SE7811130L - PROCEDURE FOR MANUFACTURE OF PRINTED CIRCUIT PLATES AND PRINTED CIRCUIT PLATES MANUFACTURED ACCORDING TO THE PROCEDURE - Google Patents

PROCEDURE FOR MANUFACTURE OF PRINTED CIRCUIT PLATES AND PRINTED CIRCUIT PLATES MANUFACTURED ACCORDING TO THE PROCEDURE

Info

Publication number
SE7811130L
SE7811130L SE7811130A SE7811130A SE7811130L SE 7811130 L SE7811130 L SE 7811130L SE 7811130 A SE7811130 A SE 7811130A SE 7811130 A SE7811130 A SE 7811130A SE 7811130 L SE7811130 L SE 7811130L
Authority
SE
Sweden
Prior art keywords
procedure
printed circuit
circuit plates
manufacture
manufactured according
Prior art date
Application number
SE7811130A
Other languages
Swedish (sv)
Other versions
SE440018B (en
Inventor
I Berlitz
T Hargita
H Hafner
Original Assignee
Ruf Kg Wilhelm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ruf Kg Wilhelm filed Critical Ruf Kg Wilhelm
Publication of SE7811130L publication Critical patent/SE7811130L/en
Publication of SE440018B publication Critical patent/SE440018B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/249—Finish coating of conductors by using conductive pastes, inks or powders comprising carbon particles as main constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
SE7811130A 1977-10-27 1978-10-26 PRINTED CIRCUIT AND PROCEDURE FOR ITS PREPARATION SE440018B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2748271A DE2748271C3 (en) 1977-10-27 1977-10-27 Printed circuit board and method of making the same

Publications (2)

Publication Number Publication Date
SE7811130L true SE7811130L (en) 1979-04-28
SE440018B SE440018B (en) 1985-07-08

Family

ID=6022447

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7811130A SE440018B (en) 1977-10-27 1978-10-26 PRINTED CIRCUIT AND PROCEDURE FOR ITS PREPARATION

Country Status (7)

Country Link
AT (1) AT378309B (en)
DE (1) DE2748271C3 (en)
FR (1) FR2407640A1 (en)
GB (1) GB2007029B (en)
IT (1) IT1100138B (en)
SE (1) SE440018B (en)
YU (2) YU247978A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3013667C2 (en) * 1980-04-09 1983-01-20 Wilhelm Ruf KG, 8000 München Printed circuit board and process for their manufacture
DE3674034D1 (en) * 1985-03-27 1990-10-18 Ibiden Co Ltd SUBSTRATES FOR ELECTRONIC CIRCUITS.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5535843B2 (en) * 1972-12-28 1980-09-17
DE2424747C3 (en) * 1974-05-21 1978-11-02 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka (Japan) Printed circuit
DE7624175U1 (en) * 1976-07-31 1976-11-25 Wilhelm Ruf Kg, 8000 Muenchen keyboard

Also Published As

Publication number Publication date
YU240182A (en) 1985-04-30
IT7829084A0 (en) 1978-10-25
DE2748271C3 (en) 1981-07-16
ATA734778A (en) 1984-11-15
FR2407640B3 (en) 1981-06-26
YU41275B (en) 1986-12-31
DE2748271B2 (en) 1980-08-07
YU247978A (en) 1983-01-21
GB2007029A (en) 1979-05-10
AT378309B (en) 1985-07-25
SE440018B (en) 1985-07-08
GB2007029B (en) 1982-09-22
IT1100138B (en) 1985-09-28
FR2407640A1 (en) 1979-05-25
DE2748271A1 (en) 1979-05-03

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