FR2407640A1 - PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOARDS OBTAINED BY THIS PROCESS - Google Patents

PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOARDS OBTAINED BY THIS PROCESS

Info

Publication number
FR2407640A1
FR2407640A1 FR7829654A FR7829654A FR2407640A1 FR 2407640 A1 FR2407640 A1 FR 2407640A1 FR 7829654 A FR7829654 A FR 7829654A FR 7829654 A FR7829654 A FR 7829654A FR 2407640 A1 FR2407640 A1 FR 2407640A1
Authority
FR
France
Prior art keywords
printed circuit
circuit boards
printed
conductors
lacquer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7829654A
Other languages
French (fr)
Other versions
FR2407640B3 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wilhelm Ruf KG
Original Assignee
Wilhelm Ruf KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wilhelm Ruf KG filed Critical Wilhelm Ruf KG
Publication of FR2407640A1 publication Critical patent/FR2407640A1/en
Application granted granted Critical
Publication of FR2407640B3 publication Critical patent/FR2407640B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/249—Finish coating of conductors by using conductive pastes, inks or powders comprising carbon particles as main constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

CETTE INVENTION CONCERNE LA FABRICATION DE PLAQUETTES DE CIRCUIT IMPRIME. SELON CE PROCEDE, ON APPLIQUE D'ABORD SUR UNE PLAQUETTE DE SUPPORT UNE COUCHE DE LAQUE, PUIS SUR CELLE-CI LES CONDUCTEURS IMPRIMES EN METAL ET, AVEC INTERPOSITION D'UNE LAQUE ISOLANTE, LES CONDUCTEURS IMPRIMES D'INTERSECTION EGALEMENT EN METAL, ET ON RECOUVRE L'ENSEMBLE DES CONDUCTEURS IMPRIMES AVEC UNE COUCHE DE LAQUE RENDUE CONDUCTRICE DE L'ELECTRICITE, PAR EXEMPLE AU MOYEN D'UNE CHARGE DE NOIR DE FUMEE. LES CONDUCTEURS IMPRIMES PEUVENT ETRE EGALEMENT EN LAQUE CONDUCTRICE. ON EVITE DE CETTE MANIERE LES DEPLACEMENTS D'IONS ARGENT SUSCEPTIBLES DE CREER DES COURTS-CIRCUITS DANS LA PLAQUETTE DE CIRCUIT IMPRIME.THIS INVENTION RELATES TO THE MANUFACTURE OF PRINTED CIRCUIT BOARDS. ACCORDING TO THIS PROCEDURE, A LACQUER LAYER IS FIRST APPLIED ON A SUPPORT PLATE, THEN ON THIS THE PRINTED METAL CONDUCTORS AND, WITH THE INTERPOSITION OF AN INSULATING LACQUER, THE PRINTED INTERSECTION CONDUCTORS ALSO IN METAL, AND ALL OF THE PRINTED CONDUCTORS ARE COVERED WITH AN ELECTRICALLY CONDUCTIVE LACQUER LAYER, FOR EXAMPLE BY MEANS OF A CHARGE OF BLACK SMOKE. THE PRINTED CONDUCTORS MAY ALSO BE IN CONDUCTIVE LACQUER. IN THIS WAY, MOVEMENTS OF SILVER IONS LIKELY TO CREATE SHORT-CIRCUITS IN THE PRINTED CIRCUIT BOARD IS AVOIDED.

FR7829654A 1977-10-27 1978-10-18 PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOARDS OBTAINED BY THIS PROCESS Granted FR2407640A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2748271A DE2748271C3 (en) 1977-10-27 1977-10-27 Printed circuit board and method of making the same

Publications (2)

Publication Number Publication Date
FR2407640A1 true FR2407640A1 (en) 1979-05-25
FR2407640B3 FR2407640B3 (en) 1981-06-26

Family

ID=6022447

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7829654A Granted FR2407640A1 (en) 1977-10-27 1978-10-18 PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOARDS OBTAINED BY THIS PROCESS

Country Status (7)

Country Link
AT (1) AT378309B (en)
DE (1) DE2748271C3 (en)
FR (1) FR2407640A1 (en)
GB (1) GB2007029B (en)
IT (1) IT1100138B (en)
SE (1) SE440018B (en)
YU (2) YU247978A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3013667C2 (en) * 1980-04-09 1983-01-20 Wilhelm Ruf KG, 8000 München Printed circuit board and process for their manufacture
DE3674034D1 (en) * 1985-03-27 1990-10-18 Ibiden Co Ltd SUBSTRATES FOR ELECTRONIC CIRCUITS.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5535843B2 (en) * 1972-12-28 1980-09-17
DE2424747C3 (en) * 1974-05-21 1978-11-02 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka (Japan) Printed circuit
DE7624175U1 (en) * 1976-07-31 1976-11-25 Wilhelm Ruf Kg, 8000 Muenchen keyboard

Also Published As

Publication number Publication date
YU240182A (en) 1985-04-30
IT7829084A0 (en) 1978-10-25
DE2748271C3 (en) 1981-07-16
ATA734778A (en) 1984-11-15
FR2407640B3 (en) 1981-06-26
YU41275B (en) 1986-12-31
SE7811130L (en) 1979-04-28
DE2748271B2 (en) 1980-08-07
YU247978A (en) 1983-01-21
GB2007029A (en) 1979-05-10
AT378309B (en) 1985-07-25
SE440018B (en) 1985-07-08
GB2007029B (en) 1982-09-22
IT1100138B (en) 1985-09-28
DE2748271A1 (en) 1979-05-03

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