ATE150612T1 - Verfahren zur herstellung eines elektrisch leitenden kontakts - Google Patents

Verfahren zur herstellung eines elektrisch leitenden kontakts

Info

Publication number
ATE150612T1
ATE150612T1 AT92304346T AT92304346T ATE150612T1 AT E150612 T1 ATE150612 T1 AT E150612T1 AT 92304346 T AT92304346 T AT 92304346T AT 92304346 T AT92304346 T AT 92304346T AT E150612 T1 ATE150612 T1 AT E150612T1
Authority
AT
Austria
Prior art keywords
contact area
substrate
electrically conductive
copper buss
conductive contact
Prior art date
Application number
AT92304346T
Other languages
English (en)
Inventor
Alain Langevin
Auger Benoit
Charles Casavant
Wolfgang Erat
Original Assignee
Circo Craft Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circo Craft Co Inc filed Critical Circo Craft Co Inc
Application granted granted Critical
Publication of ATE150612T1 publication Critical patent/ATE150612T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Conductive Materials (AREA)
AT92304346T 1991-10-25 1992-05-14 Verfahren zur herstellung eines elektrisch leitenden kontakts ATE150612T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78282791A 1991-10-25 1991-10-25

Publications (1)

Publication Number Publication Date
ATE150612T1 true ATE150612T1 (de) 1997-04-15

Family

ID=25127294

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92304346T ATE150612T1 (de) 1991-10-25 1992-05-14 Verfahren zur herstellung eines elektrisch leitenden kontakts

Country Status (9)

Country Link
US (1) US5686135A (de)
EP (1) EP0538978B1 (de)
KR (1) KR100279112B1 (de)
AT (1) ATE150612T1 (de)
CA (1) CA2055148C (de)
DE (1) DE69218336T2 (de)
DK (1) DK0538978T3 (de)
ES (1) ES2101032T3 (de)
MX (1) MX9206131A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5871807A (en) * 1995-08-14 1999-02-16 Micron Display Technology, Inc. Multiple level printing in a single pass
US6265051B1 (en) 1998-11-20 2001-07-24 3Com Corporation Edge connectors for printed circuit boards comprising conductive ink
CN116505348A (zh) * 2022-12-21 2023-07-28 北京卫星制造厂有限公司 一种汇流片的设计与装联方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
EP0203544A2 (de) * 1985-05-31 1986-12-03 Siemens Aktiengesellschaft Kontaktflächen für Schalteinrichtungen
US4725478A (en) * 1985-09-04 1988-02-16 W. R. Grace & Co. Heat-miniaturizable printed circuit board
JPS62184785U (de) * 1986-05-16 1987-11-24
US4837050A (en) * 1986-09-30 1989-06-06 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electrically conductive circuits on a base board
US4747211A (en) * 1987-02-09 1988-05-31 Sheldahl, Inc. Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films
JPH01226273A (ja) * 1988-03-07 1989-09-08 Oki Electric Ind Co Ltd 電子黒板装置
JPH0682926B2 (ja) * 1988-04-22 1994-10-19 日本電気株式会社 多層配線基板の製造方法
JP2773288B2 (ja) * 1989-08-31 1998-07-09 松下電器産業株式会社 プリント配線板
JPH04354398A (ja) * 1991-05-31 1992-12-08 Internatl Business Mach Corp <Ibm> 配線基板及びその製造方法

Also Published As

Publication number Publication date
EP0538978A3 (en) 1993-08-18
KR100279112B1 (ko) 2001-02-01
US5686135A (en) 1997-11-11
EP0538978A2 (de) 1993-04-28
ES2101032T3 (es) 1997-07-01
DE69218336D1 (de) 1997-04-24
CA2055148A1 (en) 1993-04-26
DK0538978T3 (da) 1997-09-08
EP0538978B1 (de) 1997-03-19
DE69218336T2 (de) 1997-09-25
KR930009487A (ko) 1993-05-22
MX9206131A (es) 1993-04-01
CA2055148C (en) 2002-06-18

Similar Documents

Publication Publication Date Title
GB2341277A (en) An electronic component package with posts on the active surface
EP0997935A4 (de) Gedruckte leitterplatte und verfahren zu deren herstellung
ATE99828T1 (de) Elektrischer widerstand in chip-bauweise fuer oberflaechenbestueckung und verfahren zu seiner herstellung.
DE69218336D1 (de) Verfahren zur Herstellung eines elektrisch leitenden Kontakts
DE3586422D1 (de) Elektrisch leitende kupferschichten und verfahren zur herstellung derselben.
EP0242020A3 (de) Elektrische Schaltkreise
SE9600085D0 (sv) Skärmning av elektroniska komponenter som plastinbakats direkt på kretskort
KR970073240A (ko) 절연도료, 이 도료의 도포막을 갖는 프린트 배선기판, 이 도료를 사용하는 절연성 저하예방법 및 절연성 회복법(Insulating coating material, a printed circuit board having a coating film of the same coating material, and a method of prevention a fall of the insulation and a method of recovery a insulation using of the same coating material)
DE3885457D1 (de) Verfahren zum Herstellen von durchkontaktierten Leiterplatten mit sehr kleinen oder keinen Löträndern um die Durchkontaktierungslöcher.
JPH0224395B2 (de)
EP0171630A3 (de) System zur Herstellung elektrischer Verbindungen mit hoher Auflösung auf einer gedruckten Schaltung
JPS63150993A (ja) プリント配線板の製造方法
ATE161384T1 (de) Verfahren zur durchkontaktierung von leiterplatten
GB2007029A (en) A method of producing printed circuit boards, and circuit boards produced by the method
JPS6457795A (en) Manufacture of thick film circuit device
JPS635916B2 (de)
JPS6448493A (en) Manufacture of flexible printed wiring board
JPS61194795A (ja) プリント配線板の製造方法
JPH0537147A (ja) 電子部品の絶縁方法
JPS6313400A (ja) 転写回路付き射出成形体
JPS6464292A (en) Manufacture of printed board
JPS6312192A (ja) 電気回路形成方法
JPS6436084A (en) Thin film photosensor
DE50010777D1 (de) Verfahren zur herstellung eines trägerelementes für einen ic-baustein
JPS6196797A (ja) 厚膜ｈｉｃ多層基板の製造方法

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
EEFA Change of the company name
REN Ceased due to non-payment of the annual fee