ATE168789T1 - Filmherstellungsverfahren und einstellvorrichtung dazu - Google Patents

Filmherstellungsverfahren und einstellvorrichtung dazu

Info

Publication number
ATE168789T1
ATE168789T1 AT92112828T AT92112828T ATE168789T1 AT E168789 T1 ATE168789 T1 AT E168789T1 AT 92112828 T AT92112828 T AT 92112828T AT 92112828 T AT92112828 T AT 92112828T AT E168789 T1 ATE168789 T1 AT E168789T1
Authority
AT
Austria
Prior art keywords
peeling jig
substrate
thin film
production method
adjusting device
Prior art date
Application number
AT92112828T
Other languages
English (en)
Inventor
Toshio Kaya
Makoto Fujimoto
Hiroaki Nakagawa
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13435887A external-priority patent/JP2673987B2/ja
Priority claimed from JP13435787A external-priority patent/JPH0812418B2/ja
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Application granted granted Critical
Publication of ATE168789T1 publication Critical patent/ATE168789T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/91—Product with molecular orientation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
AT92112828T 1987-05-28 1988-05-27 Filmherstellungsverfahren und einstellvorrichtung dazu ATE168789T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13435887A JP2673987B2 (ja) 1987-05-28 1987-05-28 膜の引剥し方法
JP13435787A JPH0812418B2 (ja) 1987-05-28 1987-05-28 ペリクルの製造方法

Publications (1)

Publication Number Publication Date
ATE168789T1 true ATE168789T1 (de) 1998-08-15

Family

ID=26468489

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92112828T ATE168789T1 (de) 1987-05-28 1988-05-27 Filmherstellungsverfahren und einstellvorrichtung dazu

Country Status (6)

Country Link
US (1) US4828640A (de)
EP (2) EP0293239B1 (de)
KR (1) KR960016311B1 (de)
AT (1) ATE168789T1 (de)
CA (2) CA1300857C (de)
DE (2) DE3885003T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3037745B2 (ja) * 1990-11-29 2000-05-08 三井化学株式会社 ペリクル構造体
EP0779539B1 (de) 1995-11-27 2002-07-17 Agfa-Gevaert Thermographisches Material mit einer organischen antistatischen Aussenschicht
US5820950A (en) * 1996-10-30 1998-10-13 Micro Lithography, Inc. Optical pellicle and package
US6444082B1 (en) * 2000-06-22 2002-09-03 International Business Machines Corporation Apparatus and method for removing a bonded lid from a substrate
KR100383265B1 (ko) * 2001-01-17 2003-05-09 삼성전자주식회사 웨이퍼 보호 테이프 제거용 반도체 제조장치
US6656320B2 (en) * 2001-07-10 2003-12-02 Asm Technology Singapore Pte Ltd Removal of masking tape from lead frames
TWI336603B (en) * 2004-12-03 2011-01-21 Ngk Spark Plug Co Method and apparatus for producing a wiring board, including film-peeling
JP4637053B2 (ja) * 2006-05-15 2011-02-23 信越化学工業株式会社 ペリクルおよびペリクル剥離装置
DE102006035644A1 (de) * 2006-07-31 2008-02-14 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Reduzieren der Kontamination durch Vorsehen einer zu entfernenden Polymerschutzschicht während der Bearbeitung von Mikrostrukturen
DE102008041436A1 (de) 2007-10-02 2009-04-09 Carl Zeiss Smt Ag Optisches Membranelement
JP5134418B2 (ja) 2008-04-01 2013-01-30 信越化学工業株式会社 リソグラフィ用ペリクル
US10710758B2 (en) * 2017-07-12 2020-07-14 Vanrx Pharmasystems Inc. Apparatus and method for monitoring and controlling the removal of a cover from a sealed tub in an aseptic environment
ITBO20120581A1 (it) * 2012-10-25 2014-04-26 Marchesini Group Spa Metodo per rimuovere la pellicola di sigillatura da un contenitore e dispositivo che attua tale metodo
JP5822401B2 (ja) * 2012-12-25 2015-11-24 信越化学工業株式会社 リソグラフィ用ペリクル
US20140238617A1 (en) * 2013-02-28 2014-08-28 General Electric Company System and method for removal of a layer
JP2022124709A (ja) * 2021-02-16 2022-08-26 株式会社ディスコ 剥離装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0119387B1 (de) * 1983-02-14 1988-08-03 The Perkin-Elmer Corporation Verfahren zur Herstellung einer Filmabdeckung für eine Photomaske
DE3435177A1 (de) * 1983-09-26 1985-04-11 Canon K.K., Tokio/Tokyo Maske fuer lithographische zwecke
US4579616A (en) * 1983-11-14 1986-04-01 The Perkin-Elmer Corporation Method of fabrication of an optically flat membrane
GB2157193B (en) * 1984-04-10 1987-08-19 Nitto Electric Ind Co Process for peeling protective film off a thin article
BE902962A (fr) * 1984-07-25 1985-11-18 Nitto Electric Ind Co Procede et appareil de developpement du type a decollement
JPS61102648A (ja) * 1984-10-26 1986-05-21 Canon Inc リソグラフイ−用マスク構造体
US4767484A (en) * 1986-02-20 1988-08-30 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Adminstration Method of attaching strain gauges to various materials

Also Published As

Publication number Publication date
CA1320070C (en) 1993-07-13
CA1300857C (en) 1992-05-19
EP0293239B1 (de) 1993-10-20
EP0513859A3 (de) 1992-12-02
DE3885003D1 (de) 1993-11-25
EP0513859A2 (de) 1992-11-19
US4828640A (en) 1989-05-09
EP0513859B1 (de) 1998-07-22
DE3856223D1 (de) 1998-08-27
KR960016311B1 (ko) 1996-12-09
DE3885003T2 (de) 1994-02-10
DE3856223T2 (de) 1998-12-24
EP0293239A2 (de) 1988-11-30
EP0293239A3 (en) 1989-11-15
KR880014664A (ko) 1988-12-24

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee