GB2007029A - A method of producing printed circuit boards, and circuit boards produced by the method - Google Patents
A method of producing printed circuit boards, and circuit boards produced by the methodInfo
- Publication number
- GB2007029A GB2007029A GB7841104A GB7841104A GB2007029A GB 2007029 A GB2007029 A GB 2007029A GB 7841104 A GB7841104 A GB 7841104A GB 7841104 A GB7841104 A GB 7841104A GB 2007029 A GB2007029 A GB 2007029A
- Authority
- GB
- United Kingdom
- Prior art keywords
- ways
- circuit boards
- conductive
- varnish
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000002966 varnish Substances 0.000 abstract 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
- H05K3/249—Finish coating of conductors by using conductive pastes, inks or powders comprising carbon particles as main constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
In a method of producing printed circuit boards in which e.g. metallic conductive ways, which if required intersect with interposition of an insulating layer, and contact ways or electrical connecting surfaces, are formed e.g. by printing on a baseplate 1 of insulating material, the baseplate is covered first with a layer 2 of varnish, then the conductive ways 3 are applied to the layer of varnish, then insulating varnish is applied to points of intersection between the conductive ways, then intersecting conductive ways are formed over the insulating varnish, and finally the conductive ways are covered with a layer 4 of varnish which has been made electrically conductive, e.g. by carbon filling. The metallic conductive ways may be replaced by ways of conductive varnish. <IMAGE>
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2748271A DE2748271C3 (en) | 1977-10-27 | 1977-10-27 | Printed circuit board and method of making the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2007029A true GB2007029A (en) | 1979-05-10 |
| GB2007029B GB2007029B (en) | 1982-09-22 |
Family
ID=6022447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB7841104A Expired GB2007029B (en) | 1977-10-27 | 1978-10-18 | Method of producing printed circuit boards and circuit boards produced by the method |
Country Status (7)
| Country | Link |
|---|---|
| AT (1) | AT378309B (en) |
| DE (1) | DE2748271C3 (en) |
| FR (1) | FR2407640A1 (en) |
| GB (1) | GB2007029B (en) |
| IT (1) | IT1100138B (en) |
| SE (1) | SE440018B (en) |
| YU (2) | YU247978A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4440823A (en) * | 1980-04-09 | 1984-04-03 | Wilhelm Ruf Kg | Printed board for electrical circuits |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0196865B1 (en) * | 1985-03-27 | 1990-09-12 | Ibiden Co, Ltd. | Electronic circuit substrates |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5535843B2 (en) * | 1972-12-28 | 1980-09-17 | ||
| DE2424747C3 (en) * | 1974-05-21 | 1978-11-02 | Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka (Japan) | Printed circuit |
| DE7624175U1 (en) * | 1976-07-31 | 1976-11-25 | Wilhelm Ruf Kg, 8000 Muenchen | keyboard |
-
1977
- 1977-10-27 DE DE2748271A patent/DE2748271C3/en not_active Expired
-
1978
- 1978-10-12 AT AT0734778A patent/AT378309B/en not_active IP Right Cessation
- 1978-10-18 GB GB7841104A patent/GB2007029B/en not_active Expired
- 1978-10-18 FR FR7829654A patent/FR2407640A1/en active Granted
- 1978-10-24 YU YU02479/78A patent/YU247978A/en unknown
- 1978-10-25 IT IT29084/78A patent/IT1100138B/en active
- 1978-10-26 SE SE7811130A patent/SE440018B/en not_active IP Right Cessation
-
1982
- 1982-10-26 YU YU2401/82A patent/YU41275B/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4440823A (en) * | 1980-04-09 | 1984-04-03 | Wilhelm Ruf Kg | Printed board for electrical circuits |
Also Published As
| Publication number | Publication date |
|---|---|
| SE7811130L (en) | 1979-04-28 |
| YU247978A (en) | 1983-01-21 |
| FR2407640B3 (en) | 1981-06-26 |
| AT378309B (en) | 1985-07-25 |
| FR2407640A1 (en) | 1979-05-25 |
| SE440018B (en) | 1985-07-08 |
| IT1100138B (en) | 1985-09-28 |
| DE2748271B2 (en) | 1980-08-07 |
| DE2748271C3 (en) | 1981-07-16 |
| GB2007029B (en) | 1982-09-22 |
| YU41275B (en) | 1986-12-31 |
| DE2748271A1 (en) | 1979-05-03 |
| ATA734778A (en) | 1984-11-15 |
| IT7829084A0 (en) | 1978-10-25 |
| YU240182A (en) | 1985-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5579152A (en) | Insulating material*making method thereof* and printed circuit board or electro conductive plate having said insulating material | |
| JPS5717354B2 (en) | ||
| JPS5717194A (en) | Method of providing conductor path on insulator substrate | |
| CA2097049A1 (en) | Heater Element for a Tube Connecting Device | |
| ES230456U (en) | Keyboard switch assembly with printed circuit board | |
| CA2030826A1 (en) | Composite circuit board with thick embedded conductor and method of manufacturing the same | |
| JPS5527647A (en) | Paint for forming insulating film of conductive printed circuit board and method of forming insulating film | |
| DE3460837D1 (en) | Process for producing an electrically conductive layer on a solid electrolyte surface, and electrically conductive layer | |
| GB2246480A (en) | P.C.B circuit shielding | |
| EP0288807A3 (en) | Conductive structures in polymers | |
| ES182331U (en) | Provision of electrical circuit printed. (Machine-translation by Google Translate, not legally binding) | |
| GB2007029A (en) | A method of producing printed circuit boards, and circuit boards produced by the method | |
| GB2163907A (en) | Making printed circuit boards | |
| EP0138673A3 (en) | Method of making a printed circuit board | |
| GB2004695A (en) | Improvements in or relating to electrical components sheathed with insulating material and methods of making such components | |
| EP0130462A3 (en) | Printed circuits | |
| KR970073240A (en) | Insulating coating material, a printed circuit board having a coating film of the same coating material, and a method of prevention a fall of the insulation and a method of recovery a insulation using of the same coating material) | |
| GB1425373A (en) | Thick film electrical circuits | |
| GB1254281A (en) | Printed circuits | |
| JPS5779628A (en) | Hybrid integrated circuit | |
| JPS6425595A (en) | Electronic circuit board | |
| EP0538978A3 (en) | Method of forming an electrically conductive contact on a substrate | |
| JPS5696253A (en) | Surface potentiometer | |
| JPH0352234B2 (en) | ||
| JPS53111261A (en) | Manufacture of piezo-electric element parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |