AT320372B - Verfahren zur stromfreien Kupferplattierung und Kupferplattierungsbad - Google Patents
Verfahren zur stromfreien Kupferplattierung und KupferplattierungsbadInfo
- Publication number
- AT320372B AT320372B AT13573A AT13573A AT320372B AT 320372 B AT320372 B AT 320372B AT 13573 A AT13573 A AT 13573A AT 13573 A AT13573 A AT 13573A AT 320372 B AT320372 B AT 320372B
- Authority
- AT
- Austria
- Prior art keywords
- copper plating
- electroless
- plating bath
- plating method
- bath
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US21845972A | 1972-01-17 | 1972-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AT320372B true AT320372B (de) | 1975-02-10 |
Family
ID=22815208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT13573A AT320372B (de) | 1972-01-17 | 1973-01-08 | Verfahren zur stromfreien Kupferplattierung und Kupferplattierungsbad |
Country Status (23)
| Country | Link |
|---|---|
| US (1) | US3790392A (ja) |
| JP (1) | JPS5519983B2 (ja) |
| AT (1) | AT320372B (ja) |
| AU (1) | AU464729B2 (ja) |
| BE (1) | BE794048A (ja) |
| CH (1) | CH599981A5 (ja) |
| DD (1) | DD107490A5 (ja) |
| DE (1) | DE2300748C3 (ja) |
| DK (1) | DK143948C (ja) |
| ES (1) | ES410652A1 (ja) |
| FI (1) | FI54500C (ja) |
| FR (1) | FR2168364B1 (ja) |
| GB (1) | GB1414896A (ja) |
| HK (1) | HK65076A (ja) |
| IL (1) | IL41331A (ja) |
| IT (1) | IT980460B (ja) |
| LU (1) | LU66834A1 (ja) |
| NL (1) | NL177330C (ja) |
| NO (1) | NO135188C (ja) |
| PL (1) | PL94000B1 (ja) |
| RO (1) | RO69172A (ja) |
| SE (1) | SE387664B (ja) |
| ZA (1) | ZA73328B (ja) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL164906C (nl) * | 1975-08-19 | 1981-02-16 | Philips Nv | Werkwijze voor de bereiding van een waterig alkalische verkoperbad. |
| JPS60159328U (ja) * | 1984-03-31 | 1985-10-23 | 株式会社 高津製作所 | ドレン警報器付油量計 |
| US4666858A (en) * | 1984-10-22 | 1987-05-19 | International Business Machines Corporation | Determination of amount of anionic material in a liquid sample |
| US5626736A (en) | 1996-01-19 | 1997-05-06 | Shipley Company, L.L.C. | Electroplating process |
| EP2639335B1 (en) * | 2012-03-14 | 2015-09-16 | Atotech Deutschland GmbH | Alkaline plating bath for electroless deposition of cobalt alloys |
| CN103225092A (zh) * | 2013-05-22 | 2013-07-31 | 南通鑫平制衣有限公司 | 一种塑料镀铜 |
| JP6176841B2 (ja) * | 2013-07-19 | 2017-08-09 | ローム・アンド・ハース電子材料株式会社 | 無電解銅めっき液 |
| US10060034B2 (en) | 2017-01-23 | 2018-08-28 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions |
| US10294569B2 (en) | 2017-10-06 | 2019-05-21 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
| US10655227B2 (en) | 2017-10-06 | 2020-05-19 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1192021B (de) * | 1963-01-12 | 1965-04-29 | Dehydag Gmbh | Galvanische Baeder |
| US3457089A (en) * | 1967-04-07 | 1969-07-22 | Shipley Co | Electroless copperplating |
| US3635758A (en) * | 1969-08-04 | 1972-01-18 | Photocircuits Corp | Electroless metal deposition |
-
0
- BE BE794048D patent/BE794048A/xx not_active IP Right Cessation
-
1972
- 1972-01-17 US US00218459A patent/US3790392A/en not_active Expired - Lifetime
-
1973
- 1973-01-05 AU AU50768/73A patent/AU464729B2/en not_active Expired
- 1973-01-08 DE DE2300748A patent/DE2300748C3/de not_active Expired
- 1973-01-08 AT AT13573A patent/AT320372B/de not_active IP Right Cessation
- 1973-01-11 NO NO123/73A patent/NO135188C/no unknown
- 1973-01-12 SE SE7300440A patent/SE387664B/xx unknown
- 1973-01-15 FR FR7301315A patent/FR2168364B1/fr not_active Expired
- 1973-01-15 CH CH52373A patent/CH599981A5/xx not_active IP Right Cessation
- 1973-01-15 GB GB207373A patent/GB1414896A/en not_active Expired
- 1973-01-15 LU LU66834A patent/LU66834A1/xx unknown
- 1973-01-16 DD DD168260A patent/DD107490A5/xx unknown
- 1973-01-16 NL NLAANVRAGE7300599,A patent/NL177330C/xx not_active IP Right Cessation
- 1973-01-16 FI FI117/73A patent/FI54500C/fi active
- 1973-01-16 ZA ZA730328A patent/ZA73328B/xx unknown
- 1973-01-16 ES ES410652A patent/ES410652A1/es not_active Expired
- 1973-01-16 DK DK23573A patent/DK143948C/da not_active IP Right Cessation
- 1973-01-16 IT IT67057/73A patent/IT980460B/it active
- 1973-01-17 JP JP774073A patent/JPS5519983B2/ja not_active Expired
- 1973-01-17 PL PL1973160307A patent/PL94000B1/pl unknown
- 1973-01-17 RO RO7373524A patent/RO69172A/ro unknown
- 1973-01-17 IL IL41331A patent/IL41331A/xx unknown
-
1976
- 1976-10-14 HK HK650/76*UA patent/HK65076A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NL177330C (nl) | 1985-09-02 |
| NO135188B (ja) | 1976-11-15 |
| NO135188C (ja) | 1977-02-23 |
| IL41331A0 (en) | 1973-03-30 |
| AU464729B2 (en) | 1975-09-04 |
| IL41331A (en) | 1975-11-25 |
| SE387664B (sv) | 1976-09-13 |
| HK65076A (en) | 1976-10-22 |
| DE2300748A1 (de) | 1973-07-26 |
| FR2168364B1 (ja) | 1975-03-28 |
| FI54500C (fi) | 1978-12-11 |
| LU66834A1 (ja) | 1973-03-19 |
| ES410652A1 (es) | 1976-01-01 |
| DE2300748B2 (de) | 1975-03-13 |
| JPS5519983B2 (ja) | 1980-05-30 |
| IT980460B (it) | 1974-09-30 |
| PL94000B1 (ja) | 1977-07-30 |
| FI54500B (fi) | 1978-08-31 |
| AU5076873A (en) | 1974-07-11 |
| US3790392A (en) | 1974-02-05 |
| NL7300599A (ja) | 1973-07-19 |
| DE2300748C3 (de) | 1975-10-30 |
| DK143948C (da) | 1982-04-19 |
| JPS4999934A (ja) | 1974-09-20 |
| DD107490A5 (ja) | 1974-08-05 |
| ZA73328B (en) | 1973-10-31 |
| BE794048A (fr) | 1973-07-16 |
| DK143948B (da) | 1981-11-02 |
| NL177330B (nl) | 1985-04-01 |
| RO69172A (ro) | 1980-01-15 |
| GB1414896A (en) | 1975-11-19 |
| FR2168364A1 (ja) | 1973-08-31 |
| CH599981A5 (ja) | 1978-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AT311145B (de) | Alkalisches wässeriges stromloses Verkupferungsbad und Verfahren zur stromlosen Verkupferung | |
| AT301978B (de) | Verfahren und Bad zum Beschichten metallischer Gegenstände | |
| CH537462A (de) | Verfahren zur elektrolytischen Abscheidung von Kupfer | |
| JPS5281032A (en) | Tinngold electroplating bath and plating method | |
| AT320372B (de) | Verfahren zur stromfreien Kupferplattierung und Kupferplattierungsbad | |
| IT1024416B (it) | Soluzioni di placcatura con oro metodo per applicareed oggetti placcati ottenuti | |
| AT313017B (de) | Bad zur stromlosen Metallabscheidung | |
| AT288108B (de) | Verfahren und Vorrichtung zur elektrolytischen Oberflächenbehandlung | |
| ZA731439B (en) | Electroless copper plating solution and process | |
| AT340457B (de) | Verfahren zur behandlung von metallschmelzen | |
| CH537460A (de) | Verfahren und Vorrichtung zum kontinuierlichen selektiven Galvanisieren von Bändern | |
| AT331606B (de) | Verfahren und vorrichtung zum elektroplattieren | |
| CH514683A (de) | Verfahren und Bad zum elektrolytischen Vernickeln | |
| JPS5253735A (en) | Silver plating method and silver plating bath | |
| AT324065B (de) | Bad zur autokatalytischen stromlosen abscheidung von kupper | |
| AT334858B (de) | Verfahren und anlage zum behandeln von kupferstrangguss | |
| IT987942B (it) | Metodo di placcatura elettrolitica | |
| AT315790B (de) | Verfahren zur Drahtbehandlung | |
| CH516648A (de) | Verfahren zum chemischen Vernickeln und Bad zur Durchführung des Verfahrens | |
| AT304219B (de) | Bad zur stromlosen Abscheidung von Metallen | |
| AT313663B (de) | Cyanidische,thalliumhaeltige gold-elektroplattierloesung und verfahren zur elektrolytischen goldabscheidung | |
| ZA708430B (en) | Electrodeposition of copper from acidic baths | |
| BR7605351A (pt) | Banho de revestimento de cobre sem eletrolise | |
| CH498939A (fr) | Procédé et installation de nickelage électrolytique | |
| AT325914B (de) | Verfahren zur stromlosen vernickelung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ELA | Expired due to lapse of time |