SE7802720L - PROCEDURE AND DEVICE FOR THE MANUFACTURE OF PRINTED CIRCUIT CARDS - Google Patents

PROCEDURE AND DEVICE FOR THE MANUFACTURE OF PRINTED CIRCUIT CARDS

Info

Publication number
SE7802720L
SE7802720L SE7802720A SE7802720A SE7802720L SE 7802720 L SE7802720 L SE 7802720L SE 7802720 A SE7802720 A SE 7802720A SE 7802720 A SE7802720 A SE 7802720A SE 7802720 L SE7802720 L SE 7802720L
Authority
SE
Sweden
Prior art keywords
procedure
manufacture
printed circuit
circuit cards
cards
Prior art date
Application number
SE7802720A
Other languages
Swedish (sv)
Other versions
SE429702B (en
Inventor
R P Burr
R Morino
R J Keogh
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE7802720L publication Critical patent/SE7802720L/en
Publication of SE429702B publication Critical patent/SE429702B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SE7802720A 1977-08-09 1978-03-09 PROCEDURE AND DEVICE FOR ASTAD COMMUNICATION OF LEADING CONNECTIONS SE429702B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82315377A 1977-08-09 1977-08-09

Publications (2)

Publication Number Publication Date
SE7802720L true SE7802720L (en) 1979-02-10
SE429702B SE429702B (en) 1983-09-19

Family

ID=25237948

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7802720A SE429702B (en) 1977-08-09 1978-03-09 PROCEDURE AND DEVICE FOR ASTAD COMMUNICATION OF LEADING CONNECTIONS

Country Status (14)

Country Link
JP (1) JPS5430470A (en)
AT (1) AT377890B (en)
AU (1) AU508357B2 (en)
BR (1) BR7707302A (en)
CA (1) CA1102924A (en)
CH (1) CH629058A5 (en)
DE (1) DE2811458C2 (en)
FR (1) FR2400304A1 (en)
GB (1) GB1593235A (en)
IL (1) IL54283A (en)
IT (1) IT1155890B (en)
NL (1) NL7806258A (en)
SE (1) SE429702B (en)
ZA (1) ZA775455B (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2466936A1 (en) * 1979-09-28 1981-04-10 Cii Honeywell Bull APPARATUS FOR WIRING TO THE SURFACE OF AN INTERCONNECT SUBSTRATE
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
FR2507855A1 (en) * 1981-06-11 1982-12-17 Kurganov Vladimir Tension controlling distributor head for an automatic wiring machine - has electromagnets controlling tensioning jaw pivotable w.r.t. fixed jaw, and wire breakage restoring mechanism
FR2509950A1 (en) * 1981-07-16 1983-01-21 Egorenkov Arvit Circuit board wiring device - uses programme control to coordinate circuit board displacement with wire feeding and soldering operations
JPS59186851A (en) * 1983-04-04 1984-10-23 Kataoka Kikai Seisakusho:Kk Sheet winding preparing device
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
FR2585210B1 (en) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4641773A (en) * 1985-08-09 1987-02-10 Kollmorgen Technologies Corp. Ultrasonic stylus position stabilizer
US4908939A (en) * 1985-10-18 1990-03-20 Kollmorgen Corporation Method of making coaxial interconnection boards
JP2612038B2 (en) * 1988-06-22 1997-05-21 大日本印刷株式会社 Film bonding equipment for small winding bobbins
JP2672925B2 (en) * 1992-08-26 1997-11-05 ワイケイケイ株式会社 Automatic tape winding machine
EP2039460A3 (en) 2004-11-02 2014-07-02 HID Global GmbH Relocation device, contacting device, delivery system, relocation and contacting unit production facility, production method and a transponder unit
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7979975B2 (en) 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
US7546671B2 (en) 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US8322624B2 (en) 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7980477B2 (en) 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
ATE488816T1 (en) 2007-09-18 2010-12-15 Hid Global Ireland Teoranta METHOD FOR CONTACTING A WIRE CONDUCTOR PLACED ON A SUBSTRATE
EP2704186A1 (en) * 2012-08-27 2014-03-05 Garreth Finlay Method for laying a wire conductor onto a substrate and for connecting it to a chip

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE663052A (en) * 1964-04-27
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (en) * 1970-03-05 1980-12-17
FR2304247A1 (en) * 1975-03-12 1976-10-08 Commissariat Energie Atomique METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS

Also Published As

Publication number Publication date
DE2811458A1 (en) 1979-02-15
JPS5430470A (en) 1979-03-06
AU508357B2 (en) 1980-03-20
IT1155890B (en) 1987-01-28
FR2400304A1 (en) 1979-03-09
CH629058A5 (en) 1982-03-31
GB1593235A (en) 1981-07-15
BR7707302A (en) 1979-05-29
IL54283A (en) 1980-07-31
IL54283A0 (en) 1978-06-15
AU3026177A (en) 1979-05-10
CA1102924A (en) 1981-06-09
ZA775455B (en) 1978-07-26
DE2811458C2 (en) 1983-12-29
FR2400304B1 (en) 1982-02-12
NL7806258A (en) 1979-02-13
SE429702B (en) 1983-09-19
IT7848473A0 (en) 1978-03-17
JPS618596B2 (en) 1986-03-15
AT377890B (en) 1985-05-10
ATA183578A (en) 1984-09-15

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