ATE152287T1 - Ein verfahren zur herstellung selbstausrichtender halbleiteranordnungen - Google Patents
Ein verfahren zur herstellung selbstausrichtender halbleiteranordnungenInfo
- Publication number
- ATE152287T1 ATE152287T1 AT89900987T AT89900987T ATE152287T1 AT E152287 T1 ATE152287 T1 AT E152287T1 AT 89900987 T AT89900987 T AT 89900987T AT 89900987 T AT89900987 T AT 89900987T AT E152287 T1 ATE152287 T1 AT E152287T1
- Authority
- AT
- Austria
- Prior art keywords
- contacts
- layer
- semiconductor devices
- polysilicon
- layer structure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
- H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
- H10D64/0113—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors the conductive layers comprising highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
- H10W20/42—Vias, e.g. via plugs
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Bipolar Transistors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12782087A | 1987-12-02 | 1987-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE152287T1 true ATE152287T1 (de) | 1997-05-15 |
Family
ID=22432120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT89900987T ATE152287T1 (de) | 1987-12-02 | 1988-12-02 | Ein verfahren zur herstellung selbstausrichtender halbleiteranordnungen |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0344292B1 (de) |
| JP (1) | JPH02502417A (de) |
| AT (1) | ATE152287T1 (de) |
| DE (1) | DE3855889T2 (de) |
| WO (1) | WO1989005516A1 (de) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5151387A (en) * | 1990-04-30 | 1992-09-29 | Sgs-Thomson Microelectronics, Inc. | Polycrystalline silicon contact structure |
| US7923313B1 (en) | 2010-02-26 | 2011-04-12 | Eastman Kodak Company | Method of making transistor including reentrant profile |
| US8803203B2 (en) | 2010-02-26 | 2014-08-12 | Eastman Kodak Company | Transistor including reentrant profile |
| US7985684B1 (en) | 2011-01-07 | 2011-07-26 | Eastman Kodak Company | Actuating transistor including reduced channel length |
| US8847232B2 (en) | 2011-01-07 | 2014-09-30 | Eastman Kodak Company | Transistor including reduced channel length |
| US8304347B2 (en) | 2011-01-07 | 2012-11-06 | Eastman Kodak Company | Actuating transistor including multiple reentrant profiles |
| US8492769B2 (en) | 2011-01-07 | 2013-07-23 | Eastman Kodak Company | Transistor including multi-layer reentrant profile |
| US8409937B2 (en) | 2011-01-07 | 2013-04-02 | Eastman Kodak Company | Producing transistor including multi-layer reentrant profile |
| US8847226B2 (en) | 2011-01-07 | 2014-09-30 | Eastman Kodak Company | Transistor including multiple reentrant profiles |
| US8383469B2 (en) | 2011-01-07 | 2013-02-26 | Eastman Kodak Company | Producing transistor including reduced channel length |
| US8338291B2 (en) | 2011-01-07 | 2012-12-25 | Eastman Kodak Company | Producing transistor including multiple reentrant profiles |
| US8592909B2 (en) | 2011-08-26 | 2013-11-26 | Eastman Kodak Company | Transistor including single layer reentrant profile |
| US8637355B2 (en) | 2011-08-26 | 2014-01-28 | Eastman Kodak Company | Actuating transistor including single layer reentrant profile |
| US8617942B2 (en) | 2011-08-26 | 2013-12-31 | Eastman Kodak Company | Producing transistor including single layer reentrant profile |
| US8803227B2 (en) | 2011-09-29 | 2014-08-12 | Eastman Kodak Company | Vertical transistor having reduced parasitic capacitance |
| US8865576B2 (en) | 2011-09-29 | 2014-10-21 | Eastman Kodak Company | Producing vertical transistor having reduced parasitic capacitance |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5420959B2 (de) * | 1974-01-23 | 1979-07-26 | ||
| US4016587A (en) * | 1974-12-03 | 1977-04-05 | International Business Machines Corporation | Raised source and drain IGFET device and method |
| JPS5254694A (en) * | 1975-10-31 | 1977-05-04 | Mitsubishi Kakoki Kk | Regeneration of catalysts for desulfurizing active carbons |
| JPS5379783A (en) * | 1976-12-24 | 1978-07-14 | Toyo Rubber Chem Ind Co Ltd | Production of adsorbent |
| NL190710C (nl) * | 1978-02-10 | 1994-07-01 | Nec Corp | Geintegreerde halfgeleiderketen. |
| JPS54140483A (en) * | 1978-04-21 | 1979-10-31 | Nec Corp | Semiconductor device |
| JPS55116443A (en) * | 1979-02-28 | 1980-09-08 | Agency Of Ind Science & Technol | Regeneration of dry type simultaneous desulfurization and denitrification catalyst |
| JPS6037047B2 (ja) * | 1979-03-09 | 1985-08-23 | 住友重機械工業株式会社 | 脱硫用活性炭の再生法 |
| JPS55163860A (en) * | 1979-06-06 | 1980-12-20 | Toshiba Corp | Manufacture of semiconductor device |
| JPS57176746A (en) * | 1981-04-21 | 1982-10-30 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor integrated circuit and manufacture thereof |
| US4374700A (en) * | 1981-05-29 | 1983-02-22 | Texas Instruments Incorporated | Method of manufacturing silicide contacts for CMOS devices |
| JPS59150536A (ja) * | 1983-02-16 | 1984-08-28 | Ishikawajima Harima Heavy Ind Co Ltd | 脱硫用活性炭の再生方法 |
-
1988
- 1988-12-02 JP JP1500874A patent/JPH02502417A/ja active Pending
- 1988-12-02 DE DE3855889T patent/DE3855889T2/de not_active Expired - Fee Related
- 1988-12-02 WO PCT/US1988/004291 patent/WO1989005516A1/en not_active Ceased
- 1988-12-02 EP EP89900987A patent/EP0344292B1/de not_active Expired - Lifetime
- 1988-12-02 AT AT89900987T patent/ATE152287T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO1989005516A1 (en) | 1989-06-15 |
| JPH02502417A (ja) | 1990-08-02 |
| EP0344292A4 (de) | 1990-05-14 |
| EP0344292B1 (de) | 1997-04-23 |
| DE3855889T2 (de) | 1997-08-07 |
| DE3855889D1 (de) | 1997-05-28 |
| EP0344292A1 (de) | 1989-12-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |