ATA183578A - METHOD AND DEVICE FOR PRODUCING ELECTRICAL CIRCUIT WIRES - Google Patents

METHOD AND DEVICE FOR PRODUCING ELECTRICAL CIRCUIT WIRES

Info

Publication number
ATA183578A
ATA183578A AT0183578A AT183578A ATA183578A AT A183578 A ATA183578 A AT A183578A AT 0183578 A AT0183578 A AT 0183578A AT 183578 A AT183578 A AT 183578A AT A183578 A ATA183578 A AT A183578A
Authority
AT
Austria
Prior art keywords
electrical circuit
producing electrical
circuit wires
wires
producing
Prior art date
Application number
AT0183578A
Other languages
German (de)
Other versions
AT377890B (en
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of ATA183578A publication Critical patent/ATA183578A/en
Application granted granted Critical
Publication of AT377890B publication Critical patent/AT377890B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AT0183578A 1977-08-09 1978-03-15 METHOD AND DEVICE FOR PRODUCING ELECTRICAL CIRCUIT WIRES AT377890B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82315377A 1977-08-09 1977-08-09

Publications (2)

Publication Number Publication Date
ATA183578A true ATA183578A (en) 1984-09-15
AT377890B AT377890B (en) 1985-05-10

Family

ID=25237948

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0183578A AT377890B (en) 1977-08-09 1978-03-15 METHOD AND DEVICE FOR PRODUCING ELECTRICAL CIRCUIT WIRES

Country Status (14)

Country Link
JP (1) JPS5430470A (en)
AT (1) AT377890B (en)
AU (1) AU508357B2 (en)
BR (1) BR7707302A (en)
CA (1) CA1102924A (en)
CH (1) CH629058A5 (en)
DE (1) DE2811458C2 (en)
FR (1) FR2400304A1 (en)
GB (1) GB1593235A (en)
IL (1) IL54283A (en)
IT (1) IT1155890B (en)
NL (1) NL7806258A (en)
SE (1) SE429702B (en)
ZA (1) ZA775455B (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2466936A1 (en) * 1979-09-28 1981-04-10 Cii Honeywell Bull APPARATUS FOR WIRING TO THE SURFACE OF AN INTERCONNECT SUBSTRATE
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
FR2507855A1 (en) * 1981-06-11 1982-12-17 Kurganov Vladimir Tension controlling distributor head for an automatic wiring machine - has electromagnets controlling tensioning jaw pivotable w.r.t. fixed jaw, and wire breakage restoring mechanism
FR2509950A1 (en) * 1981-07-16 1983-01-21 Egorenkov Arvit Circuit board wiring device - uses programme control to coordinate circuit board displacement with wire feeding and soldering operations
JPS59186851A (en) * 1983-04-04 1984-10-23 Kataoka Kikai Seisakusho:Kk Sheet winding preparing device
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
FR2585210B1 (en) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4641773A (en) * 1985-08-09 1987-02-10 Kollmorgen Technologies Corp. Ultrasonic stylus position stabilizer
US4908939A (en) * 1985-10-18 1990-03-20 Kollmorgen Corporation Method of making coaxial interconnection boards
JP2612038B2 (en) * 1988-06-22 1997-05-21 大日本印刷株式会社 Film bonding equipment for small winding bobbins
JP2672925B2 (en) * 1992-08-26 1997-11-05 ワイケイケイ株式会社 Automatic tape winding machine
WO2006050691A2 (en) 2004-11-02 2006-05-18 Imasys Ag Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8322624B2 (en) 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US7979975B2 (en) 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US7546671B2 (en) 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7980477B2 (en) 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
DE602007010634D1 (en) 2007-09-18 2010-12-30 Baile Na Habhann Co Galway Method for contacting a wire conductor laid on a substrate
EP2704186A1 (en) * 2012-08-27 2014-03-05 Garreth Finlay Method for laying a wire conductor onto a substrate and for connecting it to a chip

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE663052A (en) * 1964-04-27
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (en) * 1970-03-05 1980-12-17
FR2304247A1 (en) * 1975-03-12 1976-10-08 Commissariat Energie Atomique METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS

Also Published As

Publication number Publication date
IT7848473A0 (en) 1978-03-17
JPS618596B2 (en) 1986-03-15
IT1155890B (en) 1987-01-28
ZA775455B (en) 1978-07-26
DE2811458A1 (en) 1979-02-15
SE429702B (en) 1983-09-19
DE2811458C2 (en) 1983-12-29
SE7802720L (en) 1979-02-10
JPS5430470A (en) 1979-03-06
AU508357B2 (en) 1980-03-20
IL54283A0 (en) 1978-06-15
AU3026177A (en) 1979-05-10
BR7707302A (en) 1979-05-29
IL54283A (en) 1980-07-31
CA1102924A (en) 1981-06-09
GB1593235A (en) 1981-07-15
CH629058A5 (en) 1982-03-31
NL7806258A (en) 1979-02-13
FR2400304A1 (en) 1979-03-09
AT377890B (en) 1985-05-10
FR2400304B1 (en) 1982-02-12

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Legal Events

Date Code Title Description
EIH Change in the person of patent owner
EIH Change in the person of patent owner
ELJ Ceased due to non-payment of the annual fee
REN Ceased due to non-payment of the annual fee