996-08-23 1997-08-21 Procede de fabrication d'un dispositif de dissipation de l'energie thermique produite par des composants electroniques implantes sur une carte a circuits imprimes, et dispositif ainsi obtenu

Publications (1)

Publication Number Publication Date
ATE197219T1 true ATE197219T1 (de) 2000-11-15

Family

ID=9495183

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97937646T ATE197219T1 (de) 1996-08-23 1997-08-21 Herstellungsverfahren einer vorrichtung zur abfuhr von wärme,die von auf einer leiterplatte angeordneten schaltkreisen erzeugt wird

Country Status (12)

Country Link
US (1) US6161280A (de)
EP (1) EP0920789B1 (de)
AT (1) ATE197219T1 (de)
AU (1) AU4019697A (de)
CA (1) CA2263953C (de)
DE (1) DE69703392T2 (de)
DK (1) DK0920789T3 (de)
ES (1) ES2152105T3 (de)
FR (1) FR2752661B1 (de)
GR (1) GR3034995T3 (de)
PT (1) PT920789E (de)
WO (1) WO1998008363A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6545871B1 (en) * 2000-10-27 2003-04-08 Thomson Licensing, S.A. Apparatus for providing heat dissipation for a circuit element
US20030112710A1 (en) * 2001-12-18 2003-06-19 Eidson John C. Reducing thermal drift in electronic components
DE10235047A1 (de) * 2002-07-31 2004-02-12 Endress + Hauser Gmbh + Co. Kg Elektronikgehäuse mit integriertem Wärmeverteiler
JP5717619B2 (ja) * 2011-12-19 2015-05-13 三菱電機株式会社 電子機器ユニット
DE102015118498A1 (de) * 2015-10-29 2017-05-04 Endress+Hauser Conducta Gmbh+Co. Kg Verfahren zum Vergießen einer Leiterplatte mit Bauteilen
US20190357386A1 (en) * 2018-05-16 2019-11-21 GM Global Technology Operations LLC Vascular polymeric assembly

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT303218B (de) * 1968-04-08 1972-11-10 Siemens Ag Baueinheit für Geräte der Fernmeldetechnik
DE3151655A1 (de) * 1981-12-28 1983-07-07 Siemens AG, 1000 Berlin und 8000 München Anordnung zur kuehlung von bauelementengruppen
KR960015106B1 (ko) * 1986-11-25 1996-10-28 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체패키지 포장체
US4974119A (en) * 1988-09-14 1990-11-27 The Charles Stark Draper Laboratories, Inc. Conforming heat sink assembly
FR2654890B1 (fr) * 1989-11-17 1996-08-02 Matra Sep Imagerie Inf Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication.
US5403973A (en) * 1994-01-18 1995-04-04 Santilli; Michael A. Custom conformal heat sinking device for electronic circuit cards and methods of making the same
US5738907A (en) * 1995-08-04 1998-04-14 Eltech Systems Corporation Conductive metal porous sheet production

Also Published As

Publication number Publication date
GR3034995T3 (en) 2001-03-30
EP0920789B1 (de) 2000-10-25
CA2263953A1 (fr) 1998-02-26
EP0920789A1 (de) 1999-06-09
PT920789E (pt) 2001-01-31
CA2263953C (fr) 2004-12-14
ES2152105T3 (es) 2001-01-16
FR2752661A1 (fr) 1998-02-27
US6161280A (en) 2000-12-19
DK0920789T3 (da) 2001-01-29
DE69703392T2 (de) 2001-02-22
WO1998008363A1 (fr) 1998-02-26
AU4019697A (en) 1998-03-06
FR2752661B1 (fr) 1998-10-30
DE69703392D1 (de) 2000-11-30

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee