ATA4099A - Vorrichtung zur chemischen behandlung von wafern - Google Patents

Vorrichtung zur chemischen behandlung von wafern

Info

Publication number
ATA4099A
ATA4099A AT0004099A AT4099A ATA4099A AT A4099 A ATA4099 A AT A4099A AT 0004099 A AT0004099 A AT 0004099A AT 4099 A AT4099 A AT 4099A AT A4099 A ATA4099 A AT A4099A
Authority
AT
Austria
Prior art keywords
chemical treating
treating wafers
wafers
chemical
treating
Prior art date
Application number
AT0004099A
Other languages
English (en)
Other versions
AT408930B (de
Original Assignee
Thallner Erich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thallner Erich filed Critical Thallner Erich
Priority to AT0004099A priority Critical patent/AT408930B/de
Priority to US09/481,995 priority patent/US6416579B1/en
Publication of ATA4099A publication Critical patent/ATA4099A/de
Application granted granted Critical
Publication of AT408930B publication Critical patent/AT408930B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0405—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads
    • B05B13/041—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads with spray heads reciprocating along a straight line

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
AT0004099A 1999-01-13 1999-01-13 Vorrichtung zur chemischen behandlung von wafern AT408930B (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AT0004099A AT408930B (de) 1999-01-13 1999-01-13 Vorrichtung zur chemischen behandlung von wafern
US09/481,995 US6416579B1 (en) 1999-01-13 2000-01-11 Apparatus for treating silicon wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0004099A AT408930B (de) 1999-01-13 1999-01-13 Vorrichtung zur chemischen behandlung von wafern

Publications (2)

Publication Number Publication Date
ATA4099A true ATA4099A (de) 2001-08-15
AT408930B AT408930B (de) 2002-04-25

Family

ID=3479938

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0004099A AT408930B (de) 1999-01-13 1999-01-13 Vorrichtung zur chemischen behandlung von wafern

Country Status (2)

Country Link
US (1) US6416579B1 (de)
AT (1) AT408930B (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115007364A (zh) * 2022-06-18 2022-09-06 江苏中伦钢结构有限公司 一种便于移动的大型钢结构用表面喷涂装置
CN117324301A (zh) * 2023-10-30 2024-01-02 河北兴润汽车底盘系统制造有限公司 一种用于汽车底盘铝制零部件清洗装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4018958B2 (ja) * 2001-10-30 2007-12-05 大日本スクリーン製造株式会社 基板処理装置
KR101006800B1 (ko) * 2003-06-06 2011-01-10 도쿄엘렉트론가부시키가이샤 기판의 처리막의 표면 거침을 개선하는 방법 및 기판 처리장치
WO2011034057A1 (ja) * 2009-09-17 2011-03-24 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理装置用ガス供給機構
US9169562B2 (en) 2010-05-25 2015-10-27 Singulus Mocvd Gmbh I. Gr. Parallel batch chemical vapor deposition system
US8986451B2 (en) 2010-05-25 2015-03-24 Singulus Mocvd Gmbh I. Gr. Linear batch chemical vapor deposition system
US9869021B2 (en) 2010-05-25 2018-01-16 Aventa Technologies, Inc. Showerhead apparatus for a linear batch chemical vapor deposition system
US20130137273A1 (en) 2011-11-28 2013-05-30 Infineon Technologies Ag Semiconductor Processing System
WO2014189650A1 (en) * 2013-05-22 2014-11-27 Singulus Technologies Mocvd, Inc. Showerhead apparatus for a linear batch chemical vapor deposition system
CN104091776B (zh) * 2014-07-25 2017-12-08 上海华力微电子有限公司 一种消除连接孔刻蚀副产物凝结缺陷的晶圆净化设备
DE102017109820B4 (de) * 2017-04-26 2024-03-28 VON ARDENNE Asset GmbH & Co. KG Vakuumkammeranordnung und deren Verwendung
CN109339822B (zh) * 2018-11-26 2024-03-29 四川蓝海智能装备制造有限公司 一种混凝土模喷用集成机构

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US4190015A (en) * 1977-12-08 1980-02-26 Machine Technology, Inc. Apparatus for dispensing liquid to spinning workpieces
US4313783A (en) * 1980-05-19 1982-02-02 Branson International Plasma Corporation Computer controlled system for processing semiconductor wafers
US4827867A (en) * 1985-11-28 1989-05-09 Daikin Industries, Ltd. Resist developing apparatus
US4807561A (en) * 1986-05-19 1989-02-28 Toshiba Machine Co., Ltd. Semiconductor vapor phase growth apparatus
JPS6357779A (ja) * 1986-08-26 1988-03-12 Canon Inc マイクロ波プラズマｃｖｄ法による機能性堆積膜形成装置
AT389959B (de) 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
JPH0628223Y2 (ja) * 1989-06-14 1994-08-03 大日本スクリーン製造株式会社 回転塗布装置
JP2843134B2 (ja) * 1990-09-07 1999-01-06 東京エレクトロン株式会社 塗布装置および塗布方法
JP2633106B2 (ja) * 1991-05-24 1997-07-23 シャープ株式会社 レジスト塗布装置
JPH0734890B2 (ja) * 1991-10-29 1995-04-19 インターナショナル・ビジネス・マシーンズ・コーポレイション スピン・コーティング方法
US5489337A (en) * 1993-01-28 1996-02-06 Kabushiki Kaisha Toshiba Apparatus for applying organic material to semiconductor wafer in which the nozzle opening adjusts in response to data
AT639U1 (de) 1993-02-08 1996-02-26 Sez Semiconduct Equip Zubehoer Träger nach dem bernoulli-prinzip für scheibenförmige gegenstände, insbesondere siliziumscheiben
TW285779B (de) * 1994-08-08 1996-09-11 Tokyo Electron Co Ltd
JPH08274014A (ja) * 1995-03-29 1996-10-18 Tokyo Ohka Kogyo Co Ltd 塗布ノズル、この塗布ノズルを用いた塗布方法及びこの塗布ノズルを組み込んだ塗布装置
JPH0925579A (ja) * 1995-07-10 1997-01-28 Canon Inc 堆積膜形成装置
JP3516195B2 (ja) * 1996-05-28 2004-04-05 東京エレクトロン株式会社 塗布膜形成方法及びその装置
JPH09327671A (ja) * 1996-06-12 1997-12-22 Kaijo Corp 超音波洗浄機
JP3209403B2 (ja) * 1996-12-24 2001-09-17 株式会社東京精密 ウェーハ洗浄装置
JP3578577B2 (ja) * 1997-01-28 2004-10-20 大日本スクリーン製造株式会社 処理液供給方法及びその装置
JPH10256131A (ja) * 1997-03-13 1998-09-25 Sony Corp 半導体装置の製造装置及びその製造方法
JPH10335230A (ja) * 1997-06-04 1998-12-18 Sony Corp 現像液供給ノズル
US6190063B1 (en) * 1998-01-09 2001-02-20 Tokyo Electron Ltd. Developing method and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115007364A (zh) * 2022-06-18 2022-09-06 江苏中伦钢结构有限公司 一种便于移动的大型钢结构用表面喷涂装置
CN117324301A (zh) * 2023-10-30 2024-01-02 河北兴润汽车底盘系统制造有限公司 一种用于汽车底盘铝制零部件清洗装置

Also Published As

Publication number Publication date
AT408930B (de) 2002-04-25
US6416579B1 (en) 2002-07-09

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Legal Events

Date Code Title Description
MK07 Expiry

Effective date: 20190113