IT1024416B - Soluzioni di placcatura con oro metodo per applicareed oggetti placcati ottenuti - Google Patents

Soluzioni di placcatura con oro metodo per applicareed oggetti placcati ottenuti

Info

Publication number
IT1024416B
IT1024416B IT54490/74A IT5449074A IT1024416B IT 1024416 B IT1024416 B IT 1024416B IT 54490/74 A IT54490/74 A IT 54490/74A IT 5449074 A IT5449074 A IT 5449074A IT 1024416 B IT1024416 B IT 1024416B
Authority
IT
Italy
Prior art keywords
applying
gold plating
plating solutions
obtained plated
plated objects
Prior art date
Application number
IT54490/74A
Other languages
English (en)
Original Assignee
Engelhard Min & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Min & Chem filed Critical Engelhard Min & Chem
Application granted granted Critical
Publication of IT1024416B publication Critical patent/IT1024416B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
IT54490/74A 1973-12-13 1974-12-11 Soluzioni di placcatura con oro metodo per applicareed oggetti placcati ottenuti IT1024416B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US424474A US3902977A (en) 1973-12-13 1973-12-13 Gold plating solutions and method

Publications (1)

Publication Number Publication Date
IT1024416B true IT1024416B (it) 1978-06-20

Family

ID=23682749

Family Applications (1)

Application Number Title Priority Date Filing Date
IT54490/74A IT1024416B (it) 1973-12-13 1974-12-11 Soluzioni di placcatura con oro metodo per applicareed oggetti placcati ottenuti

Country Status (8)

Country Link
US (1) US3902977A (it)
JP (1) JPS5092833A (it)
CA (1) CA1048964A (it)
CH (1) CH606503A5 (it)
DE (1) DE2458913A1 (it)
FR (1) FR2254658B1 (it)
GB (1) GB1453386A (it)
IT (1) IT1024416B (it)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4207149A (en) * 1974-12-04 1980-06-10 Engelhard Minerals & Chemicals Corporation Gold electroplating solutions and processes
US4396471A (en) * 1981-12-14 1983-08-02 American Chemical & Refining Company, Inc. Gold plating bath and method using maleic anhydride polymer chelate
US4486275A (en) * 1983-02-07 1984-12-04 Heinz Emmenegger Solution for electroplating a gold-copper-cadmium alloy
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys
CH665656A5 (fr) * 1983-12-29 1988-05-31 Heinz Emmenegger Bain d'or acide et utilisation de ce bain en electroplastie.
US5942350A (en) * 1997-03-10 1999-08-24 United Technologies Corporation Graded metal hardware component for an electrochemical cell
US6828898B2 (en) * 2003-04-03 2004-12-07 Cts Corporation Fuel tank resistor card having improved corrosion resistance
US20090104463A1 (en) 2006-06-02 2009-04-23 Rohm And Haas Electronic Materials Llc Gold alloy electrolytes
SG127854A1 (en) * 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes
JP4945193B2 (ja) 2006-08-21 2012-06-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 硬質金合金めっき液
KR100848689B1 (ko) * 2006-11-01 2008-07-28 고려대학교 산학협력단 다층 나노선 및 이의 형성방법
WO2008102580A1 (ja) * 2007-02-23 2008-08-28 Japan Pure Chemical Co., Ltd. 電解金めっき液及びそれを用いて得られた金皮膜
CH710184B1 (fr) * 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.
WO2012001132A1 (de) * 2010-06-30 2012-01-05 Schauenburg Ruhrkunststoff Gmbh Tribologisch belastbare edelmetall/metallschichten
EP2588645B1 (de) 2010-06-30 2018-05-30 RDM Family Investments LLC Verfahren zur abscheidung einer nickel-metall-schicht
US20160145756A1 (en) * 2014-11-21 2016-05-26 Rohm And Haas Electronic Materials Llc Environmentally friendly gold electroplating compositions and methods

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH286123A (fr) * 1952-05-08 1952-10-15 Spreter Victor Bain pour le dépôt par voie galvanique d'alliages d'or.
NL273924A (it) * 1961-01-24
US3149057A (en) * 1959-04-27 1964-09-15 Technic Acid gold plating
US3149058A (en) * 1959-12-31 1964-09-15 Technic Bright gold plating process
US3666640A (en) * 1971-04-23 1972-05-30 Sel Rex Corp Gold plating bath and process
US3783111A (en) * 1972-09-11 1974-01-01 Auric Corp Gold plating bath for barrel plating operations

Also Published As

Publication number Publication date
CH606503A5 (it) 1978-10-31
FR2254658A1 (it) 1975-07-11
JPS5092833A (it) 1975-07-24
DE2458913A1 (de) 1975-06-26
FR2254658B1 (it) 1979-06-15
CA1048964A (en) 1979-02-20
GB1453386A (en) 1976-10-20
US3902977A (en) 1975-09-02
AU7622274A (en) 1976-06-10

Similar Documents

Publication Publication Date Title
IT1024416B (it) Soluzioni di placcatura con oro metodo per applicareed oggetti placcati ottenuti
IT994135B (it) Bagno al solfito per l elettrodero sizione di oro e procedimento di elettrodeposizione
AU497419B2 (en) Cyanide-free silver plating bath
CA978136A (en) Gold electroplating
ZA731439B (en) Electroless copper plating solution and process
CA921424A (en) Method for electroplating gold
CA949493A (en) Continuous plating method
CA1032108A (en) Sulfite gold plating bath and process
IT987942B (it) Metodo di placcatura elettrolitica
IT995955B (it) Perfezionato metodo di rivestimento con lega
SE387664B (sv) Sett och bad for att genomfora stromlos kopparpletering
CH614240A5 (en) Bath for the electrodeposition of gold
CA929481A (en) Electrolytic gold plating solutions and methods for using same
AT324794B (de) Galvanische abscheidung von goldlegierungen
JPS5224129A (en) Nonnelectrolytic gold plating method
IT1000615B (it) Procedimento di placcatura elettro litica con oro dolce
IT980874B (it) Procedimento e soluzione per la deposizione elettrolitica di leghe d oro brillanti
AU2328870A (en) Process of a1 plating
CA947695A (en) Gold plating bath and process
CA911105A (en) Electroless gold plating baths
AU487606B2 (en) Gold plating solutions and method
AU477446B2 (en) Copper plating bath and process
ZA707176B (en) Gold plating process
ZA737671B (en) Electroplating of gold
CA805140A (en) Non-cyanide silver plating bath