GB2007029A - A method of producing printed circuit boards, and circuit boards produced by the method - Google Patents

A method of producing printed circuit boards, and circuit boards produced by the method

Info

Publication number
GB2007029A
GB2007029A GB7841104A GB7841104A GB2007029A GB 2007029 A GB2007029 A GB 2007029A GB 7841104 A GB7841104 A GB 7841104A GB 7841104 A GB7841104 A GB 7841104A GB 2007029 A GB2007029 A GB 2007029A
Authority
GB
United Kingdom
Prior art keywords
ways
circuit boards
conductive
varnish
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7841104A
Other versions
GB2007029B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RUF KG W
Wilhelm Ruf KG
Original Assignee
RUF KG W
Wilhelm Ruf KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RUF KG W, Wilhelm Ruf KG filed Critical RUF KG W
Publication of GB2007029A publication Critical patent/GB2007029A/en
Application granted granted Critical
Publication of GB2007029B publication Critical patent/GB2007029B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/249—Finish coating of conductors by using conductive pastes, inks or powders comprising carbon particles as main constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

In a method of producing printed circuit boards in which e.g. metallic conductive ways, which if required intersect with interposition of an insulating layer, and contact ways or electrical connecting surfaces, are formed e.g. by printing on a baseplate 1 of insulating material, the baseplate is covered first with a layer 2 of varnish, then the conductive ways 3 are applied to the layer of varnish, then insulating varnish is applied to points of intersection between the conductive ways, then intersecting conductive ways are formed over the insulating varnish, and finally the conductive ways are covered with a layer 4 of varnish which has been made electrically conductive, e.g. by carbon filling. The metallic conductive ways may be replaced by ways of conductive varnish. <IMAGE>
GB7841104A 1977-10-27 1978-10-18 Method of producing printed circuit boards and circuit boards produced by the method Expired GB2007029B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2748271A DE2748271C3 (en) 1977-10-27 1977-10-27 Printed circuit board and method of making the same

Publications (2)

Publication Number Publication Date
GB2007029A true GB2007029A (en) 1979-05-10
GB2007029B GB2007029B (en) 1982-09-22

Family

ID=6022447

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7841104A Expired GB2007029B (en) 1977-10-27 1978-10-18 Method of producing printed circuit boards and circuit boards produced by the method

Country Status (7)

Country Link
AT (1) AT378309B (en)
DE (1) DE2748271C3 (en)
FR (1) FR2407640A1 (en)
GB (1) GB2007029B (en)
IT (1) IT1100138B (en)
SE (1) SE440018B (en)
YU (2) YU247978A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4440823A (en) * 1980-04-09 1984-04-03 Wilhelm Ruf Kg Printed board for electrical circuits

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0196865B1 (en) * 1985-03-27 1990-09-12 Ibiden Co, Ltd. Electronic circuit substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5535843B2 (en) * 1972-12-28 1980-09-17
DE2424747C3 (en) * 1974-05-21 1978-11-02 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka (Japan) Printed circuit
DE7624175U1 (en) * 1976-07-31 1976-11-25 Wilhelm Ruf Kg, 8000 Muenchen keyboard

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4440823A (en) * 1980-04-09 1984-04-03 Wilhelm Ruf Kg Printed board for electrical circuits

Also Published As

Publication number Publication date
IT1100138B (en) 1985-09-28
GB2007029B (en) 1982-09-22
IT7829084A0 (en) 1978-10-25
ATA734778A (en) 1984-11-15
SE440018B (en) 1985-07-08
AT378309B (en) 1985-07-25
DE2748271B2 (en) 1980-08-07
SE7811130L (en) 1979-04-28
YU41275B (en) 1986-12-31
YU240182A (en) 1985-04-30
FR2407640B3 (en) 1981-06-26
YU247978A (en) 1983-01-21
DE2748271C3 (en) 1981-07-16
DE2748271A1 (en) 1979-05-03
FR2407640A1 (en) 1979-05-25

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee