FR2407640A1 - PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOARDS OBTAINED BY THIS PROCESS - Google Patents
PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOARDS OBTAINED BY THIS PROCESSInfo
- Publication number
- FR2407640A1 FR2407640A1 FR7829654A FR7829654A FR2407640A1 FR 2407640 A1 FR2407640 A1 FR 2407640A1 FR 7829654 A FR7829654 A FR 7829654A FR 7829654 A FR7829654 A FR 7829654A FR 2407640 A1 FR2407640 A1 FR 2407640A1
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- circuit boards
- printed
- conductors
- lacquer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
- H05K3/249—Finish coating of conductors by using conductive pastes, inks or powders comprising carbon particles as main constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
CETTE INVENTION CONCERNE LA FABRICATION DE PLAQUETTES DE CIRCUIT IMPRIME. SELON CE PROCEDE, ON APPLIQUE D'ABORD SUR UNE PLAQUETTE DE SUPPORT UNE COUCHE DE LAQUE, PUIS SUR CELLE-CI LES CONDUCTEURS IMPRIMES EN METAL ET, AVEC INTERPOSITION D'UNE LAQUE ISOLANTE, LES CONDUCTEURS IMPRIMES D'INTERSECTION EGALEMENT EN METAL, ET ON RECOUVRE L'ENSEMBLE DES CONDUCTEURS IMPRIMES AVEC UNE COUCHE DE LAQUE RENDUE CONDUCTRICE DE L'ELECTRICITE, PAR EXEMPLE AU MOYEN D'UNE CHARGE DE NOIR DE FUMEE. LES CONDUCTEURS IMPRIMES PEUVENT ETRE EGALEMENT EN LAQUE CONDUCTRICE. ON EVITE DE CETTE MANIERE LES DEPLACEMENTS D'IONS ARGENT SUSCEPTIBLES DE CREER DES COURTS-CIRCUITS DANS LA PLAQUETTE DE CIRCUIT IMPRIME.THIS INVENTION RELATES TO THE MANUFACTURE OF PRINTED CIRCUIT BOARDS. ACCORDING TO THIS PROCEDURE, A LACQUER LAYER IS FIRST APPLIED ON A SUPPORT PLATE, THEN ON THIS THE PRINTED METAL CONDUCTORS AND, WITH THE INTERPOSITION OF AN INSULATING LACQUER, THE PRINTED INTERSECTION CONDUCTORS ALSO IN METAL, AND ALL OF THE PRINTED CONDUCTORS ARE COVERED WITH AN ELECTRICALLY CONDUCTIVE LACQUER LAYER, FOR EXAMPLE BY MEANS OF A CHARGE OF BLACK SMOKE. THE PRINTED CONDUCTORS MAY ALSO BE IN CONDUCTIVE LACQUER. IN THIS WAY, MOVEMENTS OF SILVER IONS LIKELY TO CREATE SHORT-CIRCUITS IN THE PRINTED CIRCUIT BOARD IS AVOIDED.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2748271A DE2748271C3 (en) | 1977-10-27 | 1977-10-27 | Printed circuit board and method of making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2407640A1 true FR2407640A1 (en) | 1979-05-25 |
FR2407640B3 FR2407640B3 (en) | 1981-06-26 |
Family
ID=6022447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7829654A Granted FR2407640A1 (en) | 1977-10-27 | 1978-10-18 | PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOARDS OBTAINED BY THIS PROCESS |
Country Status (7)
Country | Link |
---|---|
AT (1) | AT378309B (en) |
DE (1) | DE2748271C3 (en) |
FR (1) | FR2407640A1 (en) |
GB (1) | GB2007029B (en) |
IT (1) | IT1100138B (en) |
SE (1) | SE440018B (en) |
YU (2) | YU247978A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3013667C2 (en) * | 1980-04-09 | 1983-01-20 | Wilhelm Ruf KG, 8000 München | Printed circuit board and process for their manufacture |
EP0196865B1 (en) * | 1985-03-27 | 1990-09-12 | Ibiden Co, Ltd. | Electronic circuit substrates |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5535843B2 (en) * | 1972-12-28 | 1980-09-17 | ||
DE2424747C3 (en) * | 1974-05-21 | 1978-11-02 | Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka (Japan) | Printed circuit |
DE7624175U1 (en) * | 1976-07-31 | 1976-11-25 | Wilhelm Ruf Kg, 8000 Muenchen | keyboard |
-
1977
- 1977-10-27 DE DE2748271A patent/DE2748271C3/en not_active Expired
-
1978
- 1978-10-12 AT AT0734778A patent/AT378309B/en not_active IP Right Cessation
- 1978-10-18 FR FR7829654A patent/FR2407640A1/en active Granted
- 1978-10-18 GB GB7841104A patent/GB2007029B/en not_active Expired
- 1978-10-24 YU YU02479/78A patent/YU247978A/en unknown
- 1978-10-25 IT IT29084/78A patent/IT1100138B/en active
- 1978-10-26 SE SE7811130A patent/SE440018B/en not_active IP Right Cessation
-
1982
- 1982-10-26 YU YU2401/82A patent/YU41275B/en unknown
Also Published As
Publication number | Publication date |
---|---|
SE440018B (en) | 1985-07-08 |
ATA734778A (en) | 1984-11-15 |
DE2748271A1 (en) | 1979-05-03 |
SE7811130L (en) | 1979-04-28 |
IT7829084A0 (en) | 1978-10-25 |
YU247978A (en) | 1983-01-21 |
FR2407640B3 (en) | 1981-06-26 |
DE2748271B2 (en) | 1980-08-07 |
YU41275B (en) | 1986-12-31 |
DE2748271C3 (en) | 1981-07-16 |
YU240182A (en) | 1985-04-30 |
GB2007029B (en) | 1982-09-22 |
AT378309B (en) | 1985-07-25 |
GB2007029A (en) | 1979-05-10 |
IT1100138B (en) | 1985-09-28 |
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